TEC1-12705-SF22 Thermo-Peltier Module Thermoelectric Peltier module element, 40.0 x 40.0 x 4,2 mm with a silicone perimeter seal. TEC1-12705 Specifications and Operational Parameters Size 40x40x4.0mm Imax 5.3A Umax 15.4V Qmax (ΔT =0) 57 W ΔT max. 68°C12Vdc Imax 5A ΔTmax 61°C

Welcome to your new project. Imagine what you can build here.

Welcome to your new project. Imagine what you can build here.

ESP32-S3-Wroom (Passive-Module) This is just a module of the ESP32 for integrating with other systems. This essentially turns the ESP chip into a 39pin module for easy soldering and dev/prototyping.. Again this Module has no active components, the reason for this its to be added to an existing system. Tis also makes it easier to prototype on bread board.

ESP32 /eMMC Integration with Bidirectional Level Shifting Project Overview: This project aims to integrate an ESP32 microcontroller with an eMMC (embedded Multi Media Card) storage module to create a robust data processing and storage solution. The system utilizes bidirectional level shifting to ensure seamless communication between the 3.3V logic of the ESP32 and the 1.8V logic of the eMMC, enabling efficient data handling and processing. Objectives: Data Storage and Processing: Leverage the high-speed capabilities of the eMMC for data storage while offloading processing tasks from the ESP32 to enhance overall system performance. Voltage Level Compatibility: Implement a bidirectional level shifting solution to facilitate communication between the ESP32 and eMMC, ensuring signal integrity and compatibility across different voltage levels. Modular Design: Create a modular and scalable design that can be easily adapted for various applications, including IoT devices, data logging systems, and embedded applications. Key Components: ESP32 Microcontroller: A powerful microcontroller with integrated Wi-Fi and Bluetooth capabilities, ideal for IoT applications. eMMC Storage Module: A high-speed storage solution that provides ample memory for data-intensive applications. Bidirectional Level Shifter: A 20-channel level shifter (74LVC4245 and TXB0104D) to convert signals between 1.8V and 3.3V, ensuring reliable communication between the ESP32 and eMMC. Power Management: Utilize a MIC5205 LDO voltage regulator to step down the 3.3V supply to 1.8V for the eMMC, ensuring stable power delivery. Implementation Steps: Circuit Design: Design the circuit schematic, including connections for the ESP32, eMMC, level shifter, and power management components. PCB Layout: Create a PCB layout that optimizes trace lengths for high-speed signals, ensuring proper length matching and minimizing noise. Firmware Development: Develop firmware for the ESP32 to handle data reading, writing, and processing tasks, as well as managing communication with the eMMC. Testing and Validation: Conduct thorough testing to validate the functionality of the system, ensuring reliable data transfer and processing capabilities. Expected Outcomes: A fully functional system that demonstrates the integration of the ESP32 with eMMC storage, showcasing efficient data handling and processing. A modular design that can be adapted for various applications, providing a foundation for future projects in IoT and embedded systems.