3D Camera Module is a scalable SPI enabled 4 camera array pinout for 3D photogrammetry reconstruction which uses I2C to connect between each module to expand camera capacity while keeping capture sequences in sync. It uses ATMega32U4 with its built in USB 2.0 for data transfer and camera array adjustments and capture as well as a micro SD card slot for local image storage. An interrupt logic pinout should be used on the SPI master module as capture command. Each module is powered via USB-C (5V) or barrel jack (12V regulated to 5V).

This is a USB type C female header to 6 pin pinout for SPI protocol. Do not use this for USB protocol. This is meant to be used with Scale Snap 3D to reduce RF noise across (max) 1 meter distance.

12V to fixed 5V 2A Non-Synchronous Step-Down Regulator. The TPS5405 is a monolithic non-synchronous buck regulator with wide operating input voltage range from 6.5 V to 28 V. Current mode control with internal slope compensation is implemented to reduce component count. TPS5405 also features a light load pulse skipping mode, which allows for a power loss reduction from the input power supply to the system at light loading. The switching frequency of the converters can be set from 50 kHz to 1.1 MHz with an external resistor. Frequency spread spectrum operation is introduced for EMI reduction. LX anti-ringing is added to address high frequency EMI issues. A cycle-by-cycle current limit with frequency fold back protects the IC at over loading condition.

Use this template if you're planning to get your board manufactured in OSHPARK. It has the via min/max and trace width constraints already baked as global rules. #project-template #template #manufacturer-design-rules OSHpark 4-layer stackup specs: Top overlay or silkscreen: 1 mil thick Top solder mask or solder resist: 1 mil thick Top copper: 1.7 mil thick on 1 oz copper Dielectric: 7.96 mil thick FR408HG 2113 Mid layer 1: 0.68 mil thick on 0.5 oz copper Dielectric core: 39 mil thick FR408HR Mid layer 2: 0.68 mil thick on 0.5 oz copper Dielectric: 7.96 mil thick FR408HG 2113 Bottom copper: 1.7 mil thick on 1 oz copper Bottom solder mask or solder resist: 1 mil thick
Bottom overlay or silkscreen: 1 mil thick