Remote Receiver Sensor 38.0kHz 45m Through Hole This IR receiver series is optimized for long burst remote control systems in different environments. The customer can chose between different IC settings (AGC variants), to find the optimum solution for his application. The higher the AGC, the better noise is suppressed, but the lower the code compatibility. The devices contain a PIN diode and a preamplifier assembled on a lead frame. The epoxy package contains an IR filter. The demodulated output signal can be directly connected to a microprocessor for decoding. These components have not been qualified to automotive specifications. Individual IC settings to reach maximum performance • Immunity against noise (lamps, LCD TV, Wi-Fi) • Low supply current • Photo detector and preamplifier in one package • Supply voltage: 2.0 V to 5.5 V VS1838B #CommonPartsLibrary #Sensor #Transducer #Optical-Sensor #Photo-Detectors #Remote-Receiver #TSOP38238

The ESP32-DEVKITC-VE evaluation kit from Espressif Systems is a high-performance development platform for RF, RFID, and wireless applications. It features the ESP32-WROVER-E with embedded Xtensa dual-core 32-bit LX6 microprocessor running up to 240 MHz, with 8MB Flash and 8MB PSRAM for efficient data processing. This board supports Wi-Fi 802.11 b/g/n and Bluetooth® Smart Ready 4.x (BLE) connectivity at 2.4GHz, offering wireless communication options. With 448KB ROM, 520KB SRAM, and 16KB SRAM in RTC, it provides ample memory for complex applications. It includes up to 24 GPIOs, SD card, UART, SPI, SDIO, I2C, LED and motor PWM, I2S, IR, pulse counter, capacitive touch sensor, ADC, DAC, and TWAI® (compatible with ISO 11898-1/CAN 2.0) #commonpartslibrary #ESP32-WROVER-E #evaluationboard

MPU 8-Bit 14MHz 65KB Memory 40 Pin PDIP #commonpartslibrary #integratedcircuit #microprocessor

Voltage Level Translator Unidirectional 1 Circuit 2 Channel 200Mbps 8-X1SON (1.95x1) The TXU0202DTTR specification defines the engineering requirements for a dual-bit voltage level translator integrated circuit designed for bidirectional logic-level conversion between digital interfaces operating at different supply voltages. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure reliable signal translation, high-speed communication, and long-term operational stability in embedded electronic systems. The device is intended for use in embedded controllers, microprocessor and microcontroller systems, communication interfaces, industrial automation equipment, consumer electronics, and portable devices requiring voltage compatibility between digital subsystems. It enables seamless signal transfer while preserving logic integrity, minimizing propagation delay, and supporting low-power operation in compact electronic designs. Engineering Requirements The voltage level translator shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure consistent electrical performance, low power consumption, and dependable long-term reliability. The device shall maintain stable operation under specified voltage, temperature, and environmental operating conditions. Electrical characteristics shall provide accurate bidirectional logic-level translation with low propagation delay, high noise immunity, and reliable input and output switching performance. The device shall maintain signal integrity during continuous operation, power sequencing, and dynamic switching conditions without introducing excessive distortion or timing errors. The integrated translation architecture shall support independent voltage domains while ensuring reliable communication between connected digital devices. The device shall maintain stable performance across varying supply voltages and logic frequencies while minimizing leakage current and preserving overall system efficiency. Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical integrity and long-term reliability. The package shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. Mechanical construction shall withstand thermal cycling, vibration, mechanical handling, and environmental exposure without degradation of electrical or mechanical performance. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, or structural inconsistencies that could adversely affect functionality or reliability. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical performance specifications, timing diagrams, application guidelines, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #VoltageLevelTranslator #LogicLevelShifter #DigitalInterface #EmbeddedSystems #Semiconductor #SignalIntegrity #IndustrialElectronics #QualityAssurance #EngineeringDocumentation

Bluetooth, WiFi 802.11b/g/n, Bluetooth v4.2 + EDR, Class 1, 2 and 3 Transceiver Module 2.4GHz PCB Trace Surface Mount Wi-Fi + Bluetooth module designed for wireless connectivity in embedded applications, integrating the ESP32 dual-core 32-bit LX6 microprocessor with 2.4 GHz Wi-Fi (802.11 b/g/n) and Bluetooth v4.2 BR/EDR + BLE. It operates from a 3.0 V to 3.6 V supply, features 8 MB SPI flash and 2 MB PSRAM, and provides multiple peripheral interfaces including UART, SPI, I²C, I²S, SD/SDIO, PWM, ADC, DAC, CAN (TWAI®), and Ethernet MAC. #WiFiModule #BluetoothModule #ESP32 #Espressif #2_4GHz #BluetoothLE #BluetoothBR_EDR #DualCore #Embedded #IoT #SPIFlash #PSRAM #UART #SPI #I2C #I2S #SDIO #PWM #ADC #DAC #TWAI #EthernetMAC