Custom Ambient Light Sensor Module with LGA Footprint

RF Switch ICs Green 29 lead 4x4 LGA #CommonPartsLibrary #IntegratedCircuit #RF

Intelli-PhaseTM Solution (Integrated HS-FET/LS-FET and Driver) in LGA and TLGA (5mmx6mm) Packages #ultralibrarian

Intelli-PhaseTM Solution (Integrated HS-FET/LS-FET and Driver) in LGA and TLGA (5mmx6mm) Packages #ultralibrarian

Intelli-PhaseTM Solution (Integrated HS/LS-FETs and Driver) in 5mmx6mm LGA #ultralibrarian

SOCKET ASSY LGA1151, 0.38AU CONN SOCKET LGA 1151POS GOLD 1151 Pos LGA Socket Gold Surface Mount

4V to 16V Input Quad 3A 3A 2A 2A Output Power Module with I2C and MTP in Ultra-Thin LGA Package #ultralibrarian

4V to 16V Input Quad 3A 3A 2A 2A Output Power Module with I2C and MTP in Ultra-Thin LGA Package #ultralibrarian

SM261S4030H0R is an omnidirectional, Top‐ported, I 2 S digital output MEMS microphone. It has high performance and reliability.    MSM261S4030H0R is available in a 4 mm × 3 mm × 1.0 mm metal can LGA package. It is SMT compatible with no sensitivity degradation Cost effective Low Power mode Digital I2S output Compatible with Sn/Pb and Pb‐free solder processes RoHS/Halogen free compliant Sensitivity Matching within +/‐1dB #CommonPartsLibrary #MEMS #Microphone #Vibration-motor

Quectel LG290P (03) high-precision quad-band GNSS module, supports GPS/GLONASS/Galileo/BDS/QZSS/NavIC constellations, simultaneous L1/L2/L5/E6 reception, SBAS support, quad-band RTK positioning with fast convergence, integrated interference detection and mitigation, protection-level integrity functions, Secure Boot support, UART and I2C interfaces, low power consumption, compact 12.2 x 16.0 x 2.6mm LGA package. lg290

Cellular, Navigation BeiDou, EGDE, Galileo, GLONASS, GPS, GNSS, GSM, LTE Transceiver Module 850MHz, 900MHz, 1.8GHz, 1.9GHz Antenna Not Included Surface Mount The BG95M3LA-64-SGNS is a compact low-power LTE cellular communication module designed for IoT, telematics, asset tracking, industrial automation, and embedded wireless applications. The module supports global LTE Cat M1, Cat NB2, and EGPRS connectivity, enabling reliable wide-area wireless communication for battery-powered and mobile embedded systems. The device integrates cellular modem functionality, GNSS positioning capability, power management features, and multiple peripheral communication interfaces within a highly compact surface-mount package optimized for space-constrained embedded designs. The module is engineered for low-power operation, making it suitable for long-life IoT deployments requiring efficient wireless connectivity. The BG95M3LA-64-SGNS supports integrated satellite positioning technologies including GPS, GLONASS, Galileo, and BeiDou for location-aware applications. Its robust RF performance and industrial-grade operating capability allow deployment in harsh environmental conditions and demanding remote monitoring systems. The module provides comprehensive support for embedded communication protocols and is commonly used in smart meters, telematics units, industrial gateways, environmental monitoring systems, fleet tracking devices, and connected sensor platforms. Key Features LTE Cat M1 cellular communication support LTE Cat NB2 narrowband IoT capability EGPRS fallback connectivity Integrated GNSS positioning functionality Low-power optimized architecture Global wireless network compatibility Compact surface-mount module design Embedded TCP/IP protocol stack support UART, USB, and serial communication interfaces Integrated power management subsystem Industrial operating temperature support Embedded IoT connectivity optimization High-reliability wireless communication platform Multi-constellation satellite navigation support Electrical Characteristics Low operating power consumption Wide input voltage support High RF sensitivity performance Embedded low-power sleep functionality Stable wireless communication architecture Integrated RF and baseband processing Optimized antenna interface support Industrial-grade reliability performance Fast network registration capability Applications IoT and M2M communication systems Asset tracking devices Fleet management platforms Smart utility metering Industrial automation equipment Remote environmental monitoring Smart agriculture systems Telematics and transportation electronics Portable wireless data terminals Embedded gateway systems Smart city infrastructure Connected sensor platforms Package Information Package Type: LGA Module Mounting Type: Surface Mount Compact embedded wireless module package RoHS compliant configuration available #commonpartslibrary #wirelessmodule #lte #iot #embeddedhardware #cellularcommunication #gnss #telematics #industrialautomation #assettracking

Attitude Sensors LSM6DSO32TR LGA-14_L3.0-W2.5-P0.50-TL LCSC Part Number: C1864162 JLCPCB Part Class: Extended Part Manufactured by ST(意法半导体)STMicroelectronics LSM6DSO32 iNEMO 6-axis inertial measurement unit, integrated always-on 3D digital accelerometer and 3D digital gyroscope, accelerometer full-scale ranges ±4/±8/±16/±32g, gyroscope full-scale ranges ±125/±250/±500/±1000/±2000dps, low power consumption, 1.71V to 3.6V supply voltage, SPI/I2C/MIPI I3C interface, smart FIFO up to 9kbytes, embedded pedometer, step detector, tilt detection and motion functions, embedded temperature sensor, -40°C to +85°C operating range, compact 14-lead LGA 2.5 x 3.0 x 0.83mm package. Search Keywords: LSM6DSO32, ST LSM6DSO32, STMicroelectronics LSM6DSO32, LSM6DSO32TR, iNEMO inertial module, 6-axis IMU, 3D accelerometer gyroscope, 32g accelerometer, 2000dps gyroscope, LSM6DSO32 IMU sensor, LSM6DSO32 accelerometer, LSM6DSO32 gyroscope, SPI I2C I3C IMU, LGA-14 IMU, 2.5x3mm IMU, LSM6DSO32 datasheet Hashtags: #LSM6DSO32 #LSM6DSO32TR #STMicroelectronics #STIMU #iNEMO #IMUSensor #6AxisIMU #Accelerometer #Gyroscope #3DAccelerometer #3DGyroscope #32gAccelerometer #2000dpsGyroscope #I2CSensor #SPISensor #I3CSensor #LGA14 #MotionSensor

Accelerometer X, Y, Z Axis ±2g, 4g, 8g 6.25Hz ~ 200Hz 12-LGA (2.2x2.3) The ADXL367BCCZ-RL7 is an ultra-low power, three-axis MEMS accelerometer developed by Analog Devices for motion sensing applications requiring extremely low energy consumption and high measurement stability. The device integrates precision acceleration sensing, embedded motion detection capabilities, and intelligent power management features within a compact surface-mount package suitable for portable and battery-operated systems. The accelerometer supports both I²C and SPI digital communication interfaces, enabling flexible integration with embedded processors, microcontrollers, and sensor hubs. Its architecture is optimized for continuous motion monitoring while maintaining exceptionally low current consumption, making it ideal for wearable electronics, asset tracking devices, medical monitoring equipment, industrial sensing systems, and Internet of Things platforms. The device incorporates embedded activity, inactivity, and wake-up detection functions that allow host processors to remain in low-power states until significant motion events occur. Integrated FIFO buffering and programmable interrupt functionality reduce processor overhead and improve overall system efficiency. The ADXL367BCCZ-RL7 is designed for robust operation across a wide operating temperature range and maintains high measurement accuracy with low noise and excellent long-term stability. The compact LGA package enables dense PCB layouts for space-constrained designs. Key Features Motion Sensing Three-axis digital accelerometer Selectable acceleration measurement ranges High-resolution motion detection Low noise sensing architecture Integrated temperature sensor Power Management Ultra-low power operation optimized for battery-powered systems Multiple operating and standby modes Autonomous motion-triggered wake-up capability Efficient duty-cycling support Digital Interfaces Supports SPI communication Supports I²C communication Programmable interrupt outputs Embedded FIFO data buffering Embedded Detection Functions Activity detection Inactivity detection Motion-triggered interrupt generation Autonomous wake-up monitoring Mechanical and Environmental Compact LGA surface-mount package High shock tolerance Wide operating temperature capability Suitable for portable and industrial environments Electrical Characteristics Supply Requirements Low-voltage digital supply operation Optimized for low-current embedded systems Stable operation across supported voltage range Sensor Performance High sensitivity stability Low offset drift Low output noise density Configurable output data rates Communication and Control Supported Interfaces SPI serial interface I²C serial interface Programmability Configurable measurement ranges Adjustable output data rates Programmable interrupt mapping FIFO configuration support Package Information Package Type LGA surface-mount package Mounting PCB surface mount compatible Suitable for automated assembly processes Typical Applications Wearable electronics Health and fitness monitoring Portable instrumentation Asset and condition monitoring Industrial sensing systems IoT sensor nodes Motion-activated devices Battery-powered embedded systems #commonpartslibrary #integratedcircuit #accelerometer #sensor

SLC NAND Flash Parallel/Serial 3.3V 256G-bit 32G x 8 100-Pin LBGA FLASH - NAND (SLC) Memory IC 256Gbit Parallel 100 MHz 100-LBGA (12x18) The MT29F256G08AUCABH3-10ITZ:A is a high-density 256Gb Single-Level Cell (SLC) NAND Flash memory device from Micron Technology. It provides non-volatile data storage with high reliability, fast read/write performance, and long endurance, making it suitable for industrial, networking, embedded computing, automotive, and data-logging applications. The device supports both asynchronous and synchronous interfaces and complies with the Open NAND Flash Interface (ONFI) standard for enhanced interoperability and performance. It is housed in a compact 100-ball LBGA package (12 mm × 18 mm). • Open NAND Flash Interface (ONFI) 2.2-compliant1 • Single-level cell (SLC) technology • Organization – Page size x8: 8640 bytes (8192 + 448 bytes) – Block size: 128 pages (1024K + 56K bytes) – Plane size: 2 planes x 2048 blocks per plane – Device size: 32Gb: 4096 blocks; 64Gb: 8192 blocks; 128Gb: 16,384 blocks; 256Gb: 32,768 blocks • Synchronous I/O performance – Up to synchronous timing mode 5 – Clock rate: 10ns (DDR) – Read/write throughput per pin: 200 MT/s • Asynchronous I/O performance – Up to asynchronous timing mode 5 – tRC/tWC: 20ns (MIN) – Read/write throughput per pin: 50 MT/s • Array performance – Read page: 35µs (MAX) – Program page: 350µs (TYP) – Erase block: 1.5ms (TYP) • Operating Voltage Range – VCC: 2.7–3.6V – VCCQ: 1.7–1.95V, 2.7–3.6V • Command set: ONFI NAND Flash Protocol • Advanced Command Set – Program cache – Read cache sequential – Read cache random – One-time programmable (OTP) mode – Multi-plane commands – Multi-LUN operations – Read unique ID – Copyback • First block (block address 00h) is valid when shipped from factory. For minimum required ECC, see Error Management (page 114). • RESET (FFh) required as first command after power-on • Operation status byte provides software method for detecting – Operation completion – Pass/fail condition – Write-protect status • Data strobe (DQS) signals provide a hardware method for synchronizing data DQ in the synchronous interface • Copyback operations supported within the plane from which data is read • Quality and reliability – Data retention: JESD47G compliant; see qualification report – Endurance: 60,000 PROGRAM/ERASE cycles • Operating temperature: – Commercial: 0°C to +70°C – Industrial (IT): –40ºC to +85ºC • Package – 52-pad LGA – 48-pin TSOP – 100-ball BGA – 132-ball BGA #Micron #NANDFlash #SLCNAND #FlashMemory #NonVolatileMemory #ONFI #EmbeddedSystems #IndustrialElectronics #DataStorage #MemoryIC #LBGA100 #HighReliability #MT29F256G08AUCABH310ITZA #MicronMemory #ParallelNANDFlash

Accelerometer X, Y, Z Axis ±2g, 4g, 8g, 16g 0.05Hz ~ 1.6kHz 14-LGA (3x5) The ADXL345-EP is an extended performance version of the ADXL345, which is a small, thin, ultralow power, 3-axis accelerometer with high resolution (13-bit) measurement at up to ±16 g. Digital output data is formatted as 16-bit twos complement and is accessible through either a SPI (3- or 4-wire) or I2 C digital interface. The ADXL345-EP is well suited for extended temperature range industrial and aerospace equipment. It measures the static acceleration of gravity in tilt-sensing applications, as well as dynamic acceleration resulting from motion or shock. Its high resolution (3.9 mg/LSB) enables measurement of inclination changes less than 1.0°. Several special sensing functions are provided. Activity and inactivity sensing detect the presence or lack of motion by comparing the acceleration on any axis with user-set thresholds. Tap sensing detects single and double taps in any direction. Freefall sensing detects if the device is falling. These functions can be mapped individually to either of two interrupt output pins. An integrated memory management system with a 32-level first in, first out (FIFO) buffer can be used to store data to minimize host processor activity and lower overall system power consumption. Low power modes enable intelligent motion-based power management with threshold sensing and active acceleration measurement at extremely low power dissipation. The ADXL345-EP is supplied in a small, thin, 3 mm × 5 mm × 1 mm, 14-lead, enhanced plastic package. Ultralow power: as low as 23 µA in measurement mode and 0.1 µA in standby mode at VS = 2.5 V (typical) Power consumption scales automatically with bandwidth User-selectable resolution from 10 to 13 bits 4 mg/LSB scale factor in all g ranges 32-sample FIFO minimizes host processor load Single tap, double tap, and free-fall detection Activity/inactivity monitoring Supply voltage range: 2.0 V to 3.6 V I/O voltage range: 1.7 V to VS SPI (3- and 4-wire) and I2C digital interfaces Flexible interrupt modes mappable to either interrupt pin Measurement ranges selectable via serial command Bandwidth selectable via serial command 10,000 g shock survival Pb free/RoHS compliant Small and thin: 3 mm × 5 mm × 1 mm LGA package #CommonPartsLibrary #Sensor #Motion-sensor #accelerometer

The RFFM6901 is a single-chip RF front-end module (FEM) designed for 868 MHz to 928 MHz ISM-band wireless communication applications. It integrates a high-power power amplifier (PA), low-noise amplifier (LNA), antenna diversity switch, and matching circuitry into a compact package, helping reduce external components, PCB space, and overall system cost. It is commonly used in smart energy systems, wireless metering, industrial monitoring, alarm systems, and other Sub-1 GHz wireless devices. Key Features Operating frequency range: 868 MHz to 928 MHz Integrated 1 W power amplifier Up to +30 dBm transmit output power Integrated low-noise amplifier with bypass mode Dual-port antenna diversity switch Separate 50 Ω transmit and receive interfaces Compact 32-pin LGA package (6 mm × 6 mm) Supply voltage range: 2.8 V to 4.2 V Typical LNA gain: 17 dB Low receiver noise figure: 1.5 dB Designed for portable and battery-powered wireless systems RoHS compliant Typical Applications Smart energy and smart metering Wireless alarm and security systems ISM-band communication devices Industrial wireless sensors Portable RF equipment IoT Sub-1 GHz wireless systems Search across more sources