2 Position Wire to Board Terminal Block Horizontal with Board 0.100" (2.54mm) Through Hole 1725656 – PCB-mounted screw terminal block designed for secure wire-to-board connections in industrial, control, automation, instrumentation, and power distribution applications. Features a screw-clamp termination system that provides reliable electrical contact and strong wire retention under vibration and demanding operating conditions. The through-hole construction offers enhanced mechanical stability, making it suitable for long-term field installations and high-reliability electronic assemblies. Designed to simplify wiring, maintenance, and system integration while ensuring dependable signal and power connectivity. #TerminalBlock #ScrewTerminal #WireToBoard #IndustrialElectronics #PowerDistribution #AutomationSystems #ControlPanels #ThroughHoleConnector #PCBConnector #ReliableConnectivity #connector #Terminalblock #tht

SDRAM - Mobile LPDDR4X Memory IC 8Gbit Parallel 2.133 GHz 200-FBGA (10x15) The IM8G32L4JCBG-046I is an 8Gb (1GB) LPDDR4X SDRAM memory device designed for high-performance, low-power embedded applications. Organized as 256M × 32 bits, it delivers data rates up to 4266 MT/s, making it suitable for industrial computing, AI edge devices, networking equipment, automotive systems, and other memory-intensive applications. The LPDDR4X architecture reduces power consumption while maintaining high bandwidth and reliable operation across industrial temperature ranges. Key Features 8Gb (Gigabit) LPDDR4X SDRAM Memory organization: 256M × 32 bits High-speed operation up to 4266 MT/s Low-power LPDDR4X interface for reduced energy consumption 32-bit data bus width Industrial operating temperature range: –40°C to +95°C 200-ball FBGA package (10 mm × 15 mm) High bandwidth for demanding embedded applications Optimized for low-power and thermally constrained designs Suitable for industrial, automotive, networking, and edge AI systems #LPDDR4X #SDRAM #MemoryIC #EmbeddedSystems #IndustrialElectronics #EdgeComputing #AIoT #HighSpeedMemory #LowPowerDesign #AutomotiveElectronics #NetworkingHardware #FBGA #HardwareDesign #ElectronicsEngineering #PCBDesign #IntelligentMemory

2/2 Transceiver Full RS232 16-SOIC The MAX3232ECWE+T is a dual-channel RS-232 transceiver manufactured by Analog Devices under the Maxim Integrated product family. This integrated circuit is designed to provide reliable bidirectional communication between TTL or CMOS logic-level devices and RS-232 serial communication interfaces. The device integrates charge-pump voltage converters and line drivers/receivers, enabling full RS-232 signal compliance using a single low-voltage power supply. The transceiver supports high-speed serial data communication while maintaining low power consumption and robust signal integrity. It is widely used in embedded systems, industrial automation equipment, communication interfaces, instrumentation systems, microcontroller platforms, portable electronics, and legacy serial communication applications. The MAX3232ECWE+T enables seamless voltage-level translation between modern low-voltage digital electronics and traditional RS-232 communication standards. Its compact surface-mount package and integrated functionality reduce external component requirements and simplify serial interface implementation in space-constrained electronic systems. Engineering Specification Device Type RS-232 transceiver interface IC Communication Standard RS-232 serial communication interface Channel Configuration Dual driver and dual receiver architecture Logic Compatibility TTL and CMOS logic-level interface support Voltage Conversion Integrated charge-pump voltage generation Data Communication Bidirectional asynchronous serial communication support Signal Characteristics Compliant RS-232 voltage-level transmission and reception Power Characteristics Low-voltage single-supply operation Data Rate Performance High-speed serial communication capability Protection Features Robust communication interface tolerance and stable signal operation Package Type SOIC surface-mount package Mounting Style Surface mount technology Applications Embedded systems Industrial automation Serial communication interfaces Microcontroller systems Instrumentation equipment Portable electronics Communication gateways Legacy serial devices Data acquisition systems RS-232 interface conversion Manufacturer Analog Devices / Maxim Integrated #commonpartslibrary #rs232 #serialcommunication #transceiver #interfaceic #maximintegrated #analogdevices #embeddedhardware #communicationinterfaces #surfaceountcomponents #electronicsdesign #industrialelectronics #microcontroller #datacommunication #signalconversion

Power Management IC for iMX8M 5V 6A 6 Buck + 5 LDO The PCA9450CHNY is a highly integrated Power Management Integrated Circuit (PMIC) from NXP Semiconductors, specifically designed to power the i.MX 8M family of application processors, particularly the i.MX 8M Plus. It integrates multiple high-efficiency DC-DC buck converters, LDO regulators, power sequencing logic, load switching, voltage monitoring, and system control functions into a single device. The PCA9450C variant features a configurable dual-phase 6 A buck regulator for powering high-current processor cores while supporting Dynamic Voltage Scaling (DVS) for optimized power efficiency. Key Features Six high-efficiency switching regulators (Buck converters) PCA9450C variant supports a configurable 6 A dual-phase buck regulator Three 3 A buck regulators with Dynamic Voltage Scaling (DVS) Remote-sense capability on major buck outputs for IR-drop compensation Five integrated LDO regulators Supports DDR4, LPDDR4, and DDR3L memory configurations 400 mA load switch with active discharge Dual-channel logic level translator Integrated 32.768 kHz crystal oscillator driver Fast-mode Plus (Fm+) 1 MHz I²C interface Programmable power sequencing and voltage control Power ON/OFF and Standby/Run mode control inputs Protection features including UVLO, thermal shutdown, fault monitoring, and soft-start Operating temperature range: −40°C to +105°C 56-pin HVQFN package (7 mm × 7 mm, 0.4 mm pitch) Optimized for i.MX 8M Mini, Nano, and Plus processors, especially the i.MX 8M Plus for the PCA9450C variant. #CommonPartsLibrary #PCA9450CHNY #PCA9450C #NXP #PMIC #PowerManagementIC #PowerSupply #VoltageRegulator #BuckConverter #LDO #DynamicVoltageScaling #DVS #IMX8M #IMX8MPlus #EmbeddedSystems #IndustrialElectronics #PowerManagement #HVQFN56 #Semiconductor #IntegratedCircuit #IC #CommonPartsLibrary #ElectronicsDesign #HardwareDesign #PCBDesign #EmbeddedLinux #IoT #ProcessorPowerManagement #PowerSequencing #SystemPower #NXPSemiconductors

680 kOhms ±5% 0.25W, 1/4W Through Hole Resistor Axial Automotive AEC-Q200 Carbon Film The CFR-25JB-52-680K is a carbon film through-hole resistor designed for general-purpose electronic applications requiring stable resistance characteristics, reliable long-term performance, and cost-effective implementation. This resistor is commonly used in signal conditioning, voltage division, pull-up and pull-down networks, biasing circuits, and low-power analog or digital systems. Its axial leaded construction supports automated insertion and conventional through-hole assembly methods, making it suitable for consumer electronics, industrial controls, instrumentation, and embedded systems. The device utilizes carbon film resistive technology to provide dependable electrical performance with moderate noise characteristics and good environmental stability. The flame-retardant coating enhances mechanical durability and improves resistance against moisture and environmental exposure. The component is optimized for standard operating environments where compact size, stable operation, and economical design are required. Electrical Characteristics Resistance Value: 680 kΩ Resistance Tolerance: ±5% Resistor Technology: Carbon Film Rated Power Dissipation: 1/4 W Maximum Working Voltage: 250 V Maximum Overload Voltage: 500 V Temperature Coefficient: ±350 ppm/°C Insulation Resistance: High reliability insulation structure suitable for general electronic equipment Mechanical Characteristics Package Type: Axial Through-Hole Mounting Style: Through Hole Body Style: Cylindrical Flame-Retardant Coated Body Lead Material: Tin-Plated Copper Lead Configuration: Axial Leads for PCB insertion Environmental Characteristics Operating Temperature Range: −55°C to +155°C Moisture Resistance: Suitable for standard humidity environments Flame Resistance: Flame-retardant protective coating compliant with general safety requirements Applications Signal Conditioning Circuits Voltage Divider Networks Pull-Up and Pull-Down Resistors Industrial Control Electronics Consumer Electronic Products General Analog and Digital Circuitry Embedded Systems and Microcontroller Interfaces #commonpartslibrary #passivecomponents #resistor #carbonfilm #throughhole #axialresistor #powermanagement #analog #digital #industrialelectronics

The A767KN476M1HLAE029 is a surface-mount aluminum electrolytic capacitor designed for bulk energy storage, power supply filtering, ripple current suppression, and voltage stabilization applications. This capacitor utilizes aluminum electrolytic technology to provide high capacitance density in a compact package, making it suitable for modern power management and industrial electronic systems. The device is optimized for applications requiring stable capacitance performance, long operational life, and reliable operation under varying electrical and environmental conditions. It is commonly used in switching power supplies, DC-DC converters, industrial control equipment, communication systems, consumer electronics, and embedded power distribution networks. Its low impedance characteristics and high ripple current capability support efficient power filtering and transient response improvement in electronic circuits. The surface-mount construction enables automated assembly processes and compact PCB integration in high-density designs. Engineering Specification Device Type Aluminum electrolytic capacitor Capacitor Technology Surface-mount aluminum electrolytic construction Capacitance Characteristics High-capacitance energy storage and filtering capability Electrical Characteristics Optimized for power supply filtering and voltage stabilization Impedance Performance Low impedance design for efficient ripple suppression Ripple Current Capability Suitable for high-ripple-current power applications Thermal Characteristics Stable operation across industrial electronic operating conditions Reliability Features Long operational lifetime and robust electrical performance Mounting Style Surface mount technology Package Structure Chip-type aluminum electrolytic capacitor Environmental Characteristics Designed for commercial and industrial electronic environments Applications Switching power supplies DC-DC converters Power management systems Industrial automation Communication equipment Embedded systems Consumer electronics Voltage filtering circuits Energy storage applications Power distribution networks Manufacturer Commonly associated with KEMET aluminum electrolytic capacitor product families #commonpartslibrary #electrolyticcapacitor #aluminumcapacitor #passivecomponents #powerelectronics #powersupply #filtercapacitor #energystorage #surfaceountcomponents #embeddedhardware #electronicsdesign #dcdcconverter #industrialelectronics #powermanagement #ripplefiltering

The TPS3839G33DBZT is an ultra-low-power voltage supervisor designed to monitor system supply rails and provide reliable reset signaling for microcontrollers, processors, FPGAs, and other digital systems. The device continuously supervises the supply voltage and asserts a reset output when the monitored voltage falls below the factory-programmed threshold, ensuring proper system startup, shutdown, and fault recovery. Its low quiescent current makes it particularly suitable for battery-powered, portable, and energy-efficient applications where power consumption is critical. The device features a precision voltage monitoring architecture with a fixed reset threshold optimized for nominal logic supply rails. It provides a stable reset output with an internally defined reset timeout period, eliminating the need for external timing components. The compact package and robust noise immunity make it ideal for embedded systems, industrial controls, consumer electronics, IoT devices, medical equipment, and wireless communication platforms. Key Features Ultra-low quiescent current operation Precision fixed-voltage supervision Factory-programmed reset threshold for logic supply monitoring Active-low reset output Internal reset timeout delay High threshold accuracy over temperature Fast response to undervoltage conditions Push-pull reset output configuration No external components required for operation Compact surface-mount package Wide operating temperature range High reliability and low power consumption Applications Microcontroller reset generation Embedded control systems Battery-powered electronics Industrial automation equipment IoT and wireless sensor nodes Portable medical devices Consumer electronics Data acquisition systems Power management subsystems Communication and networking equipment Electrical Characteristics Fixed supply voltage monitoring Precision undervoltage detection Low operating current Integrated reset timing circuitry Stable reset assertion during power-up and brownout conditions Noise-tolerant voltage supervision Reliable operation across specified temperature range Package Information Surface-mount package Compact footprint for space-constrained designs RoHS-compliant construction Suitable for automated assembly processes #commonpartslibrary #integratedcircuit #powersupervisor #voltagesupervisor #resetcontroller #powermanagement #embeddedsystems #microcontroller #lowpower #batterypowered #industrialelectronics #iot #electronicsdesign #semiconductor #texasinstruments

QFN-68-EP(7x7) Power Management - Specialized RoHS The RK809-5 is a highly integrated Power Management Integrated Circuit (PMIC) from Rockchip designed for multi-core processor systems and embedded applications. It provides a complete power management solution by integrating multiple high-efficiency DC-DC buck converters, LDO regulators, power sequencing logic, battery fuel gauging, RTC functionality, and audio codec capabilities into a single device. The RK809-5 is commonly used alongside Rockchip SoCs in single-board computers, tablets, AIoT devices, and industrial embedded systems. Key Features Five high-efficiency synchronous buck converters with fast transient response. Nine low-dropout (LDO) voltage regulators for powering sensitive analog and digital circuits. Integrated battery fuel gauge for battery capacity monitoring. Configurable power-up and power-down sequencing (OTP programmable). Dynamic Voltage Scaling (DVS/DVFS) support via I²C interface. Integrated Real-Time Clock (RTC) with 32.768 kHz crystal oscillator support. Two integrated load switches for peripheral power control. Over-current, over-voltage, and thermal protection features. Built-in audio CODEC with headphone driver and Class-D amplifier support. Designed to minimize external component count and simplify power system design. QFN-68-EP (7 mm × 7 mm) package. #RK8095 #RK809 #Rockchip #PMIC #PowerManagementIC #BatteryManagement #AudioCodec #RTC #DVFS #EmbeddedSystems #SingleBoardComputer #IoT #IndustrialElectronics #PowerSupplyDesign #ElectronicsEngineering

ADC, Audio 32 b 7.35k ~ 768k I2C, I2S, TDM 20-WQFN (3x3) The TLV320ADC3120IRTER is a low-power, high-performance stereo audio analog-to-digital converter designed for voice, audio capture, and digital signal processing applications. The device integrates programmable microphone bias generation, low-noise input amplifiers, digital filtering, automatic gain control, and high-resolution audio conversion into a compact package. It supports a wide range of analog microphone and line-level input configurations while delivering excellent audio fidelity and power efficiency. The converter is optimized for portable electronics, smart devices, industrial audio systems, communication equipment, and embedded voice-processing applications requiring high-quality audio digitization. Engineering Specifications Manufacturer: Texas Instruments Part Number: TLV320ADC3120IRTER Device Type: Stereo Audio Analog-to-Digital Converter Audio Channels: Stereo Input Architecture Converter Type: Sigma-Delta Analog-to-Digital Converter Resolution: High-Resolution Audio Conversion Input Configuration: Differential and Single-Ended Inputs Microphone Support: Integrated Microphone Bias Generation Programmable Gain: Integrated Low-Noise Programmable Gain Amplifiers Digital Processing: Integrated Digital Filters Automatic Gain Control: Supported Audio Interface: Digital Audio Serial Interface Power Consumption: Low Power Operation Clocking Support: Flexible Audio Clock Configuration Noise Performance: Low Noise Audio Acquisition Dynamic Range: High Dynamic Range Package Type: WQFN Package Mounting Style: Surface Mount Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: Voice Capture Systems, Smart Speakers, Audio Recording Equipment, Industrial Audio Devices, Communication Systems, Embedded Audio Platforms, Human Machine Interfaces, Portable Electronics Key Features High-performance stereo audio conversion Integrated microphone bias circuitry Low-noise programmable gain amplifiers Automatic gain control functionality Flexible digital audio interface support Optimized for voice and audio capture applications Low power consumption for portable devices Integrated digital signal processing features High audio fidelity and dynamic range Compact surface-mount package for space-constrained designs #TLV320ADC3120IRTER #TexasInstruments #AudioADC #AudioConverter #StereoADC #DigitalAudio #VoiceCapture #AudioProcessing #EmbeddedAudio #MicrophoneInterface #AudioElectronics #DSP #IndustrialElectronics #SmartDevices #PortableElectronics #SignalProcessing #SurfaceMount #ElectronicComponents #PCBDesign #AudioSystemDesign

5.7 kV RMS/1.5 kV RMS, Quad-Channel LVDS 2.5 Gigabit Isolator (0 Reverse Channels) LVDS Digital Isolator 5700Vrms 4 Channel 2.5Gbps 40kV/µs CMTI 28-BSSOP (0.295", 7.50mm Width) The ADN4624 is a quad-channel, signal isolated, low voltage differential signaling (LVDS) buffer that operates at up to 2.5 Gbps with very low jitter. The device integrates Analog Devices, Inc., iCoupler® technology, enhanced for high speed operation to provide drop-in galvanic isolation of LVDS signal chains. AC coupling and/or level shifting to the LVDS receivers and from the LVDS drivers allows isolation of other high speed signals such as current mode logic (CML). The ADN4624 includes a refresh mechanism to monitor the input and output states and ensure they remain the same in the absence of data transitions (for example, at power-on). For lower power consumption and high speed operation with low jitter, the LVDS and isolator circuits rely on 1.8 V supplies. The ADN4624 is fully specified over a wide industrial temperature range and is available in a 28-lead, wide-body, finer pitch SOIC_W_FP package with 8.3 mm creepage and clearance (for 5.7 kV rms or 8 kVPEAK surge and impulse voltages and reinforced insulation at ac mains voltages) or 6 mm × 6 mm LFCSP package with 1.27 mm creepage and clearance (for basic/functional isolation). FEATURES ► 5.7 kV rms and 1.5 kV rms LVDS isolators ► Complies with TIA/EIA-644-A LVDS signal levels ► Quad-channel configuration ► Any data rate up to 2.5 Gbps switching with low jitter ► 10 Gbps total bandwidth across four channels ► 2.15 ns typical propagation delay ► Typical jitter: 0.82 ps rms random, 40 ps total peak ► Lower power 1.8 V supplies ► ±8 kV IEC 61000-4-2 ESD protection across isolation barrier ► High common-mode transient immunity: 100 kV/μs typical ► Safety and regulatory approvals (28-lead SOIC_W_FP package) ► UL (pending): 5700 V rms for 1 minute per UL 1577 ► CSA Component Acceptance Notice 5A (pending) ► VDE certificate of conformity (pending) ► DIN V VDE V 0884-11 (VDE V 0884-11):2017-01 ► VIORM = 849 VPEAK (working voltage) ► Enable or disable refresh (low speed output correctness check) ► Operating temperature range: −40°C to +125°C ► 28-lead, wide-body, finer pitch SOIC_W_FP package with 8.3 mm creepage and clearance or 6 mm × 6 mm LFCSP package with 1.27 mm creepage and clearance APPLICATIONS ► Isolated video and imaging data ► Analog front-end isolation ► Data plane isolation ► Isolated high speed clock and data links ► Multi-gigabit serialization/deserialization (SERDES) ► Board-to-board optical replacement (for example, short reach fiber) #CommonPartsLibrary #ADN4624BRNZ #DigitalIsolator #LVDS #AnalogDevices #HighSpeedInterface #GalvanicIsolation #LVDSIsolator #DigitalIsolation #IndustrialElectronics #HighSpeedData #SERDES #SignalIntegrity #EmbeddedSystems #ElectronicsDesign #InterfaceICs

General Purpose Relay DPDT (2 Form C) Through Hole The G5V-2-DC5 is a compact signal relay manufactured by Omron Electronic Components and designed for reliable low-power switching in telecommunications, industrial control systems, instrumentation, automation equipment, security systems, and embedded electronic applications. The relay utilizes a dual-pole double-throw contact arrangement, enabling flexible signal routing and isolation between control and load circuits. The device features a highly reliable electromagnetic switching mechanism optimized for stable operation, low contact resistance, and consistent electrical performance throughout its service life. Its compact package allows efficient PCB integration while supporting high-density circuit layouts. The relay is engineered to provide dependable switching of low-level signals and control circuits where accuracy, durability, and long-term reliability are critical design requirements. The construction incorporates high-quality contact materials and precision mechanical components to ensure excellent switching characteristics, enhanced contact stability, and resistance to environmental influences. The relay is suitable for applications requiring galvanic isolation, signal multiplexing, interface switching, and control circuit management. General Description The G5V-2-DC5 is a miniature signal relay intended for precision switching applications in electronic systems. It offers dependable electrical isolation between circuits while maintaining excellent signal integrity and operational reliability. Its compact footprint, proven switching performance, and robust construction make it a popular choice for communication equipment, industrial electronics, measurement systems, network infrastructure, security devices, and embedded control platforms. The relay is widely recognized for its reliability, ease of integration, and suitability for demanding electronic switching environments. #G5V2DC5 #Omron #SignalRelay #ElectromechanicalRelay #PCBRelay #IndustrialElectronics #EmbeddedSystems #Automation #ControlSystems #Telecommunications #ElectronicComponents #HardwareDesign #CircuitProtection #ElectricalEngineering #PCBDesign #RelayModule #ElectronicSwitching #Instrumentation #EngineeringSpecification #ElectronicsDesign

WP-BUFU REDCUBE Bush, full height: 7mm, total height: 10.5mm, thread length: 4mm, pin length: 3.5mm, raster: 2.54mm, REDCUBE Press-Fit; M5, blind 4mm 16 Pin Screw Terminal, Power Tap M5 Through Hole The 7461147 is a high-current PCB-mounted power terminal from the REDCUBE® WP-BUFU series by Würth Elektronik. It is designed to provide a robust and low-resistance connection for transferring high currents between cables, busbars, and printed circuit boards. The terminal utilizes press-fit technology, eliminating the need for soldering while ensuring a gas-tight, vibration-resistant electrical connection. It is particularly suitable for power distribution, industrial equipment, automotive electronics, battery systems, and renewable energy applications. Key Features High current rating up to 180 A M5 screw terminal for secure high-power connections Press-fit termination for solderless PCB assembly 16-pin through-hole mounting configuration Gas-tight electrical connection for long-term reliability Excellent resistance to vibration and mechanical shock Low contact resistance for efficient power transfer Simplifies manufacturing by eliminating soldering processes Suitable for high-current power distribution and battery applications RoHS compliant design Typical Applications Power supplies and power converters Battery management and energy storage systems DC-DC and DC-AC converters Industrial automation equipment Automotive power electronics Solar and wind energy systems High-current PCB power distribution networks #CommonPartsLibrary #REDCUBE #PowerTerminal #PressFit #HighCurrentConnector #PCBTerminal #WurthElektronik #IndustrialElectronics #AutomotiveElectronics #PowerDistribution #EnergyStorage #RenewableEnergy #7461147

Coin, 20.0mm Lithium Manganese Dioxide 3 V Battery Non-Rechargeable (Primary) The CR2032 is a compact, coin-cell lithium battery widely used in portable electronic devices, providing long-lasting, stable power in a small form factor. It features a cylindrical shape with a flat positive terminal and a metal casing that serves as the negative terminal. Known for its high energy density and wide operating temperature range, this battery is ideal for memory backup, real-time clocks, small medical devices, remote controls, wearable electronics, and low-drain consumer electronics. Its reliability, shelf life, and lightweight design make it a standard choice for a broad range of compact electronic applications. Engineering Specifications Battery Type: Lithium Coin Cell Chemistry: Lithium Manganese Dioxide Standard Designation: CR2032 Nominal Voltage: 3 Volts Capacity: Typical Rated Capacity for Consumer Electronics Discharge Characteristics: Suitable for Low-Drain Applications Dimensions: Standard Diameter and Height for CR2032 Operating Temperature Range: Wide Range for Consumer and Industrial Use Shelf Life: Extended, Suitable for Long-Term Storage Terminals: Flat Positive Top, Metal Casing Negative Bottom RoHS Compliant: Yes Applications: Watches, Calculators, Motherboard CMOS Backup, Fitness Trackers, Remote Controls, Medical Devices, Sensors, Small Electronics #CR2032 #LithiumBattery #CoinCell #3Volt #LongLifeBattery #PortableElectronics #Wearables #ConsumerElectronics #MemoryBackup #LowDrainDevice #IndustrialElectronics #BatteryComponent #PCBDesign #CompactPower

The NX3225SA-26MHz-STD-CSR-6 is a surface-mount quartz crystal resonator designed to provide a stable frequency reference for microcontrollers, wireless communication modules, embedded systems, consumer electronics, industrial controls, and timing applications. Manufactured in a compact ceramic package, this crystal offers excellent frequency stability, low power consumption, and reliable long-term performance. Its standard frequency tolerance and stability characteristics make it suitable for clock generation, frequency synthesis, and synchronization functions in a wide range of electronic designs requiring precise timing accuracy. Features Surface-mount quartz crystal resonator Fundamental mode operation Compact ceramic package suitable for high-density PCB layouts Stable frequency reference for digital and RF applications Low equivalent series resistance for reliable oscillator startup Compatible with automated assembly processes Excellent aging characteristics and long-term reliability Suitable for low-power and battery-operated devices RoHS-compliant and lead-free construction Applications Microcontroller clock generation Wireless communication modules Bluetooth and Wi-Fi devices Industrial automation equipment IoT and smart devices Consumer electronics Measurement and instrumentation systems Embedded control platforms Timing and synchronization circuits Electrical Characteristics Nominal frequency centered at twenty-six megahertz Standard frequency tolerance classification Standard operating temperature stability Fundamental crystal oscillation mode Specified load capacitance configuration Low equivalent series resistance High insulation resistance Low drive level operation Reliable startup characteristics Long operational lifetime with minimal frequency drift Mechanical Characteristics Ceramic surface-mount package Compact footprint suitable for space-constrained designs Metal lid sealed construction Designed for reflow soldering processes Tape-and-reel packaging compatibility Environmental Characteristics Industrial-grade reliability Resistance to mechanical shock and vibration within specification limits Moisture-resistant sealed package construction Suitable for standard electronic manufacturing environments Compliant with environmental and hazardous substance regulations #commonpartslibrary #crystal #quartzcrystal #frequencyreference #timingdevice #oscillator #clocksource #smtcomponent #passivecomponent #embeddedsystems #wirelesscommunication #industrialelectronics #consumerelectronics #iotdevices #electronicsdesign

SLC NAND Flash Parallel/Serial 3.3V 256G-bit 32G x 8 100-Pin LBGA FLASH - NAND (SLC) Memory IC 256Gbit Parallel 100 MHz 100-LBGA (12x18) The MT29F256G08AUCABH3-10ITZ:A is a high-density 256Gb Single-Level Cell (SLC) NAND Flash memory device from Micron Technology. It provides non-volatile data storage with high reliability, fast read/write performance, and long endurance, making it suitable for industrial, networking, embedded computing, automotive, and data-logging applications. The device supports both asynchronous and synchronous interfaces and complies with the Open NAND Flash Interface (ONFI) standard for enhanced interoperability and performance. It is housed in a compact 100-ball LBGA package (12 mm × 18 mm). • Open NAND Flash Interface (ONFI) 2.2-compliant1 • Single-level cell (SLC) technology • Organization – Page size x8: 8640 bytes (8192 + 448 bytes) – Block size: 128 pages (1024K + 56K bytes) – Plane size: 2 planes x 2048 blocks per plane – Device size: 32Gb: 4096 blocks; 64Gb: 8192 blocks; 128Gb: 16,384 blocks; 256Gb: 32,768 blocks • Synchronous I/O performance – Up to synchronous timing mode 5 – Clock rate: 10ns (DDR) – Read/write throughput per pin: 200 MT/s • Asynchronous I/O performance – Up to asynchronous timing mode 5 – tRC/tWC: 20ns (MIN) – Read/write throughput per pin: 50 MT/s • Array performance – Read page: 35µs (MAX) – Program page: 350µs (TYP) – Erase block: 1.5ms (TYP) • Operating Voltage Range – VCC: 2.7–3.6V – VCCQ: 1.7–1.95V, 2.7–3.6V • Command set: ONFI NAND Flash Protocol • Advanced Command Set – Program cache – Read cache sequential – Read cache random – One-time programmable (OTP) mode – Multi-plane commands – Multi-LUN operations – Read unique ID – Copyback • First block (block address 00h) is valid when shipped from factory. For minimum required ECC, see Error Management (page 114). • RESET (FFh) required as first command after power-on • Operation status byte provides software method for detecting – Operation completion – Pass/fail condition – Write-protect status • Data strobe (DQS) signals provide a hardware method for synchronizing data DQ in the synchronous interface • Copyback operations supported within the plane from which data is read • Quality and reliability – Data retention: JESD47G compliant; see qualification report – Endurance: 60,000 PROGRAM/ERASE cycles • Operating temperature: – Commercial: 0°C to +70°C – Industrial (IT): –40ºC to +85ºC • Package – 52-pad LGA – 48-pin TSOP – 100-ball BGA – 132-ball BGA #Micron #NANDFlash #SLCNAND #FlashMemory #NonVolatileMemory #ONFI #EmbeddedSystems #IndustrialElectronics #DataStorage #MemoryIC #LBGA100 #HighReliability #MT29F256G08AUCABH310ITZA #MicronMemory #ParallelNANDFlash

SDRAM - Mobile LPDDR4 Memory IC 48Gbit 2.133 GHz MT53E1536M32D4DT-046 WT:A is a high-density 48Gb (6GB) LPDDR4/LPDDR4X SDRAM memory device from Micron Technology. It is designed for high-performance, low-power applications requiring fast memory bandwidth and efficient power management. The device features a 32-bit data bus, supports data rates up to 4266 MT/s, and is packaged in a compact 200-ball FBGA, making it suitable for embedded computing, industrial systems, networking equipment, AI edge devices, automotive electronics, and mobile platforms. Key Features 48Gb (6GB) LPDDR4/LPDDR4X SDRAM Organized as 1.5G × 32 bits Data transfer rates up to 4266 MT/s Maximum clock frequency of 2133 MHz Low-power operation with 1.1V core supply 32-bit memory interface 200-ball FBGA package JEDEC LPDDR4-compliant architecture Per-bank refresh support Temperature-compensated refresh Self-refresh and deep power-down modes Partial-array self-refresh capability High bandwidth with reduced power consumption Optimized for compact embedded designs Operating temperature range: –30°C to +85°C Typical Applications Embedded Linux computers Single-board computers (SBCs) AI and edge computing platforms Industrial automation systems Networking and telecommunications equipment Automotive infotainment and control systems Tablets and mobile devices FPGA and SoC-based designs #commonpartslibrary #integratedcircuit #memory #dram #sdram #lpddr4 #lpddr4x #mobiledram #micron #embeddedsystems #embeddedcomputing #industrialelectronics #automotiveelectronics #edgecomputing #artificialintelligence #networking #telecommunications #highspeedmemory #lowpowerdesign #computerhardware #electroniccomponents #semiconductor #datasheet #fbga #memorychip #electronicsdesign #pcbdesign #hardwareengineering #electronicengineering #systemonchip #fpga #iot #internetofthings #computermemory #digitalelectronics #surfaceMount #smt #bga #storage #highperformancecomputing #hpc #mobiledevices #industrialautomation #electronicdesign #componentlibrary #fluxlibrary #parametricpart #eda #schematic #pcb #electronicdesignautomation #chipdesign #embeddedhardware #memorymodule #lowpowerelectronics #highbandwidthmemory #electronics #hardwaredevelopment #engineering #electricalengineering

64 Position Female Connector PCI Express™ Gold 0.039" (1.00mm) Black The PCIE-064-02-X-D-TH is a high-density PCI Express edge connector designed for reliable board-to-board and card-to-host connections in high-speed data communication applications. Manufactured by Samtec, this connector supports PCI Express signaling standards while providing robust mechanical and electrical performance for high-frequency, high-bandwidth systems. Its through-hole mounting and dual-row design ensure secure attachment to the PCB, high mating retention, and long operational life. The connector is ideal for computer peripherals, server systems, embedded computing platforms, networking devices, and industrial electronic equipment where signal integrity, mechanical reliability, and high-density interconnects are critical. Engineering Specifications Manufacturer: Samtec Part Number: PCIE-064-02-X-D-TH Series: PCI Express Edge Connector Connector Type: Board-to-Board / Card Edge Connector Contact Configuration: Dual-Row High-Density Contacts Mounting Style: Through-Hole Contact Material: Copper Alloy Contact Finish: Gold-Plated Contact Surface Housing Material: High-Temperature Thermoplastic Signal Performance: PCI Express Standard Compliant Electrical Performance: High-Speed Data Transmission Mechanical Durability: High Mating Cycle Life Orientation: Right Angle / Standard Edge Mount Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: PCI Express Expansion Cards, High-Speed Computing Systems, Server and Data Center Hardware, Embedded Platforms, Networking Equipment, Industrial Computing, High-Bandwidth Digital Interfaces, Board-Level Interconnects Key Features High-density dual-row PCIe edge contacts Through-hole mounting for robust PCB attachment Gold-plated contact interface for reliable signal transmission Supports high-speed PCI Express signaling Compact, high-density design for space-constrained PCBs Long mechanical life with repeated mating cycles Compatible with standard PCI Express cards and connectors Reliable operation in industrial and commercial environments Ideal for embedded computing, server, and networking applications Ensures signal integrity for high-bandwidth data communication #PCIE06402XDTH #Samtec #PCIeConnector #EdgeConnector #BoardToBoard #HighSpeedInterconnect #HighDensityConnector #ThroughHole #IndustrialElectronics #EmbeddedSystems #ServerHardware #NetworkingEquipment #ElectronicComponents #PCBDesign #HighBandwidth #DataCommunication #PCIExpress #ExpansionCardConnector #MechanicalReliability #ElectronicInterconnect

77 (55 + 22 Ground) Position Header, Male Pins Connector 0.079" (2.00mm) Through Hole The 5106081‑1 is a high-reliability male PCB connector manufactured by TE Connectivity. It belongs to the Z‑PACK 2 mm HM Series, designed for mezzanine and backplane board-to-board interconnects. The connector features precision-machined phosphor bronze contacts with tin plating, ensuring consistent electrical conductivity, low contact resistance, and long-term reliability. The device has a through-hole press-fit termination style for robust mechanical attachment to printed circuit boards and optimal compatibility with automated assembly processes. Its vertical orientation and standardized 2 mm pitch allow compact, high-density PCB layouts while maintaining reliable alignment and mating with compatible female headers. The connector is engineered to support repeated insertion cycles, high signal integrity, and consistent electrical performance in industrial, telecommunications, and embedded electronic applications. General Description The 5106081‑1 is a durable, 77-position male PCB connector intended for high-density board-to-board interconnect solutions. It provides secure electrical connections, mechanical stability, and long-term reliability in demanding electronic systems. Widely used in industrial automation, telecommunications, and embedded computing, this connector ensures precise mating, easy PCB integration, and robust operation in backplane and mezzanine applications. Its press-fit through-hole design, reliable contact material, and standardized footprint make it a versatile solution for complex multi-board electronic assemblies. #TEConnectivity #PCBConnector #MaleHeader #BoardToBoard #ZPACK #2mmPitch #HighDensityInterconnect #ThroughHole #PressFit #IndustrialElectronics #Telecommunications #EmbeddedSystems #ElectricalEngineering #ReliableConnection #EngineeringSpec #ElectronicConnector #HighPerformanceConnector

USB-C (USB TYPE-C) Receptacle Connector 24 Position Panel Mount, Through Hole, Right Angle The MUSBRM1C1M0 is a ruggedized USB Type-C receptacle connector designed for high-reliability data and power connectivity in industrial, embedded, transportation, and harsh-environment applications. The connector features a reversible USB Type-C interface that supports modern high-speed communication protocols while providing robust mechanical durability and secure board-level attachment. Its reinforced construction helps withstand vibration, shock, and repeated mating cycles, making it suitable for demanding applications where reliability and long service life are critical. The device is commonly used in industrial controllers, communication equipment, medical devices, consumer electronics, and next-generation embedded systems requiring compact and versatile connectivity. Engineering Specifications Manufacturer: Amphenol Communications Solutions Part Number: MUSBRM1C1M0 Connector Type: USB Type-C Receptacle Interface Standard: Universal Serial Bus Type-C Connector Gender: Receptacle Mounting Style: Surface Mount Orientation: Right Angle Contact Configuration: USB Type-C Multi-Function Interface Data Support: High-Speed Data Transmission Power Delivery Support: Compatible with USB Power Delivery Architectures Shielding: Integrated EMI Shielding Contact Material: Copper Alloy Contact Finish: Gold-Plated Contact Interface Housing Material: High-Strength Metal Shield Construction Durability: High Mating Cycle Life Environmental Performance: Designed for Industrial Applications Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: Embedded Systems, Industrial Automation, Consumer Electronics, Communication Equipment, Medical Devices, IoT Products, Portable Electronics, Data Acquisition Systems Key Features Reversible USB Type-C connection interface Ruggedized mechanical construction High-speed data communication capability Secure PCB mounting design Enhanced resistance to vibration and mechanical stress Integrated shielding for improved electromagnetic compatibility Compact footprint for space-constrained designs Supports modern USB power and data architectures Long operational lifespan with high insertion cycle durability Suitable for industrial and commercial electronic systems #MUSBRM1C1M0 #Amphenol #USBTypeC #USBConnector #TypeCReceptacle #HighSpeedConnectivity #PowerDelivery #IndustrialElectronics #EmbeddedSystems #CommunicationEquipment #IoTDevices #ConsumerElectronics #PCBDesign #ElectronicComponents #SurfaceMount #DataTransmission #USBPD #IndustrialAutomation #MedicalElectronics #ConnectorTechnology

10 Position Receptacle Connector 0.050" (1.27mm) Surface Mount Gold The SFM-105-02-X-D-A is a high-reliability dual-row socket connector designed for board-to-board and mezzanine interconnection applications. Manufactured by Samtec, this connector provides a compact and durable solution for connecting printed circuit boards in embedded systems, industrial electronics, communications equipment, test instruments, and high-performance computing platforms. The connector features precision-machined contacts that ensure consistent electrical performance, excellent mating reliability, and long operational life. Its low-profile design and high-density contact arrangement make it suitable for applications requiring space-efficient interconnect solutions while maintaining signal integrity and mechanical robustness. Engineering Specifications Manufacturer: Samtec Part Number: SFM-105-02-X-D-A Series: SFM Series Connector Type: Board-to-Board Socket Connector Contact System: Precision Socket Contacts Row Configuration: Dual Row Mounting Style: Through-Hole Contact Material: Copper Alloy Contact Finish: Gold-Plated Contact Interface Housing Material: High-Temperature Thermoplastic Mating Compatibility: Standard Samtec Header Systems Electrical Performance: High-Reliability Signal Interconnection Mechanical Durability: High Mating Cycle Life Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: Embedded Systems, Industrial Control Equipment, Communication Systems, Data Acquisition Platforms, Instrumentation, Test Equipment, Computing Hardware, PCB Interconnect Solutions Key Features High-density dual-row socket configuration Precision-machined contacts for reliable electrical performance Gold-plated contact interface for enhanced conductivity and durability Compact footprint for space-constrained designs Excellent mating alignment and retention characteristics High mechanical durability for repeated insertion cycles Suitable for board stacking and mezzanine interconnections Compatible with a wide range of Samtec header connectors Designed for industrial and commercial electronic systems Supports reliable signal transmission in high-performance applications #SFM10502XDA #Samtec #BoardToBoardConnector #SocketConnector #DualRowConnector #PCBConnector #Interconnect #EmbeddedSystems #IndustrialElectronics #CommunicationSystems #Instrumentation #DataAcquisition #MezzanineConnector #ThroughHoleConnector #ElectronicComponents #PCBDesign #SignalIntegrity #HighReliability #ConnectorTechnology #EmbeddedHardware