Connector Header Through Hole 10 position 0.050" pin header 2x5 1.27mm The Harwin M50-3500542 is a 1.27 mm pitch (0.05") 2×5 male pin header from the Harwin Archer M50 series, designed for board-to-board or cable-to-board interconnections. It is a through-hole, vertical PCB connector commonly used in embedded systems, debug interfaces (SWD/JTAG), and compact electronics where high-density signal routing is required. This connector provides a reliable low-profile interconnect solution with gold-plated contacts for good signal integrity and durability in industrial environments. Key Features Connector Type 2×5 (10-position) male pin header Dual-row configuration Pitch 1.27 mm (0.05") fine pitch for high-density PCB layouts Mounting Type Through-hole vertical PCB mount Contact Type Male square pins (0.4 mm typical) Electrical Rating Up to 1A per contact Contact Plating Gold plated mating area Tin plated tail for soldering Operating Temperature -40 °C to +105 °C Housing Material High-temperature thermoplastic (UL94 V-0 rated) Stacking / Mating Heights Multiple height options (approx. 3.2 mm to 6.2 mm) for flexible board stacking Compact Design Designed for high-density embedded PCB layouts Typical Applications ARM Cortex SWD / JTAG debug headers Embedded development boards Board-to-board mezzanine connections Industrial control electronics Compact IoT and MCU systems #CommonPartsLibrary #Connector #Header

BergStak 0.40mm, 100 position, Receptacle, 4mm stack height 100 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold 10164227-1004A1RLF is a high-density board-to-board mezzanine connector from Amphenol ICC (FCI), part of the BergStak® 0.40 mm series. It is designed for compact electronic systems that require reliable high-speed signal interconnection between stacked PCBs. This component is a 100-position, surface-mount receptacle connector with center strip contacts. It uses a 0.40 mm pitch to support very high pin density in a small footprint. It is commonly used in applications like smartphones, industrial modules, embedded computing, and other space-constrained electronic assemblies. Key Features 100 positions for high-density signal routing 0.40 mm fine pitch for compact PCB designs Board-to-board mezzanine (receptacle type) Surface-mount (SMT) mounting for automated assembly Center strip contact design for stable mating Gold-plated contacts for improved conductivity and corrosion resistance Mated stacking height around 4 mm Low-profile design suitable for thin electronic devices Typical Applications Smartphones and mobile devices Wearable electronics Industrial control modules Embedded computing boards Communication and networking equipment #AmphenolICC #FCI #BergStak #BoardToBoardConnector #MezzanineConnector #0_40mmPitch #SurfaceMount #HighDensityConnector #100PositionConnector #ElectronicsComponents

8 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold The TE Connectivity part 2386586-1 is a fine-pitch board-to-board (BTB) PCB receptacle connector designed for compact, high-density electronic devices. It is a vertical surface-mount connector with 8 positions and a 0.4 mm pitch, commonly used in portable electronics, embedded systems, and space-constrained PCB designs. Key Features Connector Type: PCB mount receptacle Connector System: Board-to-board (BTB) Positions: 8-pin Pitch: 0.4 mm fine pitch Rows: 2 Mounting Style: Surface mount (SMT) Orientation: Vertical Stack Height: 0.8 mm low-profile design Contact Plating: Gold (Au) Contact Material: Copper alloy Rated Current: 0.5 A max per contact Operating Voltage: 60 VDC Temperature Range: −40 °C to +85 °C Housing Material: High-temperature thermoplastic Application: Signal transmission in compact electronics Packaging: Tape & Reel for automated assembly This connector is optimized for: Compact embedded systems Wearables and handheld devices High-density PCB stacking Consumer electronics Low-profile modular designs

JST SM04B-SRSS-TB(LF)(SN) is a 4-position, 1.0 mm pitch, right-angle surface-mount JST SH PCB connector commonly used for STEMMA QT and Qwiic I²C connections. Keywords: SM04B-SRSS-TB, JST SH, 4-pin connector, 1.0mm pitch, STEMMA QT Qwiic The SM04B-SRSS-TB (LF)(SN) is a JST SH/SR series 4-position wire-to-board connector header designed for compact, high-density PCB applications. It features a 1.0 mm pitch, right-angle surface-mount (SMT) design, and a shrouded housing for secure mating and alignment. This connector is commonly used in space-constrained electronic devices where reliable signal transmission and low-profile mounting are required, such as in consumer electronics, industrial control boards, and embedded systems. It mates with compatible JST SH series housings, providing a secure push-fit connection for crimped wire assemblies. Key Features 4-position (1x4) wire-to-board connector header 1.0 mm fine pitch for compact PCB layouts Surface-mount (SMT), right-angle configuration Shrouded design for improved alignment and protection Rated current: 1 A per contact Rated voltage: 50 V AC/DC Low-profile height (~2.9 mm) Tin-plated contacts for reliable conductivity Operating temperature: -25°C to +85°C Compatible with JST SH/SR series mating housings Tape-and-reel packaging for automated PCB assembly #CommonPartsLibrary #Connector #JST #SM04BSRSSTB #SHSeries #SRSeries #WireToBoard #1mmPitch #SMTConnector #PCBConnector #ElectronicsComponents #ConnectorHeader

0.35 BB CONN. H=0.6 SSB6 RP REC ASSY 5050660622 is a 6-position board-to-board (mezzanine) receptacle connector from the Molex SlimStack™ Armor 505066 Series. It is designed for compact electronic devices where a very low-profile connection between two PCBs is required. The connector features a fine 0.35 mm pitch, 0.60 mm mated height, and surface-mount termination, making it suitable for smartphones, wearables, IoT devices, cameras, and other space-constrained applications. Key Features 6 circuits (contacts) for board-to-board interconnection. 0.35 mm pitch for high-density PCB designs. Ultra-low 0.60 mm mated height to minimize product thickness. 2-row connector configuration for efficient space utilization. Surface-mount (SMT) mounting for automated assembly. Armor Nail design improves solder joint strength and mechanical retention. Gold-plated contacts for reliable electrical performance and corrosion resistance. 50 V AC/DC voltage rating. Up to 0.3 A per contact current rating. Operating temperature range: -40°C to +85°C. Liquid Crystal Polymer (LCP) housing for high heat resistance during reflow soldering. 30 mating cycle durability. Typical Applications Smartphones and tablets Wearable devices Wireless modules Portable medical devices Cameras and imaging equipment Compact consumer electronics #CommonPartsLibrary #Connector