Connector Header Through Hole 4 position 0.100" (2.54mm) UART header 1x4 2.54mm Single-row, through-hole male pin header with 4 positions and 2.54 mm pitch. Designed for board-to-wire or board-to-board interconnect applications such as UART interfaces. Mechanical Specifications Number of Positions: 4 Number of Rows: 1 Pitch: 2.54 mm (0.100") Mounting Style: Through Hole Mounting Angle: Straight (Vertical) Contact Gender: Male (Pin) Termination Type: Solder Pin Housing Material: Polybutylene Terephthalate (PBT) Housing Color: Black Electrical Specifications Current Rating: 4.3 A – 6.3 A (per pin, depending on conditions) Voltage Rating: 450 VAC – 550 VAC Contact Resistance: (Typical for series, not specified exact) Insulation Resistance: (Not specified) Material & Plating Contact Material: Phosphor Bronze Contact Plating: Gold Flammability Rating: UL94 V-0 Environmental & Compliance RoHS Compliance: Yes Country of Origin: USA Packaging Packaging Type: Bulk Factory Pack Quantity: 1 Series Information Series: TSW (Samtec Pin Strip Header Series) Product Type: Headers & Wire Housings Typical Applications UART / Serial communication headers Microcontroller programming interfaces General-purpose 2.54 mm interconnects Prototyping and development boards #commonpartslibrary #connector

11 Position Connector Receptacle, Outer Shroud Contacts Surface Mount Gold or Gold, GXT™ 91921-31111LF is a 1.00 mm pitch board-to-board mezzanine connector from the Conan™ / MezzSelect™ series by Amphenol ICC. It is an 11-position vertical receptacle designed for compact, high-density PCB interconnect applications such as embedded systems, industrial electronics, and compact computing devices. Key Features 1.00 mm fine-pitch board-to-board connector 11-position vertical receptacle Surface-mount (SMT) termination Dual-row configuration Gold/GXT™ contact plating for reliable electrical performance Multiple stacking height support (4.15 mm to 7.52 mm) Solder retention tabs for improved mechanical stability Operating temperature range: −55 °C to +125 °C Current rating: 1 A per contact Designed for industrial and compact embedded applications Compatible with IR reflow and vapor-phase soldering processes RoHS compliant and low-halogen material construction Typical Applications Embedded computing modules Industrial control boards Compact SBCs and SOMs Communication equipment Consumer electronics requiring low-profile mezzanine interconnects

24 Position Connector Header, Center Strip Contacts Surface Mount Gold The AXT424124 is a Panasonic P4S series 0.4 mm pitch board-to-board / board-to-FPC connector, specifically a 24-position surface-mount header designed for compact, high-density electronic assemblies. It is commonly used in mobile devices and industrial equipment where space saving and reliable fine-pitch interconnection are required. This connector belongs to Panasonic’s P4S narrow-pitch interconnect family, optimized for very small pitch stacking (0.4 mm) and low-profile designs. It supports mating with a corresponding socket connector to form a mezzanine-style board connection. Key Features Ultra-fine pitch: 0.4 mm for high-density PCB layouts 24-pin dual-row header configuration Board-to-board / board-to-FPC compatibility Low profile design with ~1.5 mm mating height option Space-saving construction for compact electronics High reliability “TOUGH CONTACT” design for stable electrical connection Gold-plated contacts for improved conductivity and corrosion resistance Current rating: ~0.3 A per pin (total limited) Dielectric strength: 150 V AC Insulation resistance: ≥ 1000 MΩ Insertion life: ~50 mating cycles Surface-mount (SMD) termination for automated PCB assembly Typical Applications Smartphones and portable consumer electronics Industrial control modules Compact embedded systems Wearable devices and space-constrained PCBs #Panasonic #AXT424124 #P4SSeries #BoardToBoardConnector #FPCConnector #0.4mmPitch #SMDConnector #MezzanineConnector #HighDensityPCB #ElectronicComponents

Connector Header Through Hole 12 position 0.100" (2.54mm) The TSW-106-07-F-D is a double-row, through-hole vertical header from Samtec’s TSW series, designed for board-to-board or wire-to-board interconnections. It features a standard 2.54 mm pitch with 12 total contacts arranged in two rows of six positions. This connector is commonly used in prototyping, embedded systems, and general-purpose PCB applications where reliable and cost-effective interconnect solutions are required. Applications PCB prototyping Embedded systems Mezzanine board connections Development boards General-purpose interconnects Mating Compatibility Compatible with standard 2.54 mm pitch female headers and sockets Works with IDC connectors and jumper wires #commonpartslibrary #connector #header

Connector Header Through Hole 6 position 0.100" (2.54mm) The TSW-106-06-T-S is a through-hole, single-row, 6-position header from Samtec’s TSW series, designed for board-to-board or wire-to-board interconnections. It features a standard 2.54 mm (0.100") pitch and utilizes square posts for reliable mating with female sockets or IDC connectors. This header is commonly used in prototyping, development boards, and general-purpose PCB designs requiring robust and cost-effective interconnect solutions. Key Features Single-row vertical header 6 positions (1x6 configuration) Standard 2.54 mm pitch spacing Through-hole mounting for strong mechanical retention Tin-plated contacts for cost efficiency Square post design for reliable electrical contact Compatible with a wide range of mating connectors Electrical Characteristics Current Rating: ~3 A per contact (typical, depending on application) Contact Resistance: ≤ 10 mΩ (initial) Insulation Resistance: ≥ 1000 MΩ Withstanding Voltage: ~500 VAC Mechanical Characteristics Number of Positions: 6 Rows: 1 Pitch: 2.54 mm (0.100") Mounting Type: Through-hole Contact Type: Male pin (square post) Post Length Style: Standard (06) Tail Length: ~3.18 mm (0.125") typical Mating Pin Size: ~0.64 mm square Material and Plating Contact Material: Phosphor Bronze Plating: Tin over Nickel Insulator Material: Glass-filled thermoplastic (UL94 V-0 rated) Environmental Specifications Operating Temperature Range: -55°C to +105°C RoHS Compliant: Yes Lead-Free: Yes Applications PCB prototyping and development boards Embedded systems and microcontroller headers Board-to-board connections General-purpose signal connections Packaging Typically supplied in bulk or tube packaging depending on order quantity #commonpartslibrary #connector #header

Connector Header Through Hole 10 position 0.050" pin header 2x5 1.27mm The Harwin M50-3500542 is a 1.27 mm pitch (0.05") 2×5 male pin header from the Harwin Archer M50 series, designed for board-to-board or cable-to-board interconnections. It is a through-hole, vertical PCB connector commonly used in embedded systems, debug interfaces (SWD/JTAG), and compact electronics where high-density signal routing is required. This connector provides a reliable low-profile interconnect solution with gold-plated contacts for good signal integrity and durability in industrial environments. Key Features Connector Type 2×5 (10-position) male pin header Dual-row configuration Pitch 1.27 mm (0.05") fine pitch for high-density PCB layouts Mounting Type Through-hole vertical PCB mount Contact Type Male square pins (0.4 mm typical) Electrical Rating Up to 1A per contact Contact Plating Gold plated mating area Tin plated tail for soldering Operating Temperature -40 °C to +105 °C Housing Material High-temperature thermoplastic (UL94 V-0 rated) Stacking / Mating Heights Multiple height options (approx. 3.2 mm to 6.2 mm) for flexible board stacking Compact Design Designed for high-density embedded PCB layouts Typical Applications ARM Cortex SWD / JTAG debug headers Embedded development boards Board-to-board mezzanine connections Industrial control electronics Compact IoT and MCU systems #CommonPartsLibrary #Connector #Header

Connector Header Through Hole 6 position 0.100" (2.54mm) The 640456-6 is a 6-position, single-row wire-to-board header connector from TE Connectivity (AMP series), designed for reliable power and signal connections in a wide range of electronic applications. It features a 2.54 mm pitch and through-hole mounting for strong mechanical retention and ease of assembly. The connector is commonly used with matching crimp housings and terminals, providing a secure and serviceable interconnect solution for PCB-based systems. Key Features 6-position (1x6) header connector 2.54 mm pitch spacing Through-hole mounting (THT) Vertical (top-entry) orientation Friction-lock compatible with mating housings Tin-plated contacts for good conductivity and corrosion resistance Durable thermoplastic housing Mechanical Characteristics Mounting Type: Through Hole Orientation: Vertical (Top Entry) Pitch: 2.54 mm Number of Positions: 6 Row Configuration: Single row Mating Type: Friction fit with compatible housing Termination Type: Solder tails Electrical Characteristics Rated Current: Up to 3 A per contact (depending on wire gauge) Rated Voltage: 250 V AC/DC Contact Resistance: ≤ 20 mΩ (initial) Insulation Resistance: ≥ 1,000 MΩ Dielectric Withstanding Voltage: 1,000 VAC Material Specifications Housing: Thermoplastic, UL94V-0 rated Contacts: Copper alloy Contact Plating: Tin over nickel Environmental Specifications Operating Temperature Range: -40°C to +105°C Storage Temperature: -40°C to +105°C Packaging Information Packaging Type: Bulk or tray (varies by supplier) RoHS Compliant: Yes Lead-Free: Yes Compatible Components Mating Housing: TE Connectivity compatible crimp housings (e.g., AMP series) Crimp Terminals: соответствующие crimp contacts for 2.54 mm systems Typical Applications PCB interconnects Consumer electronics Industrial control systems Power and signal distribution Prototyping and development boards #CommonPartsLibrary #Connector #Header #Male-pins #MTA-100

Pin Headers 2.54-2*2P立贴针 HDR-SMD_4P-P2.54-V-M-R2-C2-LS7.5 LCSC Part Number: C919361 JLCPCB Part Class: Extended Part Manufactured by BOOMELE(博穆精密) 2.54mm dual-row through-hole pin header, straight vertical PCB mount, 0.64mm square pins, 2.54mm pitch, double-row male connector, brass contacts with tin-over-nickel plating, black UL94V-0 polyester insulator, rated 3A per contact, 500VAC dielectric withstand voltage, 20mΩ maximum contact resistance, 1000MΩ minimum insulation resistance, operating temperature -40°C to +105°C (tin plated), suitable for board-to-board connections, IDC cable connectors, development boards, industrial electronics and general PCB interconnect applications. Search Keywords: 2.54mm pin header, dual row pin header, 2xN pin header, 2.54mm male header, through hole header, THT pin header, vertical pin header, straight pin header, 0.64mm square pin header, double row header connector, IDC header, PCB header connector, 2x5 pin header, 2x10 pin header, 2x20 pin header, 2.54mm box header alternative, PA6T pin header Hashtags: #2p54PinHeader #DualRowHeader #MalePinHeader #THTHeader #ThroughHoleHeader #VerticalPinHeader #StraightPinHeader #254mmPitch #DoubleRowConnector #BoardToBoardConnector #IDCHeader #PCBConnector #SquarePinHeader #PinHeader2xN #ElectronicsConnector

WR-PHD 2.54 mm Pin Header 12 pins, 1 row, straight, gold plating Connector Header Through Hole 12 position 0.100" (2.54mm) Ang 61301211121 ay isang vertical through-hole male pin header connector mula sa Würth Elektronik under ng WR-PHD series. Ito ay isang 12-position, 2.54 mm pitch unshrouded header na karaniwang ginagamit para sa board-to-board at wire-to-board connections sa embedded at industrial electronics. Key Features 12-position single-row male pin header 2.54 mm (0.1") standard pitch Through-hole vertical mounting Gold-plated copper alloy contacts Unshrouded design 3 A current rating 250 V voltage rating UL94 V-0 flame-retardant housing Operating temperature: −40 °C to +105 °C Compatible for board-to-board or cable interconnect applications Solder termination type #CommonPartsLibrary #Connector

I-PEX MHF4 Connector Receptacle, Male Pin 50 Ohms Surface Mount Solder The 20449-001E-03 is an ultra-miniature MHF4 RF coaxial receptacle connector from I-PEX designed for high-frequency wireless applications such as Wi-Fi, Bluetooth, LTE, GNSS, and cellular antenna connections in compact electronic devices. It is a surface-mount RF connector optimized for miniature coaxial cable assemblies and high-density PCB layouts. Key Features Ultra-small MHF4 RF coaxial receptacle Supports frequencies up to 9 GHz Characteristic impedance: 50 Ω Surface-mount (SMT) PCB mounting Snap-on mating mechanism Compact footprint for space-constrained designs Gold-plated center contact for improved conductivity and corrosion resistance Uses: MHF4 compatible RF cables and antenna assemblies High-reliability micro RF interconnect Operating temperature: −40°C to +90°C Rated voltage: 60 V Approximate mating cycle rating: 30 cycles Constructed with: Brass contacts LCP (Liquid Crystal Polymer) dielectric material RoHS compliant Typical Applications Wi-Fi modules LTE/5G modules GNSS/GPS antennas Bluetooth devices IoT devices Embedded wireless systems Compact handheld electronics RF communication modules

IC RF TxRx + MCU Bluetooth Bluetooth v5.3 2.4GHz 48-VFQFN Exposed Pad NRF52832-QFAA-R7 is an ultra-low-power wireless System-on-Chip (SoC) from Nordic Semiconductor, designed for Bluetooth Low Energy (BLE), ANT, NFC, and proprietary 2.4 GHz wireless applications. It integrates a high-performance ARM Cortex-M4F processor, memory, peripherals, and a 2.4 GHz radio into a single chip, making it ideal for IoT devices, wearables, wireless sensors, beacons, and smart peripherals. GHz protocols • 2.4 GHz transceiver • -96 dBm sensitivity in Bluetooth® low energy mode • Supported data rates: 1 Mbps, 2 Mbps Bluetooth® low energy mode • -20 to +4 dBm TX power, configurable in 4 dB steps • On-chip balun (single-ended RF) • 5.3 mA peak current in TX (0 dBm) • 5.4 mA peak current in RX • RSSI (1 dB resolution) • ARM® Cortex®-M4 32-bit processor with FPU, 64 MHz • 215 EEMBC CoreMark® score running from flash memory • 58 μA/MHz running from flash memory • 51.6 μA/MHz running from RAM • Data watchpoint and trace (DWT), embedded trace macrocell (ETM), and instrumentation trace macrocell (ITM) • Serial wire debug (SWD) • Trace port • Flexible power management • 1.7 V–3.6 V supply voltage range • Fully automatic LDO and DC/DC regulator system • Fast wake-up using 64 MHz internal oscillator • 0.3 μA at 3 V in System OFF mode • 0.7 μA at 3 V in System OFF mode with full 64 kB RAM retention • 1.9 μA at 3 V in System ON mode, no RAM retention, wake on RTC • Memory • 512 kB flash/64 kB RAM • 256 kB flash/32 kB RAM • Nordic SoftDevice ready • Support for concurrent multi-protocol • Type 2 near field communication (NFC-A) tag with wakeup-on-field and touchto-pair capabilities • 12-bit, 200 ksps ADC - 8 configurable channels with programmable gain • 64 level comparator • 15 level low power comparator with wakeup from System OFF mode • Temperature sensor • 32 general purpose I/O pins • 3x 4-channel pulse width modulator (PWM) unit with EasyDMA • Digital microphone interface (PDM) • 5x 32-bit timer with counter mode • Up to 3x SPI master/slave with EasyDMA • Up to 2x I2C compatible 2-wire master/slave • I2S with EasyDMA • UART (CTS/RTS) with EasyDMA • Programmable peripheral interconnect (PPI) • Quadrature decoder (QDEC) • AES HW encryption with EasyDMA • Autonomous peripheral operation without CPU intervention using PPI and EasyDMA • 3x real-time counter (RTC) • Single crystal operation • Package variants • QFN48 package, 6 × 6 mm • WLCSP package, 3.0 × 3.2 mm #CommonPartsLibrary #IntegratedCircuit

CONN HEADER SMD R/A 3POS 1.25mm The SM03B-GHS-TB(LF)(SN) is a 3-pin, surface-mount, right-angle header connector that mates with JST GH-series wire housings. It provides a reliable, low-profile connection between a PCB and external wires using a crimp-style mating system. It belongs to the JST GH series, known for fine-pitch, compact connectors optimized for miniaturized electronics. 3-position connector (signal/power lines) 1.25 mm pitch for high-density PCB layout Surface-mount, right-angle (horizontal) mounting Shrouded header design for secure mating and alignment Locking ramp mechanism to prevent accidental disconnection Tin-plated contacts for reliable conductivity Lead-free / RoHS compliant (LF/SN finish) Current rating: ~1 A typical Voltage rating: ~50 V Operating temperature: approx. -25 °C to +85 °C 📦 Typical Applications Consumer electronics (wearables, IoT devices) Industrial control modules Robotics and sensor interfaces Battery-powered embedded systems Compact PCB interconnect systems #CommonPartsLibrary #Connector

Connector Header Through Hole 6 position 0.100" Pin Header 1x06 2.54mm PinHeader 1x6 2.54mm The TSW-106-07-G-S is a through-hole vertical header designed for board-to-board and board-to-wire interconnection in electronic systems. It is part of a precision connector series known for high reliability, consistent mechanical alignment, and excellent electrical performance. The component is commonly used in applications requiring modular connectivity, prototyping flexibility, and secure signal routing between printed circuit boards or peripheral interfaces. Its design supports repeated mating cycles while maintaining stable contact integrity, making it suitable for both development and production environments. Functional Description This component functions as a single-row header that provides a direct electrical interface between a printed circuit board and a mating connector or cable assembly. It enables straightforward signal or power routing through plated pins that are soldered into the PCB. The vertical orientation allows perpendicular mating, supporting compact and efficient board layouts. The connector is designed to ensure proper alignment and retention during mating, reducing the risk of intermittent connections. Electrical Characteristics The header supports low-voltage signal transmission and moderate current levels typical of board-level interconnects. It offers low contact resistance to maintain signal integrity and efficient current flow. The contact system is designed to provide consistent electrical performance across repeated insertions, ensuring reliability in both signal and power applications. Mechanical Characteristics The component features a robust insulating housing that maintains pin alignment and structural integrity during handling and operation. The contact pins are fabricated from conductive material and plated to enhance durability, conductivity, and مقاومت to corrosion. The through-hole mounting style provides strong mechanical anchoring to the printed circuit board, improving resistance to mechanical stress and vibration. The design supports reliable mating with compatible connectors and ensures long service life. Environmental Characteristics The TSW-106-07-G-S is constructed using materials that provide stable performance under typical environmental conditions encountered in electronic assemblies. It is designed to withstand standard temperature ranges and environmental stresses such as humidity and mechanical handling, maintaining electrical and mechanical reliability over time. Applications This header is widely used in embedded systems, industrial electronics, development platforms, communication equipment, and general-purpose PCB interconnect applications. It is especially suited for designs requiring modular connectivity, easy assembly, and dependable signal transfer. Summary The TSW-106-07-G-S from Samtec is a reliable through-hole header solution that combines mechanical durability with stable electrical performance. Its straightforward design, compatibility with standard interconnect systems, and suitability for a wide range of applications make it a common choice for board-level connectivity in modern electronic designs. #CommonPartsLibrary #Connector #Header #TSW

CONN HEADER TH 8POS 2.5mm 2.54mm-8P ZZ is a through-hole wire-to-board header connector from the XH-style connector family. It features a single-row 8-position configuration with approximately 2.5 mm pitch spacing, making it suitable for power and signal connections in consumer electronics, industrial controls, LED modules, battery systems, and embedded electronics. The connector is designed for PCB mounting and provides a reliable, low-cost interconnect solution for cable assemblies. Key Features Single-row 8-position (1×8) connector 2.5 mm / 2.54 mm pitch wire-to-board interface Through-hole PCB mounting Compatible with XH-series style housings Rated up to 3 A current Rated up to 250 V Tin-plated brass contacts for reliable conductivity UL94V-0 flame-retardant housing material Operating temperature range: -25°C to +85°C Suitable for power distribution and signal connections in electronic equipment Hashtags #Connector #WireToBoard #XHConnector #2_54mmPitch #ThroughHole #PCBConnector #8PinConnector #ElectronicComponents #Interconnect #EmbeddedSystems #IndustrialElectronics #PowerConnector #SignalConnector #RoHSCompliant

PM254-2-10-Z-8.5 is a through-hole pin header connector designed for reliable board-to-wire or board-to-board interconnection in electronic and embedded systems. The connector features a durable thermoplastic housing with metal contact terminals engineered for stable electrical conductivity, mechanical strength, and long-term reliability in industrial and consumer electronic applications. This connector series is commonly used in power distribution, signal routing, module interfacing, and PCB expansion applications where secure and removable connections are required. Its standardized pin spacing and vertical mounting configuration support compatibility with a wide range of mating connectors, jumper systems, and cable assemblies. The PM254-2-10-Z-8.5 connector is suitable for automated assembly processes and provides dependable performance in embedded controllers, development boards, industrial automation equipment, communication systems, and general-purpose electronic hardware. The robust contact structure ensures stable connectivity under repeated insertion cycles and varying environmental conditions. #commonpartslibrary #connector #pinheader #interconnect #throughhole #embeddedhardware #electronicscomponents #pcbdesign #industrialelectronics #boardtoboardconnector

77 (55 + 22 Ground) Position Header, Male Pins Connector 0.079" (2.00mm) Through Hole The 5106081‑1 is a high-reliability male PCB connector manufactured by TE Connectivity. It belongs to the Z‑PACK 2 mm HM Series, designed for mezzanine and backplane board-to-board interconnects. The connector features precision-machined phosphor bronze contacts with tin plating, ensuring consistent electrical conductivity, low contact resistance, and long-term reliability. The device has a through-hole press-fit termination style for robust mechanical attachment to printed circuit boards and optimal compatibility with automated assembly processes. Its vertical orientation and standardized 2 mm pitch allow compact, high-density PCB layouts while maintaining reliable alignment and mating with compatible female headers. The connector is engineered to support repeated insertion cycles, high signal integrity, and consistent electrical performance in industrial, telecommunications, and embedded electronic applications. General Description The 5106081‑1 is a durable, 77-position male PCB connector intended for high-density board-to-board interconnect solutions. It provides secure electrical connections, mechanical stability, and long-term reliability in demanding electronic systems. Widely used in industrial automation, telecommunications, and embedded computing, this connector ensures precise mating, easy PCB integration, and robust operation in backplane and mezzanine applications. Its press-fit through-hole design, reliable contact material, and standardized footprint make it a versatile solution for complex multi-board electronic assemblies. #TEConnectivity #PCBConnector #MaleHeader #BoardToBoard #ZPACK #2mmPitch #HighDensityInterconnect #ThroughHole #PressFit #IndustrialElectronics #Telecommunications #EmbeddedSystems #ElectricalEngineering #ReliableConnection #EngineeringSpec #ElectronicConnector #HighPerformanceConnector

Headers & Wire Housings PICOFLEX 10P HDR LOPRO SN Connector Header Through Hole 10 position 0.050" (1.27mm) The 0903250010 is a 10-position vertical through-hole header connector from the Picoflex PF-50 series by Molex. It features a 1.27 mm pitch, straight orientation, and is designed for reliable board-to-cable interconnections in compact electronic equipment. The connector is commonly used with Picoflex ribbon cable assemblies in industrial, consumer, telecommunications, and embedded electronic applications. It provides a space-saving solution while maintaining dependable electrical and mechanical performance. Key Features 10 contacts (single-row configuration) 1.27 mm (0.050") contact pitch Vertical (straight) through-hole mounting Male header design Compatible with Molex Picoflex cable connectors Current rating up to 1.2 A per contact Voltage rating up to 250 V Operating temperature range: -40°C to +105°C Low contact resistance (15 mΩ max) High insulation resistance (1000 MΩ min) RoHS compliant Compact footprint for high-density PCB designs Suitable for signal and low-power applications #CommonPartsLibrary #0903250010 #Molex #Picoflex #Connector #HeaderConnector #ThroughHole #PCBConnector #BoardToCable #Interconnect #Electronics #EmbeddedSystems #IndustrialElectronics #RibbonCable #1_27mmPitch #ElectronicComponents

Connector Header Surface Mount 12 position 0.049" (1.25mm) 53398-1271 The 0533981271 is a board-to-wire connector assembly component designed to provide a reliable electrical and mechanical interface between a printed circuit board and discrete wire harnesses. It belongs to a compact connector system intended for applications requiring secure mating, efficient signal transmission, and ease of assembly. The component is engineered to support consistent electrical contact performance while maintaining a small footprint suitable for space-constrained designs. Its construction ensures dependable connectivity under typical operating conditions encountered in consumer electronics, industrial equipment, and embedded systems. Functional Description This connector component serves as part of a modular interconnect system, enabling termination of wires and subsequent mating to a corresponding board-mounted header. It provides stable retention and alignment during mating and unmating operations, ensuring consistent electrical continuity. The design supports straightforward integration into automated or manual assembly processes, facilitating efficient production workflows. Contact geometry and housing features are optimized to maintain reliable engagement and minimize the risk of intermittent connections. Electrical Characteristics The component is designed to support low-voltage signal and power transmission in compact electronic systems. It provides low contact resistance to ensure efficient current flow and stable signal integrity. Insulation materials are selected to maintain dielectric performance and prevent leakage under normal operating conditions. The connector system is suitable for typical electronic applications where consistent and reliable electrical performance is required. Mechanical Characteristics The connector features a durable housing constructed from engineered thermoplastic material, providing mechanical strength and resistance to environmental stress. Contact elements are formed from conductive alloys and finished to enhance conductivity and corrosion resistance. The design includes features that promote secure mating retention and proper alignment, reducing wear and ensuring longevity over repeated use. Its compact form factor supports high-density layouts on printed circuit boards. Environmental Characteristics The component is designed to operate reliably within standard environmental conditions encountered in electronic equipment. Materials used in the housing and contacts are selected for thermal stability and resistance to common environmental factors such as humidity and mechanical vibration. The connector system maintains performance over typical temperature ranges associated with consumer and industrial applications. Applications This connector is intended for use in electronic systems requiring compact and reliable wire-to-board interconnection. Common applications include consumer devices, industrial control systems, embedded modules, and communication equipment where dependable signal or power connectivity is essential. Summary The 0533981271 from Molex is a compact and reliable connector solution for board-to-wire applications. It offers consistent electrical performance, robust mechanical design, and ease of integration, making it well suited for modern electronic assemblies requiring dependable interconnect solutions. #commonpartslibrary #connector #header

System On Chip (SOC) IC It integrates multiple processing units including CPUs, DSPs, AI accelerators, and GPU into a single chip to handle vision processing, deep learning, sensor fusion, and real-time control in automotive and industrial systems. • C7x floating point, vector DSP, up to 1.0GHz, 80 GFLOPS, 256 GOPS • Deep-learning matrix multiply accelerator (MMA), up to 8 TOPS (8b) at 1.0GHz • Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators • Depth and Motion Processing Accelerators (DMPAC) • Dual 64-bit Arm® Cortex®-A72 microprocessor subsystem at up to 2.0GHz – 1MB shared L2 cache per dual-core Cortex®- A72 cluster – 32KB L1 DCache and 48KB L1 ICache per Cortex®-A72 core • Six Arm® Cortex®-R5F MCUs at up to 1.0GHz – 16K I-Cache, 16K D-Cache, 64K L2 TCM – Two Arm® Cortex®-R5F MCUs in isolated MCU subsystem – Four Arm® Cortex®-R5F MCUs in general compute partition • Two C66x floating point DSP, up to 1.35GHz, 40GFLOPS, 160GOPS • 3D GPU PowerVR® Rogue 8XE GE8430, up to 750MHz, 96GFLOPS, 6Gpix/sec • Custom-designed interconnect fabric supporting near max processing entitlement Memory subsystem: • Up to 8MB of on-chip L3 RAM with ECC and coherency – ECC error protection – Shared coherent cache – Supports internal DMA engine • External Memory Interface (EMIF) module with ECC – Supports LPDDR4 memory types – Supports speeds up to 4266MT/s – 32-bit data bus with inline ECC • General-Purpose Memory Controller (GPMC) • 512KB on-chip SRAM in MAIN domain, protected by ECC #CommonPartsLibrary #IntegratedCircuit

8 Position FFC, FPC Connector Contacts, Bottom 0.039" (1.00mm) Surface Mount, Right Angle The Molex Easy-On connector is a compact surface-mount FPC/FFC interconnect solution designed for reliable board-to-cable connections in space-constrained electronic systems. Featuring a bottom-contact configuration with a flip-lock actuator, it provides secure retention of flexible printed circuits while supporting repeated insertion and removal cycles. Its low-profile construction and robust locking mechanism make it suitable for consumer electronics, industrial controls, embedded systems, displays, and portable devices where dependable signal transmission and compact form factors are required. Engineering Specifications Manufacturer: Molex Series: Easy-On FD19 Part Number: 2005280080 Connector Type: FFC/FPC Connector Contact Configuration: Bottom Contact Actuator Type: Flip-Lock ZIF Mounting Style: Surface Mount Orientation: Right Angle Circuit Count: Eight Positions Pitch: One Millimeter Cable Type: Flexible Flat Cable / Flexible Printed Circuit Contact Material: Copper Alloy Contact Finish: Gold over Nickel Housing Material: High-Temperature Thermoplastic Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Halogen Free: Yes Application Areas: LCD Interfaces, Touch Panels, Embedded Electronics, Industrial Equipment, Portable Devices, Consumer Electronics #Molex #EasyOn #FD19 #FFCConnector #FPCConnector #FlipLock #BottomContact #ZIFConnector #SMTConnector #ElectronicComponents #Interconnect #PCBDesign #EmbeddedSystems #DisplayInterface #IndustrialElectronics