Buck-Boost Switching Regulator IC Positive Adjustable 1.2V 1 Output 3.5A (Switch) 14-VFDFN Exposed Pad The TPS63020DSJT is a high-efficiency synchronous buck-boost DC-to-DC converter manufactured by Texas Instruments. This integrated power management device is designed to provide a stable regulated output voltage from input power sources that may vary above or below the desired output level. The converter automatically transitions between buck and boost operating modes to maintain efficient and continuous voltage regulation across a wide input range. The device integrates low-resistance power MOSFETs, advanced control circuitry, and high-efficiency switching architecture to minimize power loss and optimize battery utilization in portable electronic systems. It is widely used in battery-powered applications, embedded systems, wireless communication devices, portable instrumentation, industrial electronics, and USB-powered hardware requiring compact and reliable voltage regulation. The TPS63020DSJT is optimized for systems powered by single-cell lithium-ion, lithium-polymer, or multi-cell alkaline battery configurations. Its compact package and integrated functionality reduce external component count and simplify PCB layout while delivering high power conversion efficiency and low quiescent current performance. Engineering Specification Device Type Synchronous buck-boost DC-to-DC converter Power Conversion Topology Automatic buck and boost regulation architecture Input Characteristics Supports input voltages above or below regulated output voltage Output Characteristics Stable regulated DC voltage output Switching Technology Integrated synchronous MOSFET switching architecture Efficiency Characteristics High-efficiency power conversion for battery-powered systems Control Features Automatic operating mode transition and load regulation Power Consumption Low quiescent current operation for portable electronics Thermal Characteristics Integrated thermal management and protection features Protection Features Overcurrent protection Thermal shutdown Undervoltage lockout Short-circuit protection Package Type WSON surface-mount package Mounting Style Surface mount technology Applications Portable electronics Battery-powered systems Embedded hardware Wireless communication devices USB-powered electronics Industrial control systems Portable instrumentation IoT devices Consumer electronics Power management systems Manufacturer Texas Instruments #commonpartslibrary #buckboostconverter #dcdcconverter #powermanagement #texasinstruments #powerelectronics #powersupply #embeddedhardware #portableelectronics #batterypowered #surfaceountcomponents #electronicsdesign #voltageregulator #iothardware #industrialelectronics

Buck-Boost Switching Regulator IC Positive Adjustable 2.5V 1 Output 2A 15-PowerVFQFN The TPS63070RNMT is a high-efficiency buck-boost DC-to-DC converter manufactured by Texas Instruments. This power management integrated circuit is designed to provide a stable regulated output voltage from input sources that may be above, below, or equal to the desired output voltage. The device automatically transitions between buck and boost operating modes to maintain efficient and continuous power delivery across varying supply conditions. The converter integrates low-resistance power MOSFETs and advanced control circuitry to achieve high conversion efficiency, low quiescent current, and compact implementation. It is widely used in battery-powered systems, portable electronics, embedded devices, industrial control systems, wireless communication equipment, and USB-powered applications requiring stable voltage regulation from fluctuating power sources. The TPS63070RNMT is optimized for applications demanding high power density, extended battery life, and reliable operation under dynamic load conditions. Its compact package and integrated functionality reduce external component count and simplify PCB design for modern power management architectures. Engineering Specification Device Type Synchronous buck-boost DC-to-DC converter Power Topology Automatic buck and boost mode operation Input Voltage Characteristics Supports input voltages above, below, or equal to output voltage Output Characteristics Regulated fixed or adjustable DC voltage output Switching Technology Integrated synchronous power MOSFET architecture Efficiency Characteristics High-efficiency power conversion across wide operating conditions Control Architecture Advanced PWM/PFM power regulation control Current Capability Designed for medium-to-high current portable power applications Quiescent Current Low standby current for battery-powered operation Thermal Characteristics Integrated thermal protection and efficient heat management Protection Features Overcurrent protection Thermal shutdown Undervoltage lockout Short-circuit protection Package Type VQFN surface-mount package Mounting Style Surface mount technology Applications Battery-powered electronics Portable devices USB-powered systems Industrial automation Embedded systems Wireless communication equipment IoT devices Portable instrumentation Power banks Single-cell battery applications Manufacturer Texas Instruments #commonpartslibrary #powermanagement #buckboostconverter #dcdcconverter #texasinstruments #powerelectronics #powersupply #embeddedhardware #portableelectronics #batterymanagement #surfaceountcomponents #electronicsdesign #voltageregulator #industrialelectronics #usbpower

The CPDT-12V is an electromechanical relay designed for switching and control applications in industrial, automotive, consumer, and embedded electronic systems. Operating from a nominal twelve-volt coil supply, this relay provides reliable isolation between low-power control circuitry and higher-power loads. Its compact construction, robust contact mechanism, and dependable switching performance make it suitable for power distribution, automation controls, battery-powered equipment, protection circuits, and general-purpose switching applications. The relay incorporates a magnetic coil and mechanical contact assembly that enables safe control of AC or DC loads while maintaining electrical isolation between the control and load sides. Its durable design supports repeated switching operations and long service life in demanding environments. Features Electromechanical relay with nominal twelve-volt coil operation Provides galvanic isolation between control and load circuits Suitable for AC and DC load switching Reliable contact performance for power and signal applications Compact package for PCB mounting Low control power requirement Durable contact system for long operational life Fast switching response characteristics Compatible with industrial and embedded control systems Designed for automation, protection, and power management circuits Applications Industrial automation equipment Power control modules Battery-powered systems Automotive electronics Home appliance control circuits Smart energy management devices Security and alarm systems Embedded controller interfaces Motor and actuator switching General-purpose load control applications Electrical Characteristics Nominal coil voltage: twelve volts DC Electromagnetic actuation mechanism Isolated contact structure Designed for low-voltage control interfaces Supports switching of resistive and inductive loads Stable operation across specified environmental conditions Mechanical Characteristics PCB-mount relay construction Compact footprint for space-constrained designs Durable housing for electrical and mechanical protection Secure terminal arrangement for reliable soldering and connection Engineered for repeated switching cycles Environmental Characteristics Suitable for indoor industrial and commercial environments Resistant to normal operating vibration and mechanical shock conditions Designed for reliable operation across standard electronic equipment temperature ranges #commonpartslibrary #relay #electromechanicalrelay #switchingdevice #powermanagement #industrialautomation #controlsystems #pcbmount #automationelectronics #circuitprotection #embeddedsystems #industrialelectronics

11-Channel Spectral Sensor Frontend The AS7341-DLGM is a multi-channel spectral sensor developed by ams OSRAM, designed for advanced color measurement, spectral analysis, and ambient light sensing applications. The device integrates multiple optical channels covering visible and near-infrared wavelengths, enabling precise detection of light characteristics across a broad spectrum. Its compact surface-mount package, integrated analog front-end, and digital processing capabilities make it suitable for consumer electronics, industrial instrumentation, smart lighting systems, display calibration, agricultural sensing, and portable analytical devices. The sensor features highly sensitive photodiodes combined with optical filters that allow accurate spectral discrimination. Communication is performed through a standard digital interface, facilitating integration with microcontrollers, embedded systems, and IoT platforms. The AS7341 supports configurable measurement modes, programmable gain control, and interrupt functions for efficient system-level implementation. Key Features Multi-channel spectral sensing architecture Visible and near-infrared light detection capability Integrated optical interference filters High-sensitivity photodiode array Ambient light sensing functionality Advanced color measurement and analysis Programmable gain and integration settings Digital output with I²C communication interface Low-power operating characteristics Integrated interrupt and event detection functions Compact surface-mount package Suitable for portable and battery-powered designs High accuracy across varying lighting conditions Supports spectral identification and classification applications Optimized for display, lighting, and environmental monitoring systems Applications Color measurement instruments Spectral analysis equipment Smart lighting control systems Display color calibration Industrial automation sensors Agricultural monitoring devices Ambient light sensing applications Consumer electronics Wearable devices IoT sensing platforms Scientific and laboratory instruments Optical monitoring systems Electrical and Functional Characteristics Multi-channel optical sensing engine Digital signal processing architecture Configurable integration timing Adjustable sensitivity and gain control Low-noise measurement performance High dynamic range operation Fast measurement response capability Integrated spectral filtering technology Embedded register-based configuration Interrupt-driven event monitoring support Mechanical Characteristics Compact surface-mount package PCB-friendly footprint RoHS-compliant construction Suitable for automated assembly processes Optimized optical window design #commonpartslibrary #sensor #opticalsensor #spectralsensor #colorsensor #ambientlightsensor #amsosram #embeddedsystems #industrialelectronics #iot #measurement #environmentalsensing #consumerelectronics #smartlighting #electronicsdesign

26 MHz ±10ppm Crystal 9pF 40 Ohms 4-SMD, No Lead # TSX-3225 26.0000MF09Z-AC0 ## General Description The TSX-3225 26.0000MF09Z-AC0 is a high-precision surface-mount quartz crystal manufactured by Seiko Epson Corporation. It is designed to provide a stable and accurate clock reference for microcontrollers, wireless communication modules, RF transceivers, processors, and other digital electronic systems. The crystal utilizes advanced quartz resonator technology to deliver reliable frequency generation with excellent stability, low phase noise, and long-term performance. Its compact package and low-profile construction make it suitable for space-constrained applications including Internet of Things devices, industrial control systems, wireless sensors, communication equipment, consumer electronics, and embedded computing platforms. ## Key Features ### Frequency Characteristics * Precision quartz crystal resonator * Stable frequency generation * Excellent frequency accuracy * Low frequency drift * Reliable long-term frequency stability * Suitable for clock generation and timing applications ### Electrical Characteristics * Low equivalent series resistance * Reliable oscillator startup performance * Stable operation with low-power oscillator circuits * Optimized for microcontroller and RF applications * Consistent electrical characteristics across operating conditions ### Mechanical Characteristics * Surface-mount package construction * Compact footprint design * Low-profile structure * Automated assembly compatible * Reflow soldering compatible * Suitable for high-density PCB layouts ### Timing Performance * Accurate clock reference generation * Low phase noise characteristics * Stable timing performance * Reliable synchronization capability * Suitable for communication and processing systems ### Material Construction * High-quality quartz resonator element * Hermetically sealed package construction * Industrial-grade materials * RoHS-compliant design * Lead-free compatible manufacturing ### Environmental Characteristics * Long operational service life * Reliable operation under industrial conditions * Resistant to environmental stress * Stable performance across operating temperature ranges * High reliability for continuous operation ### Application Areas * Microcontroller Systems * Wireless Communication Modules * Bluetooth Devices * Wi-Fi Equipment * RF Transceivers * Internet of Things Devices * Industrial Automation Systems * Embedded Controllers * Consumer Electronics * Data Communication Equipment * Smart Sensors * Portable Electronic Products ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade Frequency Control Component ## Manufacturer Seiko Epson Corporation ## Product Family TSX Series Surface-Mount Quartz Crystals #TSX3225 #260000MF09ZAC0 #EpsonCrystal #QuartzCrystal #SMDCrystal #CrystalOscillator #FrequencyControl #ClockSource #EmbeddedSystems #WirelessElectronics #RFDesign #Microcontroller #IoTDevices #IndustrialElectronics #ElectronicsEngineering

The CD74HC4067M is a high-speed CMOS analog multiplexer and demultiplexer designed to route one of multiple analog or digital signals to a common input/output line. Built using advanced high-speed CMOS technology, this device provides low ON-state resistance, wide signal bandwidth, and low power consumption, making it suitable for signal routing, data acquisition systems, sensor expansion, communication interfaces, industrial control systems, and embedded electronics. The integrated channel selection logic enables efficient switching between multiple signal paths while maintaining signal integrity and minimizing distortion. Features High-speed CMOS analog multiplexer and demultiplexer architecture Multiple single-ended channels connected to a common input/output Low ON-state resistance for reduced signal loss Wide analog signal handling capability Bidirectional signal switching support Compatible with both analog and digital signals Low power consumption during operation Break-before-make switching characteristic High noise immunity Wide operating supply voltage range Direct interface compatibility with microcontrollers and digital logic devices Low crosstalk and low leakage current performance Surface-mount package optimized for automated assembly Applications Sensor multiplexing systems Data acquisition equipment Industrial automation controllers Embedded electronics Test and measurement instruments Communication systems Audio signal routing Battery monitoring systems Medical instrumentation Consumer electronic products Microcontroller input expansion Analog signal selection networks Electrical Characteristics CMOS logic implementation Analog and digital signal switching capability Low propagation delay Low channel capacitance Low leakage current High switching speed Wide bandwidth operation ESD protection features High input impedance Low standby power consumption Mechanical Characteristics Surface-mount integrated circuit package Compact footprint for high-density PCB layouts RoHS-compliant construction Suitable for automated pick-and-place assembly Standard industry package dimensions Design Considerations Use proper decoupling capacitors near supply pins Keep analog signal traces short to minimize noise pickup Ensure signals remain within specified supply voltage limits Consider ON-resistance effects in precision analog applications Implement appropriate PCB grounding techniques for optimal performance Avoid exceeding maximum switching current ratings #commonpartslibrary #integratedcircuit #analog #digital #multiplexer #demultiplexer #signalrouting #analogswitch #dataacquisition #embeddedsystems #industrialelectronics #texasinstruments

Red, Green, Blue (RGB) 624nm Red, 525nm Green, 470nm Blue LED Indication - Discrete 2V Red, 3.3V Green, 3.3V Blue 4-SMD, No Lead # 150080M153000 ## General Description The 150080M153000 is a compact surface-mount full-color RGB LED manufactured by Würth Elektronik as part of the WL-SFCD series. The device integrates red, green, and blue light-emitting elements within a single package, enabling the generation of a wide spectrum of colors for status indication, user interfaces, backlighting, visual notifications, and decorative lighting applications. Its diffused lens design provides uniform light distribution and wide viewing visibility, making it suitable for industrial equipment, consumer electronics, communication devices, instrumentation systems, control panels, and embedded electronic products. The component is optimized for automated assembly processes and offers reliable optical performance, low power consumption, and long operational life. ## Key Features ### Optical Characteristics * Full-color RGB light output * Integrated red, green, and blue emitters * Diffused lens design for uniform illumination * Wide viewing angle * High-visibility indication capability * Consistent color performance ### Electrical Characteristics * Low-power operation * Stable optical output * Suitable for indicator and backlighting applications * Reliable performance across operating conditions * Optimized for embedded electronic systems ### Mechanical Characteristics * Surface-mount package construction * Compact footprint * Low-profile package design * Compatible with automated assembly processes * Reflow-soldering compatible ### Package Construction * Common-anode configuration * Integrated multi-die LED architecture * Rectangular lens geometry * Lead-free package design * Industrial-grade construction ### Material Characteristics * High-quality encapsulation materials * Diffused optical lens * RoHS-compliant construction * Environmentally compliant materials ### Environmental Characteristics * Suitable for commercial and industrial applications * Long operational service life * Reliable operation under standard environmental conditions * Resistant to normal assembly and handling processes ### Application Areas * Status Indicators * User Interface Displays * Industrial Control Panels * Consumer Electronics * Home Appliances * Telecommunications Equipment * Instrumentation Systems * Backlighting Applications * Smart Devices * Embedded Electronic Products * Safety and Security Equipment * Human-Machine Interface Systems ### Compliance * RoHS Compliant * REACH Compliant * Lead-Free Compatible * Industry-Standard Surface-Mount Technology ## Manufacturer Würth Elektronik ## Product Family WL-SFCD SMD Full-Color Chip LED Series #150080M153000 #WurthElektronik #RGBLED #SMDLED #WLSFCD #FullColorLED #LEDIndicator #Backlighting #Optoelectronics #EmbeddedSystems #IndustrialElectronics #ConsumerElectronics #PCBDesign #ElectronicsEngineering #SMTAssembly #commonpartslibrary #optoelectronic #ledindication

The SIM800L is a compact quad-band GSM/GPRS cellular communication module designed for embedded wireless applications requiring voice, SMS, and packet data connectivity. It integrates a complete GSM/GPRS protocol stack and supports communication over standard cellular networks, enabling reliable remote monitoring, control, telemetry, asset tracking, and Internet of Things deployments. The module features low power consumption, a compact surface-mount package, and a UART-based AT command interface for straightforward integration with microcontrollers, processors, and embedded systems. It supports voice calls, SMS messaging, GPRS data transmission, and network services while providing flexible interfacing options for audio and peripheral connectivity. Designed for industrial and consumer electronic applications, the SIM800L delivers dependable wireless communication performance in compact and power-sensitive designs. Its broad network compatibility and extensive software support make it a widely adopted solution for GSM-based connected devices. Features Quad-band GSM/GPRS cellular connectivity Voice call functionality with integrated audio interface SMS text messaging support GPRS packet data communication capability Standard AT command interface UART serial communication interface Low-power operating modes Compact surface-mount package Embedded TCP/IP protocol support Real-time clock functionality DTMF detection and generation Caller identification support SIM card interface integration Antenna interface for cellular communication Wide operating temperature capability Suitable for battery-powered applications Applications Internet of Things devices Remote monitoring systems Wireless telemetry equipment Smart metering solutions Asset tracking systems Vehicle tracking devices Industrial automation equipment Security and alarm systems Wireless data loggers Remote control applications Point-of-sale terminals Embedded communication systems Electrical Characteristics GSM/GPRS cellular network operation Low-voltage power supply architecture Serial UART host interface Integrated RF transceiver SIM card support interface Audio input and output connectivity Low standby power consumption Hardware and software power management support Mechanical Characteristics Compact SMT module package PCB-mountable design Integrated RF connection interface Embedded system integration optimized Lightweight construction Compliance and Reliability GSM standard compliant GPRS standard compliant Industrial embedded communication suitable Designed for long-term operational reliability Compatible with standard cellular infrastructure #commonpartslibrary #wirelesscommunication #gsmmodule #gprs #sim800l #cellularmodule #iot #embeddedsystems #telemetry #wirelessconnectivity #industrialelectronics #communicationmodule #remotecontrol #trackingdevice #machinetomachine #smtmodule

Buck Switching Regulator IC Positive Fixed 3.3V 1 Output 2A 8-SOIC (0.154", 3.90mm Width) # L6982N33DR ## General Description The L6982N33DR is a high-efficiency synchronous step-down switching regulator manufactured by STMicroelectronics. It is designed to provide a fixed regulated output voltage from a wide input voltage range while maintaining excellent conversion efficiency and low power dissipation. The device integrates high-side and low-side power MOSFETs, control circuitry, protection features, and compensation functions within a compact package, reducing external component count and simplifying power supply design. Its robust architecture makes it suitable for industrial automation systems, distributed power architectures, telecommunications equipment, embedded systems, consumer electronics, smart devices, and battery-powered applications requiring efficient DC-to-DC voltage conversion. ## Key Features ### Power Conversion Architecture * Synchronous buck regulator topology * Fixed output voltage regulation * Integrated power MOSFETs * High-efficiency power conversion * Optimized switching performance * Reduced external component requirements ### Electrical Characteristics * Wide input voltage operating range * Stable output voltage regulation * High conversion efficiency * Low standby power consumption * Fast transient response * Low output ripple performance ### Control Features * Current-mode control architecture * Internal compensation circuitry * Soft-start functionality * Frequency synchronization capability * Stable operation under varying load conditions ### Protection Features * Overcurrent protection * Short-circuit protection * Thermal shutdown protection * Undervoltage lockout protection * Safe startup operation * Enhanced system reliability ### Power Management * Low-power operating modes * Energy-efficient design * Suitable for battery-powered systems * Optimized thermal performance * Reduced power dissipation ### Package Characteristics * Surface-mount package * Compact footprint * Automated assembly compatible * High-density PCB design support * Industrial-grade packaging ### Material Construction * Monolithic integrated power management solution * Lead-free package materials * RoHS-compliant construction * High-reliability semiconductor technology ### Environmental Characteristics * Suitable for industrial operating environments * Long operational service life * Reliable continuous operation * Robust thermal performance ### Application Areas * Industrial Automation Equipment * Embedded Systems * Microcontroller Power Supplies * FPGA and Processor Power Rails * Telecommunications Equipment * Smart Metering Systems * Consumer Electronics * Building Automation Systems * Distributed Power Architectures * Battery-Powered Devices * IoT Products * Power Management Modules ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade Power Management Solution ## Manufacturer STMicroelectronics ## Product Family L6982 Synchronous Step-Down Switching Regulator Series #L6982N33DR #STMicroelectronics #BuckConverter #DCtoDCConverter #SwitchingRegulator #PowerManagement #PowerSupplyDesign #EmbeddedSystems #IndustrialElectronics #VoltageRegulator #PowerElectronics #IoTDevices #ElectronicsEngineering #PCBDesign #SMPS

30 Ohms @ 100 MHz 1 Power Line Ferrite Bead 0603 (1608 Metric) 1A 50mOhm # BLM18PG300SN1D ## General Description The BLM18PG300SN1D is a surface-mount ferrite bead manufactured by Murata Manufacturing and designed for electromagnetic interference suppression in power line and signal line applications. As part of the BLM18P series, the device provides effective attenuation of high-frequency noise while maintaining low DC resistance and minimal impact on desired signals. Its compact construction, high current capability, and stable impedance characteristics make it suitable for power supply filtering, digital electronics, communication equipment, industrial control systems, automotive-support electronics, and embedded devices. The component is optimized to improve electromagnetic compatibility, reduce conducted noise, and enhance overall system reliability in compact electronic designs. ## Key Features ### Noise Suppression Characteristics * Ferrite bead EMI suppression technology * High-frequency noise attenuation * Effective conducted noise filtering * Stable impedance performance * Enhanced electromagnetic compatibility * Reduced signal interference ### Electrical Characteristics * Low DC resistance * High current handling capability * Minimal voltage drop across the device * Reliable operation in power distribution circuits * Stable performance across a wide frequency range * Suitable for power and signal filtering applications ### Power Line Filtering * Optimized for power supply noise suppression * Improved power rail cleanliness * Reduction of switching noise * Enhanced system stability * Suitable for DC power distribution networks ### Mechanical Characteristics * Surface-mount package construction * Compact footprint design * Automated assembly compatible * High-density PCB layout support * Reflow soldering compatible * Suitable for space-constrained applications ### Material Construction * High-performance ferrite material * Robust multilayer structure * RoHS-compliant materials * Lead-free construction * Industrial-grade manufacturing quality ### Environmental Characteristics * Long operational service life * Reliable operation under industrial conditions * Stable electrical characteristics over time * Resistant to mechanical and thermal stress * Suitable for continuous operation ### Application Areas * Power Supply Filtering * Embedded Systems * Industrial Automation Equipment * Consumer Electronics * Communication Devices * Microcontroller Systems * Wireless Equipment * Data Processing Systems * Automotive Electronic Modules * Battery-Powered Devices * Digital Control Circuits * General EMI Suppression Applications ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade EMI Suppression Solution ## Manufacturer Murata Manufacturing Co., Ltd. ## Product Family BLM18P Series Ferrite Beads #BLM18PG300SN1D #Murata #FerriteBead #EMIFilter #NoiseSuppression #PowerLineFilter #EMC #EMI #EmbeddedSystems #IndustrialElectronics #PowerManagement #SignalIntegrity #PCBDesign #ElectronicsEngineering #SurfaceMountComponents

ARM® Cortex®-M33 STM32H5 Microcontroller IC 32-Bit 250MHz 2MB (2M x 8) FLASH 144-LQFP (20x20) # STM32H573ZIT6 ## General Description The STM32H573ZIT6 is a high-performance microcontroller from STMicroelectronics based on the Arm Cortex-M33 core. It is designed to deliver advanced processing capability, enhanced security, and extensive peripheral integration for industrial, medical, consumer, communications, and embedded control applications. The device combines powerful computational performance with low-power operation, making it suitable for real-time control, edge computing, human-machine interfaces, industrial automation, IoT gateways, motor control systems, and secure connected devices. Integrated security features, high-speed memory architecture, and comprehensive communication interfaces enable the development of robust and scalable embedded solutions. ## Key Features ### Processing Architecture * Arm Cortex-M33 processor core * TrustZone security architecture * Digital signal processing capabilities * Floating-point computation support * Optimized real-time processing performance ### Memory Resources * Embedded Flash memory * Integrated SRAM architecture * Error correction capability for enhanced reliability * High-speed memory access structure ### Security Features * Secure boot functionality * Hardware cryptographic accelerators * Secure firmware update support * Memory protection mechanisms * Tamper detection capabilities * Trusted execution environment * Secure key management support ### Communication Interfaces * USART and UART communication interfaces * SPI serial communication interfaces * I²C communication interfaces * CAN FD connectivity * USB connectivity support * Ethernet interface capability * SDMMC memory card interface * Flexible external communication options ### Analog Features * High-performance analog-to-digital conversion * Digital-to-analog conversion capability * Analog comparators * Precision signal acquisition support ### Timer and Control Functions * Advanced control timers * General-purpose timers * PWM generation capability * Encoder interface support * Motor-control functionality * Real-time clock integration ### Power Characteristics * Low-power operating modes * Dynamic power optimization * Battery-powered application support * Efficient performance-to-power ratio ### Package Characteristics * LQFP package construction * Surface-mount technology compatibility * Industrial-grade mechanical design * Suitable for automated assembly processes ### Application Areas * Industrial Automation Systems * Motor Control Equipment * Human-Machine Interfaces * Smart Energy Systems * Medical Electronics * IoT Gateways * Secure Embedded Devices * Industrial Networking Equipment * Building Automation Systems * Consumer Electronics * Data Acquisition Systems * Edge Computing Applications ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial and Commercial Application Support ## Manufacturer STMicroelectronics ## Product Family STM32H5 Series High-Performance Microcontrollers #STM32H573ZIT6 #STM32H5 #STMicroelectronics #CortexM33 #Microcontroller #EmbeddedSystems #IndustrialAutomation #SecureMCU #IoT #EdgeComputing #MotorControl #EmbeddedDesign #ElectronicsEngineering #FirmwareDevelopment #IndustrialElectronics

ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 361-TFBGA (12x12) # Engineering Specification ## Product Name STM32MP157CAC3 ## General Description STM32MP157CAC3 is a high-performance microprocessor unit that combines application processing and real-time control capabilities within a single integrated circuit. The device is designed to support advanced embedded systems requiring a balance of computing performance, deterministic control, multimedia processing, connectivity, and security functionality. The component integrates multi-core processing resources, memory interfaces, graphics capabilities, peripheral controllers, and communication subsystems to enable the development of sophisticated embedded platforms. Its heterogeneous architecture allows high-level operating systems and real-time firmware to operate simultaneously, supporting applications that require both user-interface functionality and low-latency control. The device is intended for industrial automation, human-machine interface systems, edge computing platforms, communication equipment, medical devices, smart infrastructure, and Internet of Things applications. Its architecture enables consolidation of system functions, reducing component count and simplifying overall hardware design. The design emphasizes processing efficiency, system scalability, power management, security, and long-term reliability. It supports advanced software ecosystems and facilitates the development of connected embedded products with graphical interfaces, networking capabilities, and real-time operational control. ## Functional Requirements ### Application Processing The device shall provide application-level processing capabilities suitable for operating systems, middleware, and user applications. ### Real-Time Processing The device shall support deterministic control functions for time-critical embedded operations. ### Multimedia Support The component shall support graphical and multimedia processing functions for display and user-interface applications. ### System Integration The device shall integrate processing, communication, and peripheral functions within a unified embedded computing platform. ## Electrical Requirements ### Power Management The device shall support efficient power operation and multiple power management modes to optimize energy consumption. ### Memory Interface Support The component shall support external memory devices for program execution, data storage, and system operation. ### Peripheral Connectivity The device shall provide interfaces for communication, control, monitoring, and external subsystem integration. ### Signal Integrity The design shall support reliable operation across supported interface standards and operating conditions. ## Processing Architecture Requirements ### Multi-Core Operation The device shall support concurrent execution of application and real-time workloads through integrated processing resources. ### Operating System Support The architecture shall support embedded operating systems and software frameworks suitable for advanced application development. ### Security Features The device shall support hardware-based mechanisms intended to protect system integrity, software assets, and sensitive data. ### Resource Management The component shall support efficient allocation of processing, memory, and peripheral resources. ## Mechanical Requirements ### Surface Mount Construction The device shall be supplied in a high-density surface mount package suitable for automated manufacturing processes. ### PCB Integration The package shall support integration into multilayer printed circuit boards designed for high-performance embedded systems. ### Structural Integrity The device shall maintain electrical and mechanical reliability during assembly and operational service life. ## Environmental Requirements ### Operating Conditions The component shall operate reliably within environmental conditions commonly encountered in industrial and embedded applications. ### Thermal Performance The device shall support stable operation under sustained processing workloads and associated thermal conditions. ### Storage and Handling The component shall maintain physical and electrical integrity during transportation, storage, and manufacturing processes. ## Quality Requirements ### Reliability The device shall provide dependable long-term operation in embedded and industrial computing environments. ### Verification Processing, peripheral, communication, and system functions shall be validated through applicable testing and qualification procedures. ### Compliance The product shall conform to relevant semiconductor, quality, and embedded computing standards applicable to its intended use. ## Documentation Requirements Technical documentation shall include processor architecture information, hardware integration guidelines, memory interface recommendations, power management considerations, software development support, security features, and application design guidance. ## Classification Tags #STM32MP157CAC3 #STM32MP1 #Microprocessor #MPU #EmbeddedProcessor #ARMProcessor #EmbeddedLinux #RealTimeControl #IndustrialAutomation #HumanMachineInterface #EdgeComputing #IoTGateway #EmbeddedSystems #SystemOnChip #SoC #ApplicationProcessor #GraphicsProcessor #ConnectivityPlatform #IndustrialElectronics #PCBDesign #HardwareDevelopment #ElectricalEngineering #CommonPartsLibrary #ComponentLibrary #EngineeringSpecification #TechnicalDocumentation #SystemIntegration #SecureEmbeddedSystems #MulticoreProcessing

Buck Switching Regulator IC Positive Fixed 3.3V 1 Output 2A SOT-23-6 Thin, TSOT-23-6 The AP63200/AP63201/AP63203/AP63205 is a 2A, synchronous buck converter with a wide input voltage range of 3.8V to 32V and fully integrates a 125mΩ high-side power MOSFET and a 68mΩ low-side power MOSFET to provide high-efficiency step-down DC/DC conversion. The AP63200/AP63201/AP63203/AP63205 device is easily used by minimizing the external component count due to its adoption of peak current mode control along with its integrated compensation network. The AP63200/AP63201/AP63203/AP63205 has optimized designs for Electromagnetic Interference (EMI) reduction. The converter features Frequency Spread Spectrum (FSS) with a switching frequency jitter of ±6%, which reduces EMI by not allowing emitted energy to stay in any one frequency for a significant period of time. It also has a proprietary gate driver scheme to resist switching node ringing without sacrificing MOSFET turn-on and turn-off times, which further erases highfrequency radiated EMI noise caused by MOSFET switching. The device is available in a low-profile, TSOT26 package. • VIN 3.8V to 32V • 2A Continuous Output Current • 0.8V ±1% Reference Voltage • 22µA Ultralow Quiescent Current • Switching Frequency o 500kHz: AP63200 and AP63201 o 1.1MHz: AP63203 and AP63205 • Pulse Width Modulation (PWM) Regardless of Output Load o AP63201 • Supports Pulse Frequency Modulation (PFM) o AP63200, AP63203, and AP63205 o Up to 80% Efficiency at 1mA Light Load o Up to 88% Efficiency at 5mA Light Load • Fixed Output Voltage o 3.3V: AP63203 o 5.0V: AP63205 • Proprietary Gate Driver Design for Best EMI Reduction • Frequency Spread Spectrum (FSS) to Reduce EMI • Precision Enable Threshold to Adjust UVLO • Protection Circuitry o Overvoltage Protection o Cycle-by-Cycle Peak Current Limit o Thermal Shutdown • 12V and 24V distributed power bus supplies • Flat screen TV sets and monitors • Power tools and laser printers • White goods and small home appliances • FPGA, DSP, and ASIC supplies • Home audios • Network systems • Set top boxes • Gaming consoles • Consumer electronics #commonpartslibrary #integratedcircuit #AP63203WU7 #BuckConverter #DCDCConverter #PowerManagement #VoltageRegulator #SynchronousBuck #EmbeddedSystems #IndustrialElectronics #PowerSupply #DiodesInc #3V3Power #ElectronicsDesign

2 Position Wire to Board Terminal Block Horizontal with Board 0.100" (2.54mm) Through Hole 1725656 – PCB-mounted screw terminal block designed for secure wire-to-board connections in industrial, control, automation, instrumentation, and power distribution applications. Features a screw-clamp termination system that provides reliable electrical contact and strong wire retention under vibration and demanding operating conditions. The through-hole construction offers enhanced mechanical stability, making it suitable for long-term field installations and high-reliability electronic assemblies. Designed to simplify wiring, maintenance, and system integration while ensuring dependable signal and power connectivity. #TerminalBlock #ScrewTerminal #WireToBoard #IndustrialElectronics #PowerDistribution #AutomationSystems #ControlPanels #ThroughHoleConnector #PCBConnector #ReliableConnectivity #connector #Terminalblock #tht

N-Channel 68 V 80A (Tc) 190W (Tc) Through Hole TO-220 # STP75NF68 ## General Description The STP75NF68 is a high-performance N-channel power MOSFET manufactured by STMicroelectronics and designed for efficient power switching and power management applications. Utilizing advanced STripFET™ power MOSFET technology, the device offers low on-state resistance, high current-handling capability, and excellent switching performance. Its rugged construction and optimized electrical characteristics make it suitable for industrial automation systems, motor control applications, power supplies, battery-powered equipment, DC-DC converters, automotive-support systems, and general-purpose power electronics. The device is engineered to provide high efficiency, reduced power losses, and reliable operation in demanding switching environments. ## Key Features ### Power MOSFET Architecture * N-channel enhancement-mode MOSFET * Advanced STripFET™ technology * Low on-state resistance * High-current switching capability * Optimized power conversion efficiency * Fast switching performance ### Electrical Characteristics * Low conduction losses * High-current carrying capability * Low gate drive requirements * Stable switching operation * Efficient energy transfer performance * Suitable for high-power electronic systems ### Switching Performance * Fast turn-on characteristics * Fast turn-off characteristics * Reduced switching losses * High-frequency operation support * Reliable dynamic performance * Enhanced power management capability ### Thermal Characteristics * High power dissipation capability * Efficient thermal transfer performance * Suitable for heatsink integration * Reliable operation under continuous load conditions * Stable thermal behavior in demanding applications ### Protection and Reliability * Avalanche-rated performance * Rugged semiconductor construction * High reliability under transient conditions * Long operational service life * Enhanced electrical robustness ### Package Characteristics * Through-hole power package * Industry-standard footprint * Easy integration into power electronic assemblies * Suitable for industrial and commercial applications * Compatible with automated and manual assembly processes ### Material Construction * Advanced silicon power MOSFET technology * High-reliability semiconductor materials * RoHS-compliant construction * Lead-free compatible package * Industrial-grade manufacturing quality ### Environmental Characteristics * Suitable for industrial operating environments * Reliable performance under continuous operation * Resistant to electrical and thermal stress * Long-term operational stability ### Application Areas * Motor Control Systems * Switching Power Supplies * DC-DC Converters * Battery Management Systems * Industrial Automation Equipment * Power Distribution Systems * Renewable Energy Equipment * Inverter Applications * Embedded Power Electronics * Automotive Electronic Systems * Uninterruptible Power Supplies * General Power Switching Circuits ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade Power Semiconductor Solution ## Manufacturer STMicroelectronics ## Product Family STripFET™ N-Channel Power MOSFET Series #STP75NF68 #STMicroelectronics #PowerMOSFET #NChannelMOSFET #STripFET #PowerElectronics #MotorControl #SwitchingPowerSupply #DCDCConverter #BatteryManagement #IndustrialElectronics #PowerManagement #EmbeddedSystems #ElectronicsEngineering #PowerSemiconductor

N-Channel 200 V 120A (Tc) 714W (Tc) Through Hole TO-247AD (IXFH) # IXFH120N15P ## General Description The IXFH120N15P is a high-current N-channel power MOSFET manufactured by Littelfuse IXYS. It is designed for demanding power switching and power conversion applications requiring low conduction losses, fast switching performance, and high current-handling capability. Built using advanced power MOSFET technology, the device provides excellent efficiency, ruggedness, and thermal performance for industrial power systems, motor drives, battery management equipment, welding systems, uninterruptible power supplies, renewable energy systems, and high-power DC switching applications. Its robust construction and low on-state resistance make it particularly suitable for designs requiring high efficiency and reliable operation under heavy load conditions. ## Key Features ### Power MOSFET Architecture * N-channel enhancement-mode MOSFET * Advanced power semiconductor technology * Low conduction losses * High-current switching capability * Optimized efficiency for power conversion applications * Fast switching performance ### Electrical Characteristics * Low on-state resistance * High-current carrying capability * Low gate drive power requirements * Excellent switching efficiency * Stable electrical performance under demanding operating conditions * Suitable for high-power applications ### Switching Performance * Fast turn-on characteristics * Fast turn-off characteristics * Reduced switching losses * High-frequency operation capability * Efficient power control functionality ### Thermal Characteristics * High power dissipation capability * Excellent thermal conductivity * Efficient heat transfer performance * Suitable for heatsink mounting * Reliable operation under continuous load conditions ### Protection and Reliability * Avalanche ruggedness * Robust semiconductor structure * Enhanced reliability under transient conditions * Long operational service life * Industrial-grade durability ### Package Characteristics * Through-hole power package * Electrically isolated mounting configuration * Suitable for high-power assemblies * Automated and manual assembly compatibility * Industrial-grade mechanical construction ### Material Construction * Advanced silicon power MOSFET technology * High-reliability semiconductor materials * RoHS-compliant construction * Lead-free compatible package * Rugged power device architecture ### Environmental Characteristics * Suitable for industrial operating environments * High mechanical durability * Stable operation across extended temperature ranges * Reliable continuous-duty performance ### Application Areas * Motor Drive Systems * Industrial Power Supplies * Battery Management Systems * Renewable Energy Equipment * Solar Power Converters * DC-DC Converters * High-Power Switching Circuits * Welding Equipment * Uninterruptible Power Supplies * Electric Vehicle Support Systems * Energy Storage Systems * Industrial Automation Equipment ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade Power Semiconductor Solution ## Manufacturer Littelfuse IXYS ## Product Family PolarP N-Channel Power MOSFET Series #IXFH120N15P #IXYS #Littelfuse #PowerMOSFET #NChannelMOSFET #PowerElectronics #MotorDrive #DCDCConverter #PowerSupplyDesign #IndustrialElectronics #EnergyStorage #RenewableEnergy #BatteryManagement #ElectronicsEngineering #PowerSemiconductor #Commonpartslibrary #Transistor #MOSFET #FET #tht

SLC NAND Flash Parallel/Serial 3.3V 256G-bit 32G x 8 100-Pin LBGA FLASH - NAND (SLC) Memory IC 256Gbit Parallel 100 MHz 100-LBGA (12x18) The MT29F256G08AUCABH3-10ITZ:A is a high-density 256Gb Single-Level Cell (SLC) NAND Flash memory device from Micron Technology. It provides non-volatile data storage with high reliability, fast read/write performance, and long endurance, making it suitable for industrial, networking, embedded computing, automotive, and data-logging applications. The device supports both asynchronous and synchronous interfaces and complies with the Open NAND Flash Interface (ONFI) standard for enhanced interoperability and performance. It is housed in a compact 100-ball LBGA package (12 mm × 18 mm). • Open NAND Flash Interface (ONFI) 2.2-compliant1 • Single-level cell (SLC) technology • Organization – Page size x8: 8640 bytes (8192 + 448 bytes) – Block size: 128 pages (1024K + 56K bytes) – Plane size: 2 planes x 2048 blocks per plane – Device size: 32Gb: 4096 blocks; 64Gb: 8192 blocks; 128Gb: 16,384 blocks; 256Gb: 32,768 blocks • Synchronous I/O performance – Up to synchronous timing mode 5 – Clock rate: 10ns (DDR) – Read/write throughput per pin: 200 MT/s • Asynchronous I/O performance – Up to asynchronous timing mode 5 – tRC/tWC: 20ns (MIN) – Read/write throughput per pin: 50 MT/s • Array performance – Read page: 35µs (MAX) – Program page: 350µs (TYP) – Erase block: 1.5ms (TYP) • Operating Voltage Range – VCC: 2.7–3.6V – VCCQ: 1.7–1.95V, 2.7–3.6V • Command set: ONFI NAND Flash Protocol • Advanced Command Set – Program cache – Read cache sequential – Read cache random – One-time programmable (OTP) mode – Multi-plane commands – Multi-LUN operations – Read unique ID – Copyback • First block (block address 00h) is valid when shipped from factory. For minimum required ECC, see Error Management (page 114). • RESET (FFh) required as first command after power-on • Operation status byte provides software method for detecting – Operation completion – Pass/fail condition – Write-protect status • Data strobe (DQS) signals provide a hardware method for synchronizing data DQ in the synchronous interface • Copyback operations supported within the plane from which data is read • Quality and reliability – Data retention: JESD47G compliant; see qualification report – Endurance: 60,000 PROGRAM/ERASE cycles • Operating temperature: – Commercial: 0°C to +70°C – Industrial (IT): –40ºC to +85ºC • Package – 52-pad LGA – 48-pin TSOP – 100-ball BGA – 132-ball BGA #Micron #NANDFlash #SLCNAND #FlashMemory #NonVolatileMemory #ONFI #EmbeddedSystems #IndustrialElectronics #DataStorage #MemoryIC #LBGA100 #HighReliability #MT29F256G08AUCABH310ITZA #MicronMemory #ParallelNANDFlash

ARM® Cortex®-M0+ STM32U0 Microcontroller IC 32-Bit 56MHz 256KB (256K x 8) FLASH 48-LQFP (7x7) # STM32U083CCT6 ## General Description The STM32U083CCT6 is an ultra-low-power microcontroller from STMicroelectronics based on the Arm Cortex-M0+ core. It is specifically designed for energy-efficient embedded applications requiring long battery life, advanced peripheral integration, secure operation, and reliable real-time performance. The device combines low-power processing, embedded Flash memory, SRAM, analog peripherals, communication interfaces, and hardware security features within a compact package. Its architecture makes it ideal for smart sensors, industrial monitoring systems, medical devices, wearable electronics, smart metering, home automation products, and Internet of Things applications where power efficiency is a primary design requirement. ## Key Features ### Processing Architecture * Arm Cortex-M0+ processor core * Optimized low-power computing architecture * Efficient real-time processing capability * Interrupt-driven operation support * Embedded system control functionality ### Memory Resources * Embedded Flash memory * Integrated SRAM * Non-volatile data storage support * High-reliability memory architecture * Efficient code execution capability ### Low-Power Features * Ultra-low-power operating modes * Multiple sleep and standby modes * Fast wake-up capability * Battery-powered application optimization * Energy-efficient peripheral operation * Extended product operating life in portable systems ### Security Features * Hardware security mechanisms * Memory protection functionality * Secure firmware execution support * Data integrity protection * Secure embedded application development support ### Communication Interfaces * USART communication interfaces * UART communication support * SPI serial communication interfaces * I²C communication interfaces * Low-power communication capability * Flexible external device connectivity ### Analog Features * Analog-to-digital conversion capability * Precision signal acquisition support * Integrated analog peripherals * Sensor interface compatibility * Low-power analog operation ### Timer and Control Functions * General-purpose timers * PWM signal generation * Real-time clock functionality * Event-driven control capability * Timing and scheduling support ### Package Characteristics * Surface-mount package * Compact footprint design * Automated assembly compatibility * Suitable for space-constrained applications * Industrial-grade packaging ### Material Construction * Advanced low-power semiconductor technology * RoHS-compliant materials * Lead-free package construction * High-reliability integrated circuit design ### Environmental Characteristics * Suitable for industrial and commercial environments * Long operational service life * Stable performance under continuous operation * Robust low-power architecture ### Application Areas * Internet of Things Devices * Smart Sensors * Wearable Electronics * Medical Monitoring Equipment * Home Automation Systems * Smart Metering Applications * Battery-Powered Products * Environmental Monitoring Systems * Industrial Data Acquisition Equipment * Consumer Electronics * Portable Embedded Systems * Wireless Sensor Nodes ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade Embedded Microcontroller Solution ## Manufacturer STMicroelectronics ## Product Family STM32U0 Ultra-Low-Power Microcontroller Series #STM32U083CCT6 #STM32U0 #STMicroelectronics #Microcontroller #UltraLowPowerMCU #CortexM0Plus #EmbeddedSystems #IoT #SmartSensors #WearableElectronics #BatteryPoweredDevices #IndustrialElectronics #EmbeddedDesign #FirmwareDevelopment #ElectronicsEngineering

270 V 6.5 kA Varistor 1 Circuit Through Hole Disc 20mm The MOV-20DxxxK Series of 20 mm radial leaded varistor devices protects against overvoltage transients such as lightning, power contact and power induction. The metal oxide varistors offer a choice of varistor voltages from 18 V to 1800 V and Vrms voltages from 11 V to 1100 V. The devices have a high current handling, high energy absorption capability and fast response times to protect against transient faults up to rated limits. Features High voltage and current rating Straight and kinked lead styles available Bidirectional Surge protection Fast response time RoHS compliant* #MOV20D271K #Varistor #MetalOxideVaristor #SurgeProtection #CircuitProtection #OverVoltageProtection #PowerSupplyProtection #TransientSuppression #ElectronicComponents #ThroughHole #IndustrialElectronics #ConsumerElectronics

22 Position Receptacle Connector 0.059" (1.50mm) Surface Mount Tin 503154-2290 5031542290 is a 22-position surface-mount receptacle connector from the Molex CLIK-Mate series, designed for compact wire-to-board applications requiring secure locking and reliable electrical performance. Featuring a 1.50 mm pitch, dual-row configuration, and latch holder mechanism, it is ideal for use in industrial, automotive, medical, lighting, and general-purpose electronic equipment. The connector offers robust mechanical retention, pick-and-place compatibility, and operation over a wide temperature range. Key Features 22-position dual-row receptacle connector 1.50 mm pitch (CLIK-Mate series) Surface-mount (SMT) termination Secure latch holder locking mechanism Tin-plated copper alloy contacts Pick-and-place compatible for automated assembly Solder retention feature for improved manufacturing reliability Operating temperature range: -40°C to +105°C UL94 V-0 flame-retardant housing Suitable for automotive, industrial, medical, and lighting applications #CommonPartsLibrary #Connector #Molex #CLIKMate #WireToBoard #SMTConnector #BoardToWire #ElectronicConnector #IndustrialElectronics #AutomotiveElectronics #MedicalDevices #PCBDesign #InterconnectSolutions #5031542290