series Converter, Energy Harvesting Voltage Regulator IC 1 Output 10-DFN (3x3) #RegulatorSwitching #commonpartslibrary

Dual core, Wi-Fi: 2.4 GHz up to 150 Mbits/s,BLE (Bluetooth Low Energy) and legacy Bluetooth, 32 bits, Up to 240 MHz

Energy Harvesting PMIC 20-VQFN (3.5x3.5)

Single Phase Energy Meter IC with Integrated Oscillator for Socket #commonpartslibrary #sensor #integratedcircuit

Energy Harvesting Wireless Sensor, IoT, Smart Wearables PMIC 16-QFN #dc #solar #harvesting

802.15.4, Bluetooth, WiFi 802.11a/b/g/n/ac/ax, Bluetooth v5.3, Zigbee® Transceiver Module 2.4GHz, 5GHz Antenna Not Included, U.FL/MHF, PCB Trace Surface Mount The LBES5PL2EL-923 is a compact, low-power Bluetooth® Low Energy (BLE) module developed by Murata. It integrates a Nordic Semiconductor SoC (nRF52 series) with an onboard antenna, providing a complete RF solution for wireless connectivity in embedded systems. The module is designed for IoT, wearable, and low-power wireless applications, offering reliable communication, small footprint, and minimal external component requirements. Key Features Integrated Bluetooth® Low Energy (BLE) 5.x compliant module Based on Nordic Semiconductor nRF52 series SoC Built-in chip antenna (no external antenna required) Ultra-low power consumption suitable for battery-powered devices Integrated RF matching and shielding Supports multiple BLE roles (Central, Peripheral, Broadcaster, Observer) Compact surface-mount package Pre-certified RF module (reduces certification effort) Electrical Characteristics Supply Voltage Operating Voltage: 1.7 V to 3.6 V Current Consumption TX Mode: ~5–10 mA (depending on output power) RX Mode: ~5 mA Sleep Mode: < 2 µA RF Characteristics Frequency Band: 2.4 GHz ISM (2400–2483.5 MHz) Output Power: up to +4 dBm Sensitivity: approx. -96 dBm Interfaces UART SPI I²C (TWI) GPIO (multiplexed) ADC inputs PWM Mechanical Specifications Package Type: Surface Mount Module (SMD) Dimensions: ~10 mm × 7 mm × 1.4 mm (approx.) Integrated antenna and shielding Environmental Ratings Operating Temperature: -40°C to +85°C Storage Temperature: -40°C to +125°C Compliance & Certifications Bluetooth SIG qualified FCC / IC / CE (module-level certification, varies by variant) RoHS compliant Applications IoT devices Wearables Smart home products Wireless sensors Industrial monitoring systems Pin Configuration (Summary) Power: VDD, GND Communication: UART, SPI, I²C GPIOs: Configurable digital I/O RF: Integrated antenna (no RF pin required) Design Considerations Follow recommended PCB layout for antenna clearance Avoid copper under antenna region Provide stable power supply with proper decoupling capacitors Ensure proper grounding for RF performance #commonpartslibrary #integratedcircuit #transceiver #wireless #rf

MGM210LA22JIF devices are PCB modules for Zigbee, Thread, Bluetooth and multiprotocol (Zigbee + Bluetooth) connectivity built around the EFR32MG21 Wireless Gecko Series 2 SoC and designed and optimized for the unique needs of smart LED lightbulbs. Delivering unparalleled RF performance and energy consumption compliance with CA Title 20, the module also offers a powerful and energy-efficient MCU core, 1024 kB of flash memory to enable future-proofing capabilities and over-the-air firmware updates with a dedicated core for enhanced security features. With its extended temperature rating and form factor, the device is suitable for enclosed operation in lightbulb housings. #CommonpartLibrary #Module #EFR32MG21 #arduino-matter

CoolSiC™ 1200 V SiC MOSFET G2 : Silicon Carbide MOSFET with .XT interconnection technology Features • VDSS = 1200 V at Tvj = 25°C • IDDC = 34 A at TC = 100°C • RDS(on) = 40 mΩ at VGS = 18 V, Tvj = 25°C • Very low switching losses • Overload operation up to Tvj = 200°C • Short circuit withstand time 2 µs • Benchmark gate threshold voltage, VGS(th) = 4.2 V • Robust against parasitic turn on, 0 V turn-off gate voltage can be applied • Robust body diode for hard commutation • .XT interconnection technology for best-in-class thermal performance • Suitable Infineon gate drivers can be found under https://www.infineon.com/gdfinder Potential applications • General purpose drives (GPD) • EV Charging • Online UPS/Industrial UPS • Solar power optimizer • String inverter • Energy Storage Systems (ESS) • Welding #CommonPartsLibrary #Transistor #FET #Mosfet #CoolSiC™ G2 IMZC120R040M2H

Wireless MCU with Integ Tri-radio 1x1 Wi-Fi 6 + BLE Low Energy 5.4 / 802.15.4 TFBGA145 package #CommonPartsLibrary #IntegratedCircuit #RF-transceiver

4.7 µH Unshielded Drum Core, Wirewound Inductor 62 A 0.95mOhm Max Vertical, 2 PC Pin The IHDM1008BCEV4R7M30 is a surface-mount power inductor designed for energy storage and filtering in switching power supplies and DC-DC converter circuits. It provides stable inductance characteristics under varying current conditions, making it suitable for applications requiring efficient power conversion and noise suppression. The device is constructed using a magnetically shielded structure to minimize electromagnetic interference and ensure reliable operation in densely populated circuit environments. Its design supports high current handling capability while maintaining low core losses, contributing to overall system efficiency. Functional Overview The inductor stores energy in its magnetic field when current flows through it and releases that energy when the current changes. This behavior is essential for smoothing current in switching regulators and maintaining stable voltage levels in power circuits. Its low resistance winding helps reduce power loss, while the magnetic shielding limits flux leakage, improving performance in sensitive electronic systems. The component is optimized for high-frequency operation typically found in modern power management designs. Electrical Characteristics The device provides a fixed inductance value with stable performance across a range of operating currents. It supports relatively high saturation current levels, allowing it to function effectively in power circuits without significant degradation of inductance. Low direct current resistance contributes to improved efficiency and reduced heat generation. The inductor is designed to maintain consistent electrical behavior across typical operating temperatures and frequencies used in switching applications. Interface Requirements The component features standard surface-mount terminals for direct placement onto printed circuit boards. Proper soldering and pad design are required to ensure mechanical stability and optimal electrical performance. Placement considerations should include minimizing loop area and proximity to switching elements to reduce noise and maximize efficiency. Operating Conditions The inductor is intended for operation across a wide temperature range suitable for consumer and industrial electronics. It is capable of maintaining performance under continuous load conditions and varying thermal environments. Adequate thermal management and airflow may be necessary in high-current applications to prevent excessive temperature rise. Protection and Reliability Features The device is constructed with durable materials to ensure long-term reliability under electrical and thermal stress. Its magnetically shielded design reduces susceptibility to external interference and limits emissions that could affect nearby components. It is designed to withstand standard handling and soldering processes associated with surface-mount assembly. Packaging and Integration The IHDM1008BCEV4R7M30 is provided in a compact surface-mount package optimized for automated assembly processes. Its form factor allows efficient use of board space while supporting high-performance power designs. The package design ensures secure mounting and consistent electrical contact in high-density circuit layouts. Applications Typical applications include DC-DC converters, voltage regulator modules, power management circuits, filtering stages, and energy storage elements in portable devices, industrial equipment, and communication systems. #commonpartslibrary #inductors

Green 568nm LED Indication - Discrete 2.2V Radial The WP483GDT is a through-hole green light-emitting diode designed for general-purpose visual indication and low-power lighting applications. It emits a visible green wavelength when forward biased and is commonly used in status indicators, signal displays, and basic illumination circuits. The device is built with a durable epoxy lens package that provides mechanical protection and enhances light output visibility. It is suitable for use in a wide range of electronic systems, including consumer electronics, control panels, and embedded designs. Device Overview The component is a standard discrete LED with a two-lead configuration consisting of an anode and a cathode. It operates by converting electrical energy into light through electroluminescence. The emitted color falls within the green spectrum, making it appropriate for applications requiring clear visual signaling without excessive brightness or power consumption. Electrical Characteristics The LED operates under forward bias conditions, with a typical forward voltage in the range expected for green LEDs. It supports low current operation while maintaining consistent luminous output. Reverse voltage tolerance is limited, and proper polarity must be observed to prevent damage. Current-limiting resistors are required in circuit integration to ensure safe operation. Optical Characteristics The device produces a green light output with a defined luminous intensity and viewing angle based on its lens shape and internal structure. The epoxy lens may be diffused or clear, affecting the spread and focus of the emitted light. Brightness is dependent on the forward current applied. Mechanical Characteristics The LED is housed in a standard round through-hole package, compatible with typical PCB mounting. Leads are spaced to fit common board layouts and can be soldered directly. The epoxy body provides insulation and environmental protection while maintaining optical clarity. Thermal Considerations The device is designed for low power dissipation but should be operated within recommended limits to avoid overheating. Adequate spacing and proper current control help maintain thermal stability and prolong device lifespan. Applications The WP483GDT is suitable for indicator lights in electronic devices, status displays in control systems, educational and hobby electronics, and general-purpose signaling applications where green illumination is required. Compliance and Handling The component should be handled using standard ESD precautions. Storage and soldering conditions should follow typical LED handling practices to maintain performance and reliability. #commonpartslibrary #led #green

RF System on a Chip - SoC Cortex-M55 250MHz, 2.5D GPU, 4MB MRAM, 3.75MB SRAM, BLE5.4, -20 to +70 C, BGA , 1.71 V to 2.2 V -20C ~ 70C ARM® Cortex®-M55 System On Chip (SOC) IC Apollo510B 250MHz The AP510BFA-CBR is an ultra-low-power MCU System-on-Chip (SoC) designed for advanced embedded and edge-AI applications. It belongs to the Apollo510B series and integrates a powerful ARM Cortex-M55 processor optimized for both performance and energy efficiency. It combines processing, memory, and multiple peripherals into a single BGA package, making it suitable for compact and power-sensitive designs. Key Characteristics Core: ARM Cortex-M55 Max CPU Speed: 250 MHz Architecture: MCU / SoC Flash Memory: 4 MB RAM: ~3.75 MB Connectivity: I2C, SPI, UART, USB Wireless Support: Bluetooth 5.4 (variant dependent) Package: 153-BGA (compact high-density package) Key Features Built on Ambiq’s ultra-low-power SPOT technology Designed for battery-powered and energy-sensitive devices High computational performance for edge AI and DSP workloads Integrated peripherals for embedded system development Typical Applications Wearables (smartwatches, fitness bands) Smart home and IoT devices Edge AI / machine learning nodes Industrial sensors and monitoring systems Wireless communication modules #CommonPartsLibrary #IntegratedCircuit #SoC #Apollo510B

Bluetooth Low Energy 5.0 transceiver module, nRF52832-based, 1.7-3.6 V supply, 6.5 x 6.5 mm SMD-52 package

+/-24V PGA I/P 24-BIT 256KSPS DA The ADAQ7767-1BBCZ is a high-performance, precision data acquisition (DAQ) µModule® system from Analog Devices. It integrates a 24-bit sigma-delta analog-to-digital converter (ADC), signal conditioning, and essential analog front-end components into a compact package. Designed for high accuracy and ease of use, it significantly reduces design complexity, layout effort, and noise sensitivity in precision measurement systems. This device is optimized for applications requiring high resolution, low noise, and excellent DC performance, such as industrial automation, instrumentation, and test equipment. Key Features 24-bit resolution sigma-delta ADC Integrated analog front end (AFE) Low noise, high dynamic range performance Programmable gain amplifier (PGA) Wide input bandwidth Low drift and high linearity SPI-compatible serial interface Internal reference and buffer options Compact system-in-package (SiP) design Electrical Characteristics Resolution: 24 bits Sampling Rate: Up to 256 kSPS (depending on configuration) Input Type: Differential Input Voltage Range: ±VREF (dependent on configuration) Signal-to-Noise Ratio (SNR): ~108 dB (typical) Total Harmonic Distortion (THD): Low distortion performance Reference Voltage: Internal or external supported Power Requirements Analog Supply Voltage (AVDD): 4.5 V to 5.5 V (typical) Digital Supply Voltage (DVDD): 1.8 V to 3.3 V Power Consumption: Optimized for precision applications Interface Communication: SPI-compatible serial interface Data Output: Serial digital output Control: Register-based configuration Package Information Package Type: µModule® (BGA) Package Code: BBCZ Mounting Type: Surface mount Compact footprint for space-constrained designs Operating Conditions Operating Temperature Range: -40°C to +85°C (industrial grade) Storage Temperature Range: -65°C to +150°C Applications Industrial process control Data acquisition systems Precision instrumentation Test and measurement equipment Medical instrumentation Energy monitoring systems Advantages Reduces PCB design complexity Minimizes noise and parasitic effects Factory-optimized signal chain performance Faster time-to-market

The ESP32-WROOM-32E (16MB) is a highly integrated Wi-Fi + Bluetooth + Bluetooth Low Energy (BLE) module developed by Espressif. It is based on the ESP32-D0WD-V3 chip and features a dual-core processor, rich peripherals, and large flash memory—making it ideal for IoT, embedded systems, and wireless applications. This module is part of the upgraded WROOM-32E series, offering improved RF performance, better stability, and enhanced reliability compared to earlier versions like the 32D. Key Features (16MB Variant) Processor & Memory Dual-core Xtensa® 32-bit LX6 CPU, up to 240 MHz 520 KB SRAM + 448 KB ROM 16 MB SPI Flash (large storage for firmware/data) Optional variants with PSRAM for memory-intensive tasks Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth v4.2 (BR/EDR + BLE) Integrated PCB antenna (no external antenna needed) Peripherals & Interfaces Up to 26–38 GPIOs (depending on usage) Supports: UART, SPI, I2C, I2S PWM (LED & motor control) ADC, DAC Capacitive touch sensors SD/SDIO/MMC, CAN (TWAI) Electrical & Physical Operating voltage: 3.0V – 3.6V Operating temperature: –40°C to +85°C (industrial range) Compact size: 18 × 25.5 × 3.1 mm Typical Applications Smart home devices (lighting, appliances) IoT sensors and gateways Industrial automation systems Wearables and smart gadgets Audio/voice processing (thanks to dual-core + large flash) #module #ESP32 #16MB

Enclosed AC DC Converters 2 Output 15V 340mA, 340mA 80 ~ 305 VAC Input The RAC10-K/277 series are highly efficient PCB-Mount power conversion modules with ultra-low energy losses even in light load conditions. Built for worldwide usage, the AC/DC units cover an enhanced mains input range of 85VAC up to 305VAC and come with international safety certifications for both industrial and household standards. These AC/DC modules offer fully protected single or dual outputs as well as EMC Class B compliance without the need of any external components. The 140% peak power capability makes the RAC10-K/277 series suitable for inductive, high start-up current or nonlinear loads. With a full load temperature range of -40°C to +65°C, they are ideal for always on and standby mode operations in process automation, IoT and smart building applications. Input voltage: 85 VAC to 305 VAC (wide-range, including 277 VAC industrial lines) Output: Dual output (±15 V DC) Power rating: 10 Watts Isolation: Fully isolated AC to DC conversion Encapsulation: Fully sealed/potted module for safety and reliability #CommonPartsLibrary #power-supply #RAC10-15

The RFFM6901 is a single-chip RF front-end module (FEM) designed for 868 MHz to 928 MHz ISM-band wireless communication applications. It integrates a high-power power amplifier (PA), low-noise amplifier (LNA), antenna diversity switch, and matching circuitry into a compact package, helping reduce external components, PCB space, and overall system cost. It is commonly used in smart energy systems, wireless metering, industrial monitoring, alarm systems, and other Sub-1 GHz wireless devices. Key Features Operating frequency range: 868 MHz to 928 MHz Integrated 1 W power amplifier Up to +30 dBm transmit output power Integrated low-noise amplifier with bypass mode Dual-port antenna diversity switch Separate 50 Ω transmit and receive interfaces Compact 32-pin LGA package (6 mm × 6 mm) Supply voltage range: 2.8 V to 4.2 V Typical LNA gain: 17 dB Low receiver noise figure: 1.5 dB Designed for portable and battery-powered wireless systems RoHS compliant Typical Applications Smart energy and smart metering Wireless alarm and security systems ISM-band communication devices Industrial wireless sensors Portable RF equipment IoT Sub-1 GHz wireless systems Search across more sources

MCP3913 Series 3.6 V 4.5 mA SMT Six-Channel Analog Front End - SSOP-28 The MCP3913A1T-E/SS is a high-performance, multi-channel analog front-end (AFE) from Microchip Technology intended for precision measurement applications. It features six simultaneous sampling 24-bit delta-sigma ADCs with integrated programmable gain amplifiers, enabling accurate acquisition of low-level analog signals. Designed for energy monitoring and industrial sensing, the device provides low noise, high dynamic range, and flexible configuration. It supports SPI communication for efficient interfacing with microcontrollers and digital processing systems. Key Features Six simultaneous sampling 24-bit delta-sigma ADC channels Integrated programmable gain amplifiers per channel High signal-to-noise ratio and low distortion Programmable oversampling ratios for performance tuning Internal voltage reference with external reference option SPI-compatible digital interface Configurable data output formats and control registers Low power operation modes Electrical Characteristics Resolution: 24-bit Number of Channels: 6 Input Configuration: Differential Supply Voltage: 2.7V to 3.6V Operating Temperature Range: -40°C to +125°C Programmable Gain: Up to 32 V/V (typical) Reference Voltage: Internal or external selectable Functional Description The device integrates six high-resolution delta-sigma ADCs that sample input signals simultaneously, ensuring accurate phase and timing relationships across channels. Each input passes through a programmable gain stage, allowing optimization for different sensor levels. Analog signals are digitized using oversampling and digital filtering techniques to achieve high precision and noise reduction. Configuration is handled via internal registers, and data is transferred through an SPI interface. Package Information Package Type: SSOP Pin Count: 28 Mounting Type: Surface Mount Applications Energy metering Power monitoring systems Industrial automation Multi-channel data acquisition Sensor interfacing Smart grid systems Advantages High integration reduces external components Simultaneous sampling improves measurement accuracy High resolution supports precise signal analysis Flexible configuration for various system requirements #commonpartslibrary #integratedcircuit #powermanagement #energymetering

4.7 µH Shielded Drum Core, Wirewound Inductor 2.6 A 105mOhm Max 2-SMD The SRP4020TA-4R7M is a compact surface-mount power inductor designed for use in high-efficiency power conversion and energy storage applications. It is optimized for switching regulators, DC-DC converters, and filtering circuits where stable inductance, low core loss, and reliable current handling are required. The device features a magnetically shielded construction that minimizes electromagnetic interference, making it suitable for densely populated electronic assemblies. Its robust design supports consistent performance across a wide range of operating conditions, contributing to improved system efficiency and reduced noise. Construction and Materials The component is manufactured using a ferrite core with integrated winding, enclosed in a molded structure that provides mechanical stability and environmental protection. The shielding structure reduces flux leakage and enhances electromagnetic compatibility. External terminations are designed for reliable solderability and strong adhesion to standard printed circuit board pads. Electrical Characteristics The inductor provides a nominal inductance corresponding to its designation and maintains stability under rated operating conditions. It exhibits low direct current resistance to minimize conduction losses and supports moderate to high current levels without significant saturation. The component is engineered to maintain performance over variations in temperature and frequency typical of switching power applications. Thermal Performance The device is capable of operating within standard industrial temperature ranges, with thermal characteristics that support efficient heat dissipation through the PCB. Its construction helps maintain inductance stability and prevents degradation under thermal stress. Mechanical Characteristics The package is a low-profile, surface-mount form factor suitable for automated assembly. The compact footprint enables use in space-constrained designs, while the structure ensures durability during handling and reflow soldering processes. Applications Typical applications include step-down and step-up voltage regulators, power management modules, portable electronics, telecommunications equipment, and general-purpose filtering where compact size and efficient performance are critical. Reliability and Compliance The component is designed to meet common industry reliability standards for surface-mount passive devices. It is compatible with standard reflow soldering processes and is typically compliant with environmental regulations governing hazardous substances. #commonpartslibrary #inductor

Audio Transformers / Signal Transformers POE70P Flyback 7uH 5.0 V 1.4 A SMD,12.7x10.5mm Pulse Transformers RoHS The POE70P-50LD, manufactured by Coilcraft, is a magnetic component designed for PoE applications, where electrical power is delivered together with data over Ethernet cables. It is optimized for isolated DC-DC conversion in network-powered devices. Key Characteristics Part Type: PoE transformer / flyback transformer Technology: Magnetic (ferrite core) transformer Mounting: Surface-mount (SMT) Power Rating: ~7 W Isolation Voltage: up to 1500 Vrms Input Range: typically 36–72 V (PoE standard range) Output Example: ~5 V / 1.4 A (depending on design) Core Material: Ferrite Operating Temp: −40 °C to +85 °C Function (How it works) Converts high-voltage PoE input into low-voltage DC output Provides galvanic isolation between Ethernet line and device Works in a flyback converter topology Supports efficient energy transfer and EMI control Typical Applications IP cameras VoIP phones Wireless access points Network switches Industrial IoT devices #CommonPartsLibrary #Transformer