The ESP32-S3-PICO-1-N8R8 is a highly integrated System-in-Package (SiP) module from Espressif based on the ESP32-S3 SoC. It is designed for compact, low-power IoT applications requiring strong wireless performance, rich peripherals, and minimal external components. This variant (N8R8) integrates 8 MB of SPI flash and 8 MB of PSRAM, making it suitable for memory-intensive applications such as AIoT, voice processing, and graphical user interfaces. The module integrates RF circuitry, crystal oscillator, power management, and memory into a single package, significantly reducing PCB size and BOM cost while improving reliability. ⚡ Key Features Processor & Performance Dual-core Xtensa LX7 microprocessor Up to 240 MHz clock speed Hardware acceleration for AI/ML and vector operations Memory 8 MB SPI Flash 8 MB PSRAM Internal SRAM for fast access tasks Wireless Connectivity 2.4 GHz Wi-Fi 802.11 b/g/n Bluetooth 5 (LE) support Integrated RF front-end Peripherals GPIO, SPI, I2C, UART, ADC, PWM USB 1.1 OTG support RMT, I2S, SD/MMC interface Touch sensor support Power & Efficiency Low-power sleep modes for battery-powered devices Integrated power management circuitry (SiP-level integration) Wide operating voltage: 3.0V – 3.6V Integration Advantages Built-in crystal oscillator Integrated RF matching components Reduced external component count (SiP design) Compact footprint for space-constrained designs 📌 Typical Applications Smart home devices IoT sensors and controllers Voice-enabled AI devices Wearables HMI (Human Machine Interface) Industrial monitoring systems

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-S3-WROOM-1-N16R8 is a high-performance Wi-Fi + Bluetooth Low Energy (BLE) module developed by Espressif Systems. It is built around the ESP32-S3 SoC, featuring a dual-core Xtensa LX7 32-bit processor running up to 240 MHz. This module integrates 16 MB Flash memory and 8 MB PSRAM, making it suitable for memory-intensive applications such as AI, image processing, and advanced IoT systems. It also includes an onboard PCB trace antenna, RF circuitry, crystal oscillator, and power management components—allowing designers to quickly integrate wireless connectivity into compact embedded designs. Key Features Processing & Memory Dual-core Xtensa LX7 CPU, up to 240 MHz 384 KB ROM, 512 KB SRAM + 16 KB RTC SRAM 16 MB Flash (Quad SPI) 8 MB PSRAM (Octal/Quad SPI) Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 5 (LE) + Mesh support Integrated PCB antenna Peripherals & Interfaces Up to 36 GPIOs Interfaces: UART, SPI, I2C, I2S, PWM, ADC, USB OTG Built-in USB Serial/JTAG support Supports touch sensors, timers, watchdogs, CAN (TWAI) Electrical Characteristics Supply voltage: 3.0 V – 3.6 V TX power: up to ~20.5 dBm RX sensitivity: ~-103.5 dBm Operating temp: −40 °C to +65 °C (typical) Advanced Capabilities Optimized for AI acceleration (vector instructions) Suitable for voice recognition, image processing, and edge AI Low-power modes for battery-operated devices| Typical Applications IoT devices and sensor hubs Smart home & home automation AIoT (voice/image recognition) Industrial automation & monitoring Wearables and health devices USB-connected embedded systems #Module #RF-Transceiver #ESP32-S3

ESP32-S3-WROOM-1-N8 is a high-performance Wi-Fi and Bluetooth Low Energy (BLE) module from Espressif Systems. It is built around the ESP32-S3 SoC, featuring a dual-core Xtensa LX7 processor, integrated 2.4 GHz Wi-Fi and Bluetooth 5 LE connectivity, 8 MB SPI flash memory, and a PCB antenna. The module is optimized for AIoT, edge computing, human-machine interfaces, smart devices, and industrial IoT applications. Key Features Dual-core Xtensa® LX7 CPU running up to 240 MHz for high-performance embedded applications. 8 MB onboard SPI Flash (N8 variant) for firmware and data storage. 2.4 GHz Wi-Fi (802.11 b/g/n) with data rates up to 150 Mbps. Bluetooth 5 LE support including: Long Range mode 2 Mbps PHY Bluetooth Mesh Extended Advertising AI acceleration support through ESP32-S3 vector instructions for machine learning and signal-processing workloads. USB 1.1 OTG and USB Serial/JTAG integrated, simplifying debugging and USB device applications. Up to 45 GPIOs with extensive peripheral support: SPI I²C I²S UART PWM ADC Touch Sensors TWAI® (CAN-compatible) Camera Interface LCD Interface SDIO Host MCPWM Integrated 40 MHz crystal oscillator, RF matching circuitry, and PCB antenna for reduced external component count. Operating voltage range: 3.0 V to 3.6 V. Compact surface-mount module suitable for space-constrained designs. Typical Applications Smart home and home automation devices HMI displays and touchscreen products Voice recognition and audio processing Edge AI and machine learning applications Industrial IoT gateways and sensors Video streaming and camera systems USB-connected embedded devices Smart agriculture and healthcare equipment N8 specifically indicates 8 MB Flash and no PSRAM, making it a good choice for applications requiring substantial program storage but not large external RAM. #RF-transceiver #Module #ESP32

QFN-68(7x7) Power Management - Specialized ROHS The RK806-1 is a multi-channel PMIC designed to deliver and manage power for modern embedded platforms. It integrates multiple high-efficiency DC-DC buck converters, LDO regulators, and a configurable power sequencing controller in a compact QFN-68 package. It is tightly coupled with Rockchip SoCs and is responsible for generating stable voltage rails for CPU cores, GPU, DDR memory, and peripheral blocks. ⭐ Key Features ⚡ 1. High-Integration Power Architecture Multiple synchronous buck converters (high-current rails for CPU/GPU) Several LDO regulators for low-noise analog and IO domains Supports dynamic voltage scaling (DVS) for performance optimization 🔌 2. Wide Output Capability Output voltage range: ~0.5 V to 3.4 V per channel Designed for modern low-voltage SoC power domains Supports both high-current and low-noise power rails 🧠 3. Programmable Power Sequencing OTP / register-configurable power-up & power-down sequence Ensures safe startup for multi-rail SoCs Supports synchronized sequencing with multiple PMICs 📡 4. Digital Control Interface I²C and SPI interface for configuration and control Real-time voltage adjustment per processor demand Register-based control for power modes and telemetry 🛡️ 5. Protection & Reliability Features Over-voltage protection (OVP) Over-current protection (OCP) Thermal shutdown protection Soft-start for inrush current control ⚙️ 6. Efficiency & Performance Optimizations High-frequency switching (~MHz range) for smaller external components Fast transient response for CPU load changes Low standby current for power-sensitive designs 📦 7. Package & Integration QFN-68 (7×7 mm) compact package High thermal efficiency for dense PCB layouts Minimal external components required 📌 Typical Applications Single-board computers (SBCs) AI edge computing devices Tablets and industrial embedded systems Consumer electronics using Rockchip SoCs (e.g., RK3588 platforms) #commonpartslibrary #integratedcircuit #powermanagement

Power Inductors AIUR-06-122K IND-TH_BD13.5-P7.50-D0.8 LCSC Part Number: C1331491 undefined Manufactured by ABRACON

Inductors/Coils/Transformers AISC-0402-47NJ-T IND-SMD_L1.2-W0.6 LCSC Part Number: C186838 JLCPCB Part Class: Extended Part Manufactured by ABRACON

Inductors/Coils/Transformers AISC-0402-2N2J-T IND-SMD_L1.0-W0.5-2 LCSC Part Number: C186817 JLCPCB Part Class: Extended Part Manufactured by ABRACON

Inductors/Coils/Transformers AISC-0402-6N2G-T IND-SMD_L1.2-W0.6 LCSC Part Number: C186801 JLCPCB Part Class: Extended Part Manufactured by ABRACON

Inductors/Coils/Transformers AISC-0805-R39J-T IND-SMD_L2.3-W1.8 LCSC Part Number: C186966 JLCPCB Part Class: Extended Part Manufactured by ABRACON

Power Inductors AIAP-03-822K IND-TH_BD11.4-L22.9-P26.90-D0.8 LCSC Part Number: C186790 JLCPCB Part Class: Extended Part Manufactured by ABRACON

Inductors/Coils/Transformers AISC-1008-2R7J-T IND-SMD_L2.9-W2.8 LCSC Part Number: C187064 JLCPCB Part Class: Extended Part Manufactured by ABRACON

Inductors/Coils/Transformers AISC-0805-R47J-T IND-SMD_L2.3-W1.8 LCSC Part Number: C186967 JLCPCB Part Class: Extended Part Manufactured by ABRACON

Touch Sensors AI32 SOP-8_L4.9-W3.9-P1.27-LS6.0-BL LCSC Part Number: C441719 JLCPCB Part Class: Extended Part Manufactured by Sam&wing(芯网)

Air Pump

Inductors/Coils/Transformers AISC-0805-R68G-T IND-SMD_L2.3-W1.7 LCSC Part Number: C186930 JLCPCB Part Class: Extended Part Manufactured by ABRACON

Inductors/Coils/Transformers AISC-0603-R068G-T IND-SMD_L1.8-W1.2 LCSC Part Number: C186858 JLCPCB Part Class: Extended Part Manufactured by ABRACON

Inductors/Coils/Transformers AISC-0603-R033J-T IND-SMD_L1.8-W1.2 LCSC Part Number: C186891 JLCPCB Part Class: Extended Part Manufactured by ABRACON

Inductors/Coils/Transformers AISC-0603-R018G-T IND-SMD_L1.8-W1.1 LCSC Part Number: C186848 JLCPCB Part Class: Extended Part Manufactured by ABRACON

Inductors/Coils/Transformers AISC-0603-R027G-T IND-SMD_L1.8-W1.2 LCSC Part Number: C186851 JLCPCB Part Class: Extended Part Manufactured by ABRACON

Inductors/Coils/Transformers AISC-0603-R072J-T IND-SMD_L1.8-W1.2 LCSC Part Number: C186898 JLCPCB Part Class: Extended Part Manufactured by ABRACON