ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 1.0GHz 624-FCBGA (21x21) #CommonPartsLibrary #IntegratedCircuit #Microprocessor #MCIMX6

ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 852MHz 624-FCBGA (21x21) #CommonPartsLibrary #IntegratedCircuit #Microprocessor #MCIMX6

ARM® Cortex®-A53 Microprocessor IC i.MX8ML 4 Core, 64-Bit 1.8GHz 548-LFBGA (15x15) #CommonPartsLibrary #IntegratedCircuit #Embedded #Microprocessor #i.MX8ML

OSD32MP15x Embedded Module Arm® Dual Cortex®-A7, Arm® Cortex®-M4 NEON™ SIMD 650MHz, 209MHz #CommonPartsLibrary #IntegratedCircuit #Embedded #Microcontroller #Microprocessor #FPGA

2.4 GHz Wi-Fi (802.11 b/g/n) and Bluetooth® 5 module. Built around ESP8684 series of SoC, RISC-V single-core microprocessor 2 MB/4 MB flash in chip package #ESP32 #WiFi #RISC-V

2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module Built around ESP32-S3 series of SoCs, Xtensa® dual-core 32-bit LX7 microprocessor Flash up to 32 MB (Octal), PSRAM up to 16 MB (Octal) 33 GPIOs, rich set of peripherals On-board PCB antenna1.0 Espressif Manufacturer Recommendations 3.25mm ESP32-S3-WROOM-2-N32R8V

ARM® Cortex®-A53, ARM® Cortex®-M5F, ARM® Cortex®-R5F Microprocessor IC Sitara™ 5 Core, 64-Bit 1GHz, 400MHz, 800MHz 441-FCBGA (17.2x17.2) #CommonPartsLibrary #IntegratedCircuit #Microprocessor #Sitara™

Zynq® UltraScale+™ Kria™ Embedded Module ARM® Cortex®-A53 Arm® Cortex®-R5F 533MHz, 1.333GHz 4GB 16GB eMMC, 64MB QSPI #CommonPartsLibrary #IntegratedCircuit #Embedded #Microcontroller #Microprocessor #FPGA-Module

The ESP32-DEVKITC-VE evaluation kit from Espressif Systems is a high-performance development platform for RF, RFID, and wireless applications. It features the ESP32-WROVER-E with embedded Xtensa dual-core 32-bit LX6 microprocessor running up to 240 MHz, with 8MB Flash and 8MB PSRAM for efficient data processing. This board supports Wi-Fi 802.11 b/g/n and Bluetooth® Smart Ready 4.x (BLE) connectivity at 2.4GHz, offering wireless communication options. With 448KB ROM, 520KB SRAM, and 16KB SRAM in RTC, it provides ample memory for complex applications. It includes up to 24 GPIOs, SD card, UART, SPI, SDIO, I2C, LED and motor PWM, I2S, IR, pulse counter, capacitive touch sensor, ADC, DAC, and TWAI® (compatible with ISO 11898-1/CAN 2.0) #commonpartslibrary #ESP32-WROVER-E #evaluationboard

Low supply current makes the MAX803/MAX809/MAX810 ideal for use in portable equipment. The MAX803 is available in a 3-pin SC70 package, and the MAX809/MAX810 are available in 3-pin SC70 or SOT23 packages. #integrated-circuit #microprocessor

ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 361-TFBGA (12x12) # Engineering Specification ## Product Name STM32MP157CAC3 ## General Description STM32MP157CAC3 is a high-performance microprocessor unit that combines application processing and real-time control capabilities within a single integrated circuit. The device is designed to support advanced embedded systems requiring a balance of computing performance, deterministic control, multimedia processing, connectivity, and security functionality. The component integrates multi-core processing resources, memory interfaces, graphics capabilities, peripheral controllers, and communication subsystems to enable the development of sophisticated embedded platforms. Its heterogeneous architecture allows high-level operating systems and real-time firmware to operate simultaneously, supporting applications that require both user-interface functionality and low-latency control. The device is intended for industrial automation, human-machine interface systems, edge computing platforms, communication equipment, medical devices, smart infrastructure, and Internet of Things applications. Its architecture enables consolidation of system functions, reducing component count and simplifying overall hardware design. The design emphasizes processing efficiency, system scalability, power management, security, and long-term reliability. It supports advanced software ecosystems and facilitates the development of connected embedded products with graphical interfaces, networking capabilities, and real-time operational control. ## Functional Requirements ### Application Processing The device shall provide application-level processing capabilities suitable for operating systems, middleware, and user applications. ### Real-Time Processing The device shall support deterministic control functions for time-critical embedded operations. ### Multimedia Support The component shall support graphical and multimedia processing functions for display and user-interface applications. ### System Integration The device shall integrate processing, communication, and peripheral functions within a unified embedded computing platform. ## Electrical Requirements ### Power Management The device shall support efficient power operation and multiple power management modes to optimize energy consumption. ### Memory Interface Support The component shall support external memory devices for program execution, data storage, and system operation. ### Peripheral Connectivity The device shall provide interfaces for communication, control, monitoring, and external subsystem integration. ### Signal Integrity The design shall support reliable operation across supported interface standards and operating conditions. ## Processing Architecture Requirements ### Multi-Core Operation The device shall support concurrent execution of application and real-time workloads through integrated processing resources. ### Operating System Support The architecture shall support embedded operating systems and software frameworks suitable for advanced application development. ### Security Features The device shall support hardware-based mechanisms intended to protect system integrity, software assets, and sensitive data. ### Resource Management The component shall support efficient allocation of processing, memory, and peripheral resources. ## Mechanical Requirements ### Surface Mount Construction The device shall be supplied in a high-density surface mount package suitable for automated manufacturing processes. ### PCB Integration The package shall support integration into multilayer printed circuit boards designed for high-performance embedded systems. ### Structural Integrity The device shall maintain electrical and mechanical reliability during assembly and operational service life. ## Environmental Requirements ### Operating Conditions The component shall operate reliably within environmental conditions commonly encountered in industrial and embedded applications. ### Thermal Performance The device shall support stable operation under sustained processing workloads and associated thermal conditions. ### Storage and Handling The component shall maintain physical and electrical integrity during transportation, storage, and manufacturing processes. ## Quality Requirements ### Reliability The device shall provide dependable long-term operation in embedded and industrial computing environments. ### Verification Processing, peripheral, communication, and system functions shall be validated through applicable testing and qualification procedures. ### Compliance The product shall conform to relevant semiconductor, quality, and embedded computing standards applicable to its intended use. ## Documentation Requirements Technical documentation shall include processor architecture information, hardware integration guidelines, memory interface recommendations, power management considerations, software development support, security features, and application design guidance. ## Classification Tags #STM32MP157CAC3 #STM32MP1 #Microprocessor #MPU #EmbeddedProcessor #ARMProcessor #EmbeddedLinux #RealTimeControl #IndustrialAutomation #HumanMachineInterface #EdgeComputing #IoTGateway #EmbeddedSystems #SystemOnChip #SoC #ApplicationProcessor #GraphicsProcessor #ConnectivityPlatform #IndustrialElectronics #PCBDesign #HardwareDevelopment #ElectricalEngineering #CommonPartsLibrary #ComponentLibrary #EngineeringSpecification #TechnicalDocumentation #SystemIntegration #SecureEmbeddedSystems #MulticoreProcessing

Remote Receiver Sensor 38.0kHz 45m Through Hole This IR receiver series is optimized for long burst remote control systems in different environments. The customer can chose between different IC settings (AGC variants), to find the optimum solution for his application. The higher the AGC, the better noise is suppressed, but the lower the code compatibility. The devices contain a PIN diode and a preamplifier assembled on a lead frame. The epoxy package contains an IR filter. The demodulated output signal can be directly connected to a microprocessor for decoding. These components have not been qualified to automotive specifications. Individual IC settings to reach maximum performance • Immunity against noise (lamps, LCD TV, Wi-Fi) • Low supply current • Photo detector and preamplifier in one package • Supply voltage: 2.0 V to 5.5 V VS1838B #CommonPartsLibrary #Sensor #Transducer #Optical-Sensor #Photo-Detectors #Remote-Receiver #TSOP38238

System On Chip (SOC) IC It integrates multiple processing units including CPUs, DSPs, AI accelerators, and GPU into a single chip to handle vision processing, deep learning, sensor fusion, and real-time control in automotive and industrial systems. • C7x floating point, vector DSP, up to 1.0GHz, 80 GFLOPS, 256 GOPS • Deep-learning matrix multiply accelerator (MMA), up to 8 TOPS (8b) at 1.0GHz • Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators • Depth and Motion Processing Accelerators (DMPAC) • Dual 64-bit Arm® Cortex®-A72 microprocessor subsystem at up to 2.0GHz – 1MB shared L2 cache per dual-core Cortex®- A72 cluster – 32KB L1 DCache and 48KB L1 ICache per Cortex®-A72 core • Six Arm® Cortex®-R5F MCUs at up to 1.0GHz – 16K I-Cache, 16K D-Cache, 64K L2 TCM – Two Arm® Cortex®-R5F MCUs in isolated MCU subsystem – Four Arm® Cortex®-R5F MCUs in general compute partition • Two C66x floating point DSP, up to 1.35GHz, 40GFLOPS, 160GOPS • 3D GPU PowerVR® Rogue 8XE GE8430, up to 750MHz, 96GFLOPS, 6Gpix/sec • Custom-designed interconnect fabric supporting near max processing entitlement Memory subsystem: • Up to 8MB of on-chip L3 RAM with ECC and coherency – ECC error protection – Shared coherent cache – Supports internal DMA engine • External Memory Interface (EMIF) module with ECC – Supports LPDDR4 memory types – Supports speeds up to 4266MT/s – 32-bit data bus with inline ECC • General-Purpose Memory Controller (GPMC) • 512KB on-chip SRAM in MAIN domain, protected by ECC #CommonPartsLibrary #IntegratedCircuit

The ESP32-S3-PICO-1-N8R8 is a highly integrated System-in-Package (SiP) module from Espressif based on the ESP32-S3 SoC. It is designed for compact, low-power IoT applications requiring strong wireless performance, rich peripherals, and minimal external components. This variant (N8R8) integrates 8 MB of SPI flash and 8 MB of PSRAM, making it suitable for memory-intensive applications such as AIoT, voice processing, and graphical user interfaces. The module integrates RF circuitry, crystal oscillator, power management, and memory into a single package, significantly reducing PCB size and BOM cost while improving reliability. ⚡ Key Features Processor & Performance Dual-core Xtensa LX7 microprocessor Up to 240 MHz clock speed Hardware acceleration for AI/ML and vector operations Memory 8 MB SPI Flash 8 MB PSRAM Internal SRAM for fast access tasks Wireless Connectivity 2.4 GHz Wi-Fi 802.11 b/g/n Bluetooth 5 (LE) support Integrated RF front-end Peripherals GPIO, SPI, I2C, UART, ADC, PWM USB 1.1 OTG support RMT, I2S, SD/MMC interface Touch sensor support Power & Efficiency Low-power sleep modes for battery-powered devices Integrated power management circuitry (SiP-level integration) Wide operating voltage: 3.0V – 3.6V Integration Advantages Built-in crystal oscillator Integrated RF matching components Reduced external component count (SiP design) Compact footprint for space-constrained designs 📌 Typical Applications Smart home devices IoT sensors and controllers Voice-enabled AI devices Wearables HMI (Human Machine Interface) Industrial monitoring systems

Zilog Z80 microprocessor family, fourth-generation enhanced 8-bit CPU architecture with high computational performance and efficient memory utilization. Features two complete sets of general-purpose registers (main and alternate register banks) for fast context switching, two 16-bit index registers (IX and IY), stack pointer, program counter, refresh register, and interrupt register. Supports a single +5V power supply and interfaces directly with standard memory and peripheral devices. Includes advanced interrupt handling, daisy-chain interrupt capability, and built-in dynamic RAM refresh support. Widely used in industrial control systems, embedded equipment, terminals, instrumentation, retro computers, and communication devices. Search Keywords: Z80 CPU, Zilog Z80, Z84C00, Z8400, 8-bit microprocessor, enhanced Z80 processor, DIP40 CPU, CMOS Z80, NMOS Z80, embedded processor, industrial controller CPU, retro computer processor, vintage microprocessor, dynamic RAM refresh CPU, interrupt controller compatible CPU Hashtags: #Z80 #Zilog #Z84C00 #Z8400 #8BitCPU #Microprocessor #EmbeddedSystems #IndustrialElectronics #RetroComputing #VintageComputing #DIP40 #ComputerArchitecture #DigitalElectronics #CPU #ClassicComputingMicroprocessors - MPU 6MHz Z80 CMOS CPU XT