ARM Microcontrollers - MCU ARM M4 1024 FLASH 168 Mhz 192kB SRAM 100-LQFP (14x14) Arm® Cortex®-M4 32b MCU+FPU, 210DMIPS, up to 1MB Flash/192+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera • Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator) allowing 0-wait state execution from Flash memory, frequency up to 168 MHz, memory protection unit, 210 DMIPS/ 1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions • Memories – Up to 1 Mbyte of Flash memory – Up to 192+4 Kbytes of SRAM including 64- Kbyte of CCM (core coupled memory) data RAM – 512 bytes of OTP memory – Flexible static memory controller supporting Compact Flash, SRAM, PSRAM, NOR and NAND memories • LCD parallel interface, 8080/6800 modes • Clock, reset and supply management – 1.8 V to 3.6 V application supply and I/Os – POR, PDR, PVD and BOR – 4-to-26 MHz crystal oscillator – Internal 16 MHz factory-trimmed RC (1% accuracy) – 32 kHz oscillator for RTC with calibration – Internal 32 kHz RC with calibration • Low-power operation – Sleep, Stop and Standby modes –VBAT supply for RTC, 20×32 bit backup registers + optional 4 KB backup SRAM • 3×12-bit, 2.4 MSPS A/D converters: up to 24 channels and 7.2 MSPS in triple interleaved mode • 2×12-bit D/A converters • General-purpose DMA: 16-stream DMA controller with FIFOs and burst support • Up to 17 timers: up to twelve 16-bit and two 32- bit timers up to 168 MHz, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input • Debug mode – Serial wire debug (SWD) & JTAG interfaces – Cortex-M4 Embedded Trace Macrocell™ • Up to 140 I/O ports with interrupt capability – Up to 136 fast I/Os up to 84 MHz – Up to 138 5 V-tolerant I/Os • Up to 15 communication interfaces – Up to 3 × I2C interfaces (SMBus/PMBus) – Up to 4 USARTs/2 UARTs (10.5 Mbit/s, ISO 7816 interface, LIN, IrDA, modem control) – Up to 3 SPIs (42 Mbits/s), 2 with muxed full-duplex I2S to achieve audio class accuracy via internal audio PLL or external clock – 2 × CAN interfaces (2.0B Active) – SDIO interface • Advanced connectivity – USB 2.0 full-speed device/host/OTG controller with on-chip PHY – USB 2.0 high-speed/full-speed device/host/OTG controller with dedicated DMA, on-chip full-speed PHY and ULPI – 10/100 Ethernet MAC with dedicated DMA: supports IEEE 1588v2 hardware, MII/RMII #CommonPartsLibrary #IntegratedCircuit #Microcontroller #STM32F407

WiFi Modules ESP32-S3-MINI-1-N4R2 BULETM-SMD_ESP32-S3-MINI-1-N8 LCSC Part Number: C3013941 JLCPCB Part Class: Extended Part Manufactured by ESPRESSIF Espressif ESP32-S3-MINI-1/1U Wi-Fi and Bluetooth LE MCU module based on ESP32-S3, dual-core 32-bit Xtensa LX7 processor up to 240MHz, supports 2.4GHz Wi-Fi and Bluetooth LE, 8MB Quad SPI flash, optional 2MB Quad SPI PSRAM, up to 80MHz SPI flash clock, integrated low-power co-processor, -40°C to +85°C operating temperature, compact SMD module for IoT, smart home, embedded systems and wearable electronics; ESP32-S3-MINI-1 includes PCB antenna, ESP32-S3-MINI-1U supports external antenna connector. Search Keywords: ESP32-S3-MINI-1, ESP32-S3-MINI-1U, ESP32-S3-MINI-1-N8, ESP32-S3-MINI-1-N4R2, ESP32-S3-MINI-1U-N8, ESP32-S3-MINI-1U-N4R2, Espressif ESP32-S3-MINI, ESP32-S3 WiFi Bluetooth module, ESP32-S3 BLE module, ESP32-S3 MCU module, ESP32-S3-MINI 8MB flash, ESP32-S3-MINI 2MB PSRAM, ESP32-S3-MINI PCB antenna, ESP32-S3-MINI external antenna, ESP32-S3-MINI-1U antenna connector, ESP32-S3 SMD module, ESP32-S3 IoT module, ESP32-S3-MINI datasheet Hashtags: #ESP32S3MINI1 #ESP32S3MINI1U #ESP32S3MINI1N8 #ESP32S3MINI1N4R2 #ESP32S3MINI1UN8 #ESP32S3MINI1UN4R2 #Espressif #ESP32S3 #ESP32Module #WiFiModule #BluetoothLEModule #BLEModule #MCUModule #IoTModule #SMDModule #PCBantenna #ExternalAntenna #XtensaLX7 #8MBFlash #2MBPSRAM

2.4GHz Wi-Fi+Bluetooth LE SoC ESP32-S3FH4R2 is a highly integrated low-power Wi-Fi and Bluetooth LE System-on-Chip (SoC) from Espressif Systems. It is based on a dual-core Xtensa® LX7 processor running at up to 240 MHz and is designed for IoT, smart home, industrial control, AIoT, audio processing, and embedded applications. The ESP32-S3FH4R2 variant includes 4 MB of in-package Quad SPI Flash and 2 MB of in-package Quad SPI PSRAM, reducing external component count and simplifying PCB design. Key Features Dual-core Xtensa® LX7 CPU Up to 240 MHz operating frequency 32-bit architecture with floating-point unit (FPU) SIMD instructions for AI and signal-processing workloads Integrated Memory 4 MB in-package Flash 2 MB in-package PSRAM 512 KB on-chip SRAM 384 KB ROM Additional RTC memory for low-power operation Wireless Connectivity IEEE 802.11 b/g/n 2.4 GHz Wi-Fi Bluetooth® 5 Low Energy (LE) Long-range and low-power wireless communication support Rich Peripheral Set Up to 45 programmable GPIOs USB OTG and USB Serial/JTAG SPI, I²C, I²S, UART, SDIO TWAI® (CAN 2.0 compatible) Camera interface LCD interface PWM, pulse counter, RMT, DMA controller Analog Features Two 12-bit SAR ADCs Temperature sensor 14 capacitive touch sensing inputs Security Features Secure Boot Flash Encryption AES, SHA, RSA, HMAC hardware accelerators True Random Number Generator (RNG) Digital Signature peripheral Low-Power Operation Multiple power-saving modes ULP-RISC-V coprocessor ULP-FSM coprocessor Deep-sleep support with RTC memory retention

ARM® Cortex®-M4 series Microcontroller IC 32-Bit Single-Core 168MHz 1MB (1M x 8) FLASH 64-LQFP (10x10) Arm® Cortex®-M4 32b MCU+FPU, 210DMIPS, up to 1MB flash/192+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces, and camera Includes ST state-of-the-art patented technology • Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator) allowing 0-wait state execution from flash memory, frequency up to 168 MHz, memory protection unit, 210 DMIPS/ 1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions • Memories – Up to 1 Mbyte of flash memory – Up to 192+4 Kbytes of SRAM including 64- Kbyte of CCM (core coupled memory) data RAM – 512 bytes of OTP memory – Flexible static memory controller supporting CompactFlash™, SRAM, PSRAM, NOR and NAND memories • LCD parallel interface, 8080/6800 modes • Clock, reset, and supply management – 1.8 V to 3.6 V application supply and I/Os – POR, PDR, PVD and BOR – 4-to-26 MHz crystal oscillator – Internal 16 MHz factory-trimmed RC (1% accuracy) – 32 kHz oscillator for RTC with calibration – Internal 32 kHz RC with calibration • Low-power operation – Sleep, Stop, and Standby modes –VBAT supply for RTC, 20×32-bit backup registers + optional 4 KB backup SRAM • 3×12-bit, 2.4 MSPS A/D converters: up to 24 channels and 7.2 MSPS in triple interleaved mode • 2×12-bit D/A converters • General-purpose DMA: 16-stream DMA controller with FIFOs and burst support • Up to 17 timers: up to twelve 16-bit and two 32- bit timers up to 168 MHz, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input • Debug mode – Serial wire debug (SWD) & JTAG interfaces – Cortex-M4 Embedded Trace Macrocell™ • Up to 140 I/O ports with interrupt capability – Up to 136 fast I/Os up to 84 MHz – Up to 138 5 V-tolerant I/Os • Up to 15 communication interfaces – Up to 3 × I2C interfaces (SMBus/PMBus) – Up to 4 USARTs/2 UARTs (10.5 Mbit/s, ISO 7816 interface, LIN, IrDA, modem control) – Up to 3 SPIs (42 Mbits/s), 2 with muxed full-duplex I2S to achieve audio class accuracy via internal audio PLL or external clock – 2 × CAN interfaces (2.0B Active) – SDIO interface • Advanced connectivity – USB 2.0 full-speed device/host/OTG controller with on-chip PHY – USB 2.0 high-speed/full-speed device/host/OTG controller with dedicated DMA, on-chip full-speed PHY and ULPI – 10/100 Ethernet MAC with dedicated DMA: supports IEEE 1588v2 hardware, MII/RMII #commonpartslibrary #integratedcircuit #microcontroller

The ESP32-S3-PICO-1-N8R8 is a highly integrated System-in-Package (SiP) module from Espressif based on the ESP32-S3 SoC. It is designed for compact, low-power IoT applications requiring strong wireless performance, rich peripherals, and minimal external components. This variant (N8R8) integrates 8 MB of SPI flash and 8 MB of PSRAM, making it suitable for memory-intensive applications such as AIoT, voice processing, and graphical user interfaces. The module integrates RF circuitry, crystal oscillator, power management, and memory into a single package, significantly reducing PCB size and BOM cost while improving reliability. ⚡ Key Features Processor & Performance Dual-core Xtensa LX7 microprocessor Up to 240 MHz clock speed Hardware acceleration for AI/ML and vector operations Memory 8 MB SPI Flash 8 MB PSRAM Internal SRAM for fast access tasks Wireless Connectivity 2.4 GHz Wi-Fi 802.11 b/g/n Bluetooth 5 (LE) support Integrated RF front-end Peripherals GPIO, SPI, I2C, UART, ADC, PWM USB 1.1 OTG support RMT, I2S, SD/MMC interface Touch sensor support Power & Efficiency Low-power sleep modes for battery-powered devices Integrated power management circuitry (SiP-level integration) Wide operating voltage: 3.0V – 3.6V Integration Advantages Built-in crystal oscillator Integrated RF matching components Reduced external component count (SiP design) Compact footprint for space-constrained designs 📌 Typical Applications Smart home devices IoT sensors and controllers Voice-enabled AI devices Wearables HMI (Human Machine Interface) Industrial monitoring systems

The ESP32-DevKitC is an official ESP32-based development board from Espressif Systems designed for rapid prototyping and IoT application development. It integrates an ESP32 module (such as ESP32-WROOM-32E or ESP32-WROVER variants), USB-to-UART programming interface, power regulation circuitry, reset and boot buttons, and access to most ESP32 GPIOs through dual-row headers. The board is breadboard-friendly and supports wireless connectivity, making it suitable for smart devices, industrial monitoring, home automation, wearable electronics, and embedded control systems. Key Features ESP32 Dual-Core Processor Xtensa® 32-bit LX6 dual-core MCU Up to 240 MHz clock frequency High-performance embedded processing capability. Wireless Connectivity Integrated 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth Classic (BR/EDR) and Bluetooth Low Energy (BLE) support. Memory Typically includes 4 MB SPI Flash Some variants provide additional PSRAM for memory-intensive applications. Rich Peripheral Interfaces UART, SPI, I²C, I²S, SDIO ADC and DAC PWM outputs Capacitive touch sensing Pulse counter and timer peripherals. Extensive GPIO Access Most ESP32 pins are broken out to headers Supports digital I/O, interrupts, analog inputs, and communication interfaces. Development-Friendly Hardware USB-to-UART bridge for programming and debugging Dedicated EN (Reset) and BOOT buttons On-board 3.3 V regulator Breadboard-compatible layout. Flexible Power Options Powered through Micro-USB and onboard power circuitry Supports external power connections through header pins. #DevelopmentBoard

The ESP32-CAM Ai-Thinker is a compact, low-cost Wi-Fi and Bluetooth-enabled camera development module based on the ESP32-S dual-core microcontroller. It integrates an OV2640 2MP camera sensor, onboard Flash memory, PSRAM, and a MicroSD card slot, making it suitable for IoT vision applications, wireless surveillance, image capture, video streaming, face recognition, and smart home projects. The module combines wireless connectivity and image processing capabilities in a small form factor while maintaining low power consumption. Key Features ESP32-S Dual-Core Processor Tensilica Xtensa LX6 dual-core 32-bit CPU Operating frequency up to 240 MHz Computing performance up to 600 DMIPS Integrated Camera Equipped with OV2640 CMOS image sensor Maximum image resolution: 1600 × 1200 (UXGA, 2MP) Supports JPEG image compression and video streaming Memory 4 MB Flash memory External PSRAM for frame buffering and image processing 520 KB internal SRAM Wireless Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 4.2 BR/EDR and BLE support Storage Built-in MicroSD/TF card slot Supports local storage of images, videos, and data logs Peripheral Interfaces UART SPI I²C PWM ADC DAC GPIO expansion pins Power Supply Operating voltage: 5 V Low-power operation with deep-sleep capability for battery-powered applications Compact Design Module size approximately 27 mm × 40.5 mm PCB antenna onboard Optional external antenna connection on some variants

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-S3-WROOM-1-N16R8 is a high-performance Wi-Fi + Bluetooth Low Energy (BLE) module developed by Espressif Systems. It is built around the ESP32-S3 SoC, featuring a dual-core Xtensa LX7 32-bit processor running up to 240 MHz. This module integrates 16 MB Flash memory and 8 MB PSRAM, making it suitable for memory-intensive applications such as AI, image processing, and advanced IoT systems. It also includes an onboard PCB trace antenna, RF circuitry, crystal oscillator, and power management components—allowing designers to quickly integrate wireless connectivity into compact embedded designs. Key Features Processing & Memory Dual-core Xtensa LX7 CPU, up to 240 MHz 384 KB ROM, 512 KB SRAM + 16 KB RTC SRAM 16 MB Flash (Quad SPI) 8 MB PSRAM (Octal/Quad SPI) Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 5 (LE) + Mesh support Integrated PCB antenna Peripherals & Interfaces Up to 36 GPIOs Interfaces: UART, SPI, I2C, I2S, PWM, ADC, USB OTG Built-in USB Serial/JTAG support Supports touch sensors, timers, watchdogs, CAN (TWAI) Electrical Characteristics Supply voltage: 3.0 V – 3.6 V TX power: up to ~20.5 dBm RX sensitivity: ~-103.5 dBm Operating temp: −40 °C to +65 °C (typical) Advanced Capabilities Optimized for AI acceleration (vector instructions) Suitable for voice recognition, image processing, and edge AI Low-power modes for battery-operated devices| Typical Applications IoT devices and sensor hubs Smart home & home automation AIoT (voice/image recognition) Industrial automation & monitoring Wearables and health devices USB-connected embedded systems #Module #RF-Transceiver #ESP32-S3

Bluetooth, WiFi 802.11b/g/n/ax, Bluetooth v5.4 Transceiver Module 2.4GHz Integrated, Chip Surface Mount Silicon Labs SiWG917 module is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWG917 module includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 16 x 21.1 x 2.3 mm package. The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, flash, ultra-low power sensor hub, and matrix vector processor. The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications. The modules come with modular radio type approvals for various countries, including USA (FCC), Canada (IC/ISED) and Japan (MIC), and are in compliance with the relevant EN standards (including EN 300 328 v2.2.2) for the conformity with the directives and regulations in EU and UK. KEY FEATURES • Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1 stream IEEE 802.11 b/g/n/ax • Bluetooth LE 5.4 • Single chip Matter Over Wi-Fi Solution • ARM® Cortex® M4 Processor with FPU subsystem up to 180 MHz with rich set of Digital and Analog Peripherals. • Wi-Fi 6 Benefits: TWT for improved efficiency and longer battery life, MUMIMO/OFDMA for Higher Throughput, network capacity and low latency • Best in Class Device and Wireless Security • WLAN Tx power up to +17.5 dBm with integrated PA • Bluetooth LE Tx power up to +17 dBm with integrated PA • WLAN Rx sensitivity as low as -95.5 dBm • Wi-Fi 4 Standby Associated mode current: 71 μA @ 1-second listen interval • Embedded Flash option up to 8 MB/ optional external Flash up to 16 MB • Embedded PSRAM option up to 2 MB/ optional external PSRAM option up to 16 MB • Ultra-low power sensor hub peripherals • Matrix Vector Processor (MVP) • Embedded Wi-Fi, Bluetooth LE, Matter, and networking stacks supporting wireless coexistence • Three software-configurable MCU application memory options for sharing the RAM between the wireless, system, and application (192/256/320 KB) • Operating temperature: -40 to +85 ºC • Operating supply range: 3.0 to 3.63 V • Supply voltage for GPIOs: 1.71 to 3.63 V #WiFi6 #BluetoothLE54 #IoTModule #WirelessSoC #SiliconLabs #EmbeddedSystems #SmartHome #IndustrialIoT #LowPowerDesign #RFModule #ConnectedDevices #EdgeComputing #MatterReady #PCBDesign #ElectronicsEngineering

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-S3-WROOM-1-N8R8 is a high-performance Wi-Fi and Bluetooth Low Energy (BLE) module from Espressif Systems, designed for advanced IoT, edge AI, smart devices, industrial automation, and embedded applications. It is based on the ESP32-S3 SoC featuring a dual-core Xtensa® LX7 processor running up to 240 MHz, integrated wireless connectivity, and enhanced AI acceleration capabilities. The N8R8 variant includes 8 MB Flash memory and 8 MB Octal SPI PSRAM, making it suitable for memory-intensive applications such as machine learning, image processing, graphical user interfaces, and data logging. Key Features Dual-core 32-bit Xtensa LX7 CPU operating up to 240 MHz Integrated 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 5 LE (Low Energy) support 8 MB Flash memory 8 MB Octal SPI PSRAM Vector instructions and hardware acceleration for AI/ML workloads Integrated PCB trace antenna USB OTG and USB Serial/JTAG support Rich peripheral set including: GPIO ADC UART SPI I²C I²S PWM USB Operating voltage: 3.0 V to 3.6 V Wireless data rates up to 150 Mbps RF output power up to 20.5 dBm High receiver sensitivity down to –104.5 dBm Surface-mount 41-pin module package Industrial operating temperature range up to -40°C to +85°C (module-dependent specification) #Module #RF-Transceiver #Esp32