Charger IC Lithium Ion 16-VQFN (3x3) The BQ24075QRGTRQ1 is an automotive-qualified standalone linear battery charger and power-path management integrated circuit designed for single-cell Li-Ion and Li-Polymer battery applications. The device integrates battery charging, system power regulation, input current limiting, and dynamic power-path management into a compact solution optimized for portable and embedded automotive systems. The charger supports USB and external adapter power sources while automatically managing system load distribution between the input supply and battery. Integrated thermal regulation and safety protection features improve reliability under varying operating conditions and harsh automotive environments. The BQ24075QRGTRQ1 supports programmable charging parameters, battery temperature monitoring, and power-good status reporting. The device is qualified for automotive applications and is suitable for infotainment systems, telematics, portable instrumentation, embedded battery-powered modules, and industrial handheld equipment. Key Features Automotive-qualified battery charger IC Single-cell Li-Ion and Li-Polymer battery support Integrated dynamic power-path management USB and adapter input compatibility Programmable fast-charge current control Integrated thermal regulation Input current limiting capability Battery temperature monitoring support Automatic charge termination functionality Short-circuit and over-temperature protection Power-good and charging status indication Compact surface-mount package Optimized for portable and embedded applications Electrical Characteristics Linear charging architecture High integration power management solution Dynamic load sharing between system and battery Stable regulated system output Programmable charging voltage and current Thermal foldback protection operation Low standby and shutdown current consumption Integrated safety timer functionality Wide input operating voltage range Applications Automotive infotainment systems Portable embedded electronics Industrial handheld equipment Battery-powered control modules Telematics systems USB-powered charging systems Portable instrumentation Data logging devices Embedded IoT products Rechargeable battery management systems Package Information Package Type: VQFN Mounting Type: Surface Mount Automotive-grade integrated circuit package RoHS compliant configuration available #commonpartslibrary #integratedcircuit #batterycharger #powermanagement #automotiveelectronics #lithiumbattery #embeddedhardware #usbcharging #portableelectronics #powerpathmanagement

4/4 Transceiver Full MII, RMII 32-VQFN (5x5) ## Engineering Specification ## General Description The **LAN8770M-I/PRA** is a Microchip Technology single-port **100BASE-T1 Ethernet physical layer transceiver** designed for automotive, industrial, and embedded networking applications. It provides Ethernet communication over a single balanced twisted pair and is suitable for compact systems requiring reliable network connectivity, low-power operation, and standard MAC interface support. The device is commonly used in automotive electronic control units, infotainment systems, telematics modules, sensor nodes, industrial control systems, and embedded Ethernet hardware. ## Device Identification Manufacturer Part Number: **LAN8770M-I/PRA** Manufacturer: **Microchip Technology** Product Family: **LAN8770** Device Category: **Integrated Circuit** Device Type: **Ethernet PHY Transceiver** Ethernet Standard: **100BASE-T1** Interface Type: **MII and RMII** Mounting Type: **Surface Mount** Package Type: **VQFN** ## Functional Description The device functions as an Ethernet physical layer transceiver that connects a host controller or microcontroller MAC interface to a single-pair Ethernet physical medium. It handles the analog and digital PHY functions required for 100BASE-T1 communication, allowing embedded systems to transmit and receive Ethernet data over a single twisted pair cable. ## Network and Interface Description The **LAN8770M-I/PRA** supports 100 Mb/s single-pair Ethernet communication and provides MII and RMII host interface options. This allows integration with microcontrollers, processors, gateways, and network controllers that support standard Ethernet MAC interfaces. The device is intended for applications where compact Ethernet connectivity and reduced cabling complexity are required. ## Electrical Description The device is designed for low-voltage operation and supports multiple supply domains according to the manufacturer’s recommended operating conditions. Proper power sequencing, decoupling, reset handling, clocking, and reference layout should be implemented to maintain stable PHY operation and signal integrity. ## Package and Mechanical Description The component is supplied in a compact surface-mount **VQFN package**, suitable for dense printed circuit board assemblies. The package supports automated assembly and is appropriate for space-constrained automotive and industrial electronic designs. ## Control and Diagnostic Description The PHY supports management and configuration through standard control interfaces used in Ethernet designs. It provides status monitoring and configuration capability for link management, operating mode selection, and system-level diagnostics. These features allow the host controller to configure and monitor Ethernet link behavior during operation. ## Automotive and Industrial Suitability The **LAN8770M-I/PRA** is suitable for embedded systems requiring robust single-pair Ethernet communication. It is applicable to automotive networking, telematics, infotainment, advanced driver assistance systems, industrial Ethernet nodes, building automation, control modules, and other connected embedded platforms. ## Mounting and Assembly Description The component is intended for surface-mount PCB assembly using standard reflow soldering processes. PCB layout should follow Microchip’s hardware design guidance, including proper power supply decoupling, controlled impedance routing, short signal paths, grounding, and separation of sensitive analog and digital sections where applicable. ## Design Considerations The design should account for Ethernet signal integrity, single-pair cable interface requirements, common-mode noise control, EMC performance, supply filtering, oscillator or clock source requirements, reset timing, thermal performance, and package solderability. The device should not be operated beyond the manufacturer’s specified electrical, thermal, or mechanical limits. ## Application Suitability The device is suitable for automotive Ethernet nodes, electronic control units, telematics modules, infotainment systems, sensor interfaces, industrial controllers, embedded gateways, connected equipment, and compact network-enabled hardware requiring 100BASE-T1 Ethernet PHY functionality. ## Hashtags #commonpartslibrary #integratedcircuit #ethernetphy #microchip #microchiptechnology #lan8770 #lan8770mipra #singlepairethernet #100baset1 #automotiveethernet #ethernettransceiver #phytransceiver #embeddednetworking #mii #rmii #vqfnpackage #smdcomponent #surfacemount #automotiveelectronics #industrialethernet #telematics #infotainment #embeddedhardware #pcbdesign #hardwaredesign #electronicscomponents #electronicparts #componentlibrary #engineeringparts #electronicsengineering

USB-C (USB TYPE-C) USB 2.0 Receptacle Connector 24 (16+8 Dummy) Position Through Hole, Right Angle The USB4085-GF-A is a USB Type-C receptacle connector designed for compact embedded and consumer electronic applications requiring USB connectivity and power delivery support. It provides a reversible plug interface compliant with USB Type-C mechanical specifications and is commonly used in portable devices, development platforms, industrial electronics, and power-enabled USB systems. This connector supports USB data communication and power connections through a surface-mount design optimized for automated PCB assembly. The device includes integrated through-hole shell stakes for enhanced mechanical retention and durability under repeated insertion cycles. Its compact footprint and standardized pin arrangement enable compatibility with modern USB Type-C implementations while maintaining reliable electrical and mechanical performance. The USB4085-GF-A is suitable for USB charging, data transfer, embedded systems, battery-powered devices, and general-purpose USB Type-C interface applications. Engineering Specification Connector Type USB Type-C Receptacle Connector USB Interface Standard USB Type-C compliant receptacle Mounting Style Surface-mount technology with through-hole shell retention tabs Contact Configuration Dual-row reversible USB Type-C contact arrangement Number of Contacts Twenty-four signal and power contacts Orientation Right-angle PCB mount Data Support USB data communication support compatible with USB Type-C applications Power Capability Supports USB power and charging applications Shielding Integrated metal shell shielding for EMI reduction and mechanical protection Mechanical Retention Reinforced through-hole shell stakes for connector stability and insertion durability Contact Material Copper alloy contacts with plated finish for conductivity and corrosion resistance Housing Material High-temperature thermoplastic suitable for reflow soldering Operating Temperature Range Industrial-grade operating temperature capability suitable for embedded electronic systems Assembly Compatibility Compatible with automated SMT reflow assembly processes Application Areas Portable electronics, embedded systems, industrial controllers, development boards, battery-powered devices, USB charging interfaces, and communication equipment #commonpartslibrary #connector #usbtypec #interface #powermanagement #embeddedhardware #electronics #usbconnector

Authentication Chip 8-UDFN (2x3) The ATECC608B-MAHDA-S is a secure authentication and cryptographic co-processor designed for hardware-based security, device authentication, encrypted communication, and secure key storage in embedded systems and IoT applications. The device integrates advanced cryptographic functionality with protected non-volatile memory to provide a secure root of trust for connected devices. The integrated security engine supports public key cryptography, secure boot validation, message authentication, key generation, digital signatures, and encrypted data exchange. The device is optimized for low-power embedded applications requiring protection against counterfeiting, unauthorized access, firmware tampering, and network-based attacks. The ATECC608B-MAHDA-S supports industry-standard cryptographic algorithms and secure provisioning workflows, enabling secure authentication in cloud-connected systems, industrial automation, consumer electronics, and automotive embedded platforms. The compact surface-mount package and low-power operation make the device suitable for highly integrated embedded designs where hardware security and identity protection are critical requirements. Key Features Hardware-based cryptographic security device Secure key storage and management Integrated authentication engine Public key cryptography support Secure boot and firmware validation capability Digital signature generation and verification Hardware random number generator Encrypted communication support Tamper-resistant key protection Secure provisioning and device identity management Low-power operation for embedded systems I2C serial communication interface Compact surface-mount package IoT and cloud authentication support Electrical Characteristics Secure non-volatile key storage architecture Low operating power consumption Hardware cryptographic acceleration Secure internal key isolation Fast authentication processing capability Wide operating voltage support Industrial temperature operation compatibility High-reliability embedded security implementation Applications IoT device authentication Secure embedded systems Cloud-connected devices Secure boot implementations Firmware integrity verification Industrial automation systems Smart home products Medical electronics Automotive embedded security Asset tracking and identification Anti-counterfeiting systems Encrypted communication platforms Package Information Package Type: SOIC Mounting Type: Surface Mount Compact embedded security package RoHS compliant configuration available #commonpartslibrary #integratedcircuit #securityic #cryptography #iotsecurity #embeddedhardware #authentication #secureboot #hardwaresecurity #encryptedcommunication

IC RF TxRx + MCU Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 2.412GHz ~ 2.484GHz 56-VFQFN Exposed Pad The ESP32-S3R8 is a high-performance wireless microcontroller system-on-chip manufactured by Espressif Systems. This device integrates dual-core processing, Wi-Fi connectivity, Bluetooth Low Energy communication, embedded memory resources, and advanced peripheral interfaces within a compact package optimized for embedded and IoT applications. The microcontroller is based on the Xtensa LX7 architecture and is designed to support edge computing, wireless communication, human-machine interfaces, audio processing, AI acceleration, and low-power connected systems. The ESP32-S3R8 includes integrated flash and RAM resources, advanced security functions, vector instruction acceleration, and extensive GPIO/peripheral capability for modern embedded development. The device is widely used in IoT devices, industrial automation systems, smart home equipment, wearable electronics, wireless sensor nodes, edge AI applications, USB-enabled embedded systems, and portable consumer electronics. Its integrated wireless functionality and high processing performance reduce external component count while simplifying system-level design for connected embedded platforms. Engineering Specification Device Type Wireless microcontroller system-on-chip Processor Architecture Dual-core Xtensa LX7 microcontroller architecture Wireless Connectivity Integrated Wi-Fi and Bluetooth Low Energy communication Processing Features High-performance embedded processing with vector instruction acceleration Memory Resources Integrated RAM and embedded memory architecture Communication Interfaces SPI I2C UART I2S USB PWM ADC GPIO interfaces Wireless Features Secure wireless networking and low-power communication support USB Capability Integrated USB communication and device functionality AI and DSP Features Vector instruction support for AI and digital signal processing workloads Security Features Hardware encryption and secure boot support Power Characteristics Low-power operating modes for battery-powered systems Package Type QFN surface-mount package Mounting Style Surface mount technology Applications IoT devices Wireless embedded systems Industrial automation Smart home electronics Edge AI applications Wearable devices Consumer electronics USB-enabled systems Sensor networks Embedded communication platforms Manufacturer Espressif Systems #commonpartslibrary #esp32 #esp32s3 #wirelessmcu #microcontroller #iot #embeddedhardware #wifi #bluetoothlowenergy #espressif #surfaceountcomponents #electronicsdesign #edgeai #wirelesscommunication #consumerelectronics

Buck-Boost Switching Regulator IC Positive Adjustable 1.2V 1 Output 3.5A (Switch) 14-VFDFN Exposed Pad The TPS63020DSJT is a high-efficiency synchronous buck-boost DC-to-DC converter manufactured by Texas Instruments. This integrated power management device is designed to provide a stable regulated output voltage from input power sources that may vary above or below the desired output level. The converter automatically transitions between buck and boost operating modes to maintain efficient and continuous voltage regulation across a wide input range. The device integrates low-resistance power MOSFETs, advanced control circuitry, and high-efficiency switching architecture to minimize power loss and optimize battery utilization in portable electronic systems. It is widely used in battery-powered applications, embedded systems, wireless communication devices, portable instrumentation, industrial electronics, and USB-powered hardware requiring compact and reliable voltage regulation. The TPS63020DSJT is optimized for systems powered by single-cell lithium-ion, lithium-polymer, or multi-cell alkaline battery configurations. Its compact package and integrated functionality reduce external component count and simplify PCB layout while delivering high power conversion efficiency and low quiescent current performance. Engineering Specification Device Type Synchronous buck-boost DC-to-DC converter Power Conversion Topology Automatic buck and boost regulation architecture Input Characteristics Supports input voltages above or below regulated output voltage Output Characteristics Stable regulated DC voltage output Switching Technology Integrated synchronous MOSFET switching architecture Efficiency Characteristics High-efficiency power conversion for battery-powered systems Control Features Automatic operating mode transition and load regulation Power Consumption Low quiescent current operation for portable electronics Thermal Characteristics Integrated thermal management and protection features Protection Features Overcurrent protection Thermal shutdown Undervoltage lockout Short-circuit protection Package Type WSON surface-mount package Mounting Style Surface mount technology Applications Portable electronics Battery-powered systems Embedded hardware Wireless communication devices USB-powered electronics Industrial control systems Portable instrumentation IoT devices Consumer electronics Power management systems Manufacturer Texas Instruments #commonpartslibrary #buckboostconverter #dcdcconverter #powermanagement #texasinstruments #powerelectronics #powersupply #embeddedhardware #portableelectronics #batterypowered #surfaceountcomponents #electronicsdesign #voltageregulator #iothardware #industrialelectronics

Buck-Boost Switching Regulator IC Positive Adjustable 2.5V 1 Output 2A 15-PowerVFQFN The TPS63070RNMT is a high-efficiency buck-boost DC-to-DC converter manufactured by Texas Instruments. This power management integrated circuit is designed to provide a stable regulated output voltage from input sources that may be above, below, or equal to the desired output voltage. The device automatically transitions between buck and boost operating modes to maintain efficient and continuous power delivery across varying supply conditions. The converter integrates low-resistance power MOSFETs and advanced control circuitry to achieve high conversion efficiency, low quiescent current, and compact implementation. It is widely used in battery-powered systems, portable electronics, embedded devices, industrial control systems, wireless communication equipment, and USB-powered applications requiring stable voltage regulation from fluctuating power sources. The TPS63070RNMT is optimized for applications demanding high power density, extended battery life, and reliable operation under dynamic load conditions. Its compact package and integrated functionality reduce external component count and simplify PCB design for modern power management architectures. Engineering Specification Device Type Synchronous buck-boost DC-to-DC converter Power Topology Automatic buck and boost mode operation Input Voltage Characteristics Supports input voltages above, below, or equal to output voltage Output Characteristics Regulated fixed or adjustable DC voltage output Switching Technology Integrated synchronous power MOSFET architecture Efficiency Characteristics High-efficiency power conversion across wide operating conditions Control Architecture Advanced PWM/PFM power regulation control Current Capability Designed for medium-to-high current portable power applications Quiescent Current Low standby current for battery-powered operation Thermal Characteristics Integrated thermal protection and efficient heat management Protection Features Overcurrent protection Thermal shutdown Undervoltage lockout Short-circuit protection Package Type VQFN surface-mount package Mounting Style Surface mount technology Applications Battery-powered electronics Portable devices USB-powered systems Industrial automation Embedded systems Wireless communication equipment IoT devices Portable instrumentation Power banks Single-cell battery applications Manufacturer Texas Instruments #commonpartslibrary #powermanagement #buckboostconverter #dcdcconverter #texasinstruments #powerelectronics #powersupply #embeddedhardware #portableelectronics #batterymanagement #surfaceountcomponents #electronicsdesign #voltageregulator #industrialelectronics #usbpower

Cellular, Navigation BeiDou, EGDE, Galileo, GLONASS, GPS, GNSS, GSM, LTE Transceiver Module 850MHz, 900MHz, 1.8GHz, 1.9GHz Antenna Not Included Surface Mount The BG95M3LA-64-SGNS is a compact low-power LTE cellular communication module designed for IoT, telematics, asset tracking, industrial automation, and embedded wireless applications. The module supports global LTE Cat M1, Cat NB2, and EGPRS connectivity, enabling reliable wide-area wireless communication for battery-powered and mobile embedded systems. The device integrates cellular modem functionality, GNSS positioning capability, power management features, and multiple peripheral communication interfaces within a highly compact surface-mount package optimized for space-constrained embedded designs. The module is engineered for low-power operation, making it suitable for long-life IoT deployments requiring efficient wireless connectivity. The BG95M3LA-64-SGNS supports integrated satellite positioning technologies including GPS, GLONASS, Galileo, and BeiDou for location-aware applications. Its robust RF performance and industrial-grade operating capability allow deployment in harsh environmental conditions and demanding remote monitoring systems. The module provides comprehensive support for embedded communication protocols and is commonly used in smart meters, telematics units, industrial gateways, environmental monitoring systems, fleet tracking devices, and connected sensor platforms. Key Features LTE Cat M1 cellular communication support LTE Cat NB2 narrowband IoT capability EGPRS fallback connectivity Integrated GNSS positioning functionality Low-power optimized architecture Global wireless network compatibility Compact surface-mount module design Embedded TCP/IP protocol stack support UART, USB, and serial communication interfaces Integrated power management subsystem Industrial operating temperature support Embedded IoT connectivity optimization High-reliability wireless communication platform Multi-constellation satellite navigation support Electrical Characteristics Low operating power consumption Wide input voltage support High RF sensitivity performance Embedded low-power sleep functionality Stable wireless communication architecture Integrated RF and baseband processing Optimized antenna interface support Industrial-grade reliability performance Fast network registration capability Applications IoT and M2M communication systems Asset tracking devices Fleet management platforms Smart utility metering Industrial automation equipment Remote environmental monitoring Smart agriculture systems Telematics and transportation electronics Portable wireless data terminals Embedded gateway systems Smart city infrastructure Connected sensor platforms Package Information Package Type: LGA Module Mounting Type: Surface Mount Compact embedded wireless module package RoHS compliant configuration available #commonpartslibrary #wirelessmodule #lte #iot #embeddedhardware #cellularcommunication #gnss #telematics #industrialautomation #assettracking

JLCPCB Part # C70377 QJ.BS-6 battery holder for cylindrical battery cells, through-hole PCB mounting, molded UL94V-0 LCP housing with tin-plated phosphor bronze battery contacts, designed for secure retention and electrical connection of a single cylindrical battery, compact vertical PCB installation, suitable for battery-powered electronic devices, embedded systems, development boards, sensors and portable equipment. Search Keywords: QJ.BS-6, QJ BS-6, battery holder, cylindrical battery holder, PCB battery holder, through hole battery holder, vertical battery holder, battery socket, battery clip holder, UL94V0 battery holder, single cell battery holder, Shenzhen Q&J Electronics battery holder, PCB battery socket #QJBS6 #BatteryHolder #BatterySocket #BatteryClip #PCBBatteryHolder #ThroughHoleBatteryHolder #CylindricalBatteryHolder #SingleCellBatteryHolder #BatteryConnector #PortableElectronics #EmbeddedHardware #PowerSupplyHardware #C70377

TSW-123-07-G-D-LL HDR-TH_TSW-123-15-L-D LCSC Part Number: C5807494 JLCPCB Part Class: Extended Part Manufactured by SAMTEC Samtec TSW series 0.025" (0.64mm) square post terminal strip/header, through-hole PCB connector available in single, double and triple row configurations, 2.54mm (0.100") or 2.00mm (0.079") pitch options, gold or tin plated contacts, precision machined square pins, customizable pin counts and stack heights, designed for board-to-board, wire-to-board and prototyping applications in industrial, embedded and electronic systems. Search Keywords: TSW terminal strip, Samtec TSW, TSW series header, square post header, 0.025 square post, 0.64mm square pin header, Samtec through hole header, 2.54mm pin header, 0.100 inch header, PCB terminal strip, board to board connector, through hole connector, Samtec TSW datasheet, pin header connector Hashtags: #SamtecTSW #TSWSeries #TerminalStrip #PinHeader #SquarePostHeader #ThroughHoleHeader #PCBConnector #BoardToBoardConnector #254mmPitch #100MilHeader #SamtecConnector #EmbeddedHardware #PrototypeConnector #ThroughHoleConnector