802.15.4 Bluetooth, Wi-Fi Bluetooth v5.0, ZigBee® Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-C6-WROOM-1-N4 is based on the ESP32-C6 single-core RISC-V microcontroller, integrating advanced wireless standards and secure connectivity in a small module format. It is designed for next-generation IoT devices that require Wi-Fi 6 efficiency, mesh networking, and Bluetooth Low Energy support. Processor: 32-bit RISC-V single-core CPU (up to 160 MHz) Wireless Connectivity: Wi-Fi 6 (802.11ax, 2.4 GHz) Bluetooth LE 5.0 IEEE 802.15.4 (Thread / Zigbee support) Memory (N4 variant): 4 MB Flash Security: Secure boot Flash encryption Cryptographic hardware acceleration #commonpartslibrary #rf #wireless #transceiver #module #zigbee

Small Footprint RMII 10/100 Ethernet Transceiver with HP Auto-MDIX Support LAN8720A-CP-TR-ABC is a low-power, single-port 10BASE-T/100BASE-TX Ethernet Physical Layer (PHY) transceiver from Microchip Technology. It is designed to connect a microcontroller, processor, or Ethernet MAC to a standard Ethernet network through an RMII (Reduced Media Independent Interface). The device is widely used in embedded networking applications such as industrial controllers, IoT gateways, IP cameras, networked printers, routers, and ESP32-based Ethernet designs. Key Features Single-chip 10/100 Mbps Ethernet PHY Supports both 10BASE-T and 100BASE-TX Ethernet operation. RMII Interface Reduced pin-count interface for easy connection to Ethernet MACs and microcontrollers. IEEE 802.3 / 802.3u Compliant Fully compliant with Fast Ethernet standards. HP Auto-MDIX Support Automatically detects and configures straight-through or crossover Ethernet cables. Auto-Negotiation Automatically selects the best available speed and duplex mode. Flexible I/O Voltage Supports LVCMOS I/O voltages from 1.6 V to 3.6 V, simplifying interfacing with different processors. Integrated 1.2 V Regulator Allows operation from a single 3.3 V supply, reducing external components. Low-Power Architecture Features multiple power-saving modes through Microchip's flexPWR® technology. Built-in Diagnostics and Reliability Features Loopback modes, automatic polarity correction, link-status monitoring, and wake-up detection. Compact Package Available in a 24-pin SQFN/QFN (4 mm × 4 mm) package for space-constrained designs #CommonPartsLibrary #IntegratedCircuit

802.15.4, Bluetooth Bluetooth v5.3, Zigbee® Transceiver Module 2.4GHz Integrated, Trace Surface Mount The ESP32-H2-MINI-1-H4 is a small-form-factor, ultra-low-power connectivity module that integrates a RISC-V based MCU with modern IoT radio standards, making it suitable for smart home and mesh networking systems. Unlike ESP32 variants that focus on Wi-Fi, the ESP32-H2 family is designed for 802.15.4-based networking (Thread / Zigbee) plus BLE. 32-bit RISC-V single-core CPU Up to ~96 MHz operation (low-power optimized architecture) IEEE 802.15.4 (Thread / Zigbee support) Bluetooth Low Energy (BLE 5.x) #RF-Transceiver #Module #ESP

SLC NAND Flash Parallel/Serial 3.3V 256G-bit 32G x 8 100-Pin LBGA FLASH - NAND (SLC) Memory IC 256Gbit Parallel 100 MHz 100-LBGA (12x18) The MT29F256G08AUCABH3-10ITZ:A is a high-density 256Gb Single-Level Cell (SLC) NAND Flash memory device from Micron Technology. It provides non-volatile data storage with high reliability, fast read/write performance, and long endurance, making it suitable for industrial, networking, embedded computing, automotive, and data-logging applications. The device supports both asynchronous and synchronous interfaces and complies with the Open NAND Flash Interface (ONFI) standard for enhanced interoperability and performance. It is housed in a compact 100-ball LBGA package (12 mm × 18 mm). • Open NAND Flash Interface (ONFI) 2.2-compliant1 • Single-level cell (SLC) technology • Organization – Page size x8: 8640 bytes (8192 + 448 bytes) – Block size: 128 pages (1024K + 56K bytes) – Plane size: 2 planes x 2048 blocks per plane – Device size: 32Gb: 4096 blocks; 64Gb: 8192 blocks; 128Gb: 16,384 blocks; 256Gb: 32,768 blocks • Synchronous I/O performance – Up to synchronous timing mode 5 – Clock rate: 10ns (DDR) – Read/write throughput per pin: 200 MT/s • Asynchronous I/O performance – Up to asynchronous timing mode 5 – tRC/tWC: 20ns (MIN) – Read/write throughput per pin: 50 MT/s • Array performance – Read page: 35µs (MAX) – Program page: 350µs (TYP) – Erase block: 1.5ms (TYP) • Operating Voltage Range – VCC: 2.7–3.6V – VCCQ: 1.7–1.95V, 2.7–3.6V • Command set: ONFI NAND Flash Protocol • Advanced Command Set – Program cache – Read cache sequential – Read cache random – One-time programmable (OTP) mode – Multi-plane commands – Multi-LUN operations – Read unique ID – Copyback • First block (block address 00h) is valid when shipped from factory. For minimum required ECC, see Error Management (page 114). • RESET (FFh) required as first command after power-on • Operation status byte provides software method for detecting – Operation completion – Pass/fail condition – Write-protect status • Data strobe (DQS) signals provide a hardware method for synchronizing data DQ in the synchronous interface • Copyback operations supported within the plane from which data is read • Quality and reliability – Data retention: JESD47G compliant; see qualification report – Endurance: 60,000 PROGRAM/ERASE cycles • Operating temperature: – Commercial: 0°C to +70°C – Industrial (IT): –40ºC to +85ºC • Package – 52-pad LGA – 48-pin TSOP – 100-ball BGA – 132-ball BGA #Micron #NANDFlash #SLCNAND #FlashMemory #NonVolatileMemory #ONFI #EmbeddedSystems #IndustrialElectronics #DataStorage #MemoryIC #LBGA100 #HighReliability #MT29F256G08AUCABH310ITZA #MicronMemory #ParallelNANDFlash

Hot Swap Controller 1 Channel General Purpose 32-LQFN (5x5) The NCP81428MNTXG is a high-performance multi-phase synchronous buck controller designed for CPU, GPU, FPGA, ASIC, and high-current core power applications requiring accurate voltage regulation, fast transient response, and high efficiency. The device supports multi-phase operation with integrated gate drivers and advanced control architecture optimized for modern low-voltage, high-current power rails. It is intended for applications requiring dynamic voltage scaling, precise load-line regulation, and reliable system power management in computing, networking, telecommunications, and industrial platforms. The controller operates with external MOSFET stages and supports flexible power stage configuration for optimized thermal and efficiency performance. It incorporates differential voltage sensing, programmable protection features, current balancing between phases, and high-speed transient compensation to maintain stable operation under rapidly changing load conditions. Engineering Specification Manufacturer onsemi Manufacturer Part Number NCP81428MNTXG Device Type Multi-Phase Synchronous Buck Controller with Integrated Gate Drivers Control Topology Voltage Mode Multi-Phase PWM Control Phase Configuration Dual-Phase Controller Architecture Application Focus CPU Core Power GPU Core Regulation FPGA Power Rails ASIC Core Supplies High-Current DC-DC Regulation Input Supply Range Supports Low-Voltage Bias Supply Operation for Digital Power Systems Output Voltage Regulation Programmable Low-Voltage Output Regulation with Differential Remote Sense Capability Switching Frequency Programmable PWM Switching Frequency with Multi-Phase Interleaving Gate Driver Integration Integrated High-Side and Low-Side MOSFET Gate Drivers Current Sensing Supports Inductor DCR Sensing and Sense Resistor Current Monitoring Load-Line Support Programmable Load-Line Regulation and Droop Compensation Voltage Positioning Adaptive Voltage Positioning for Improved Transient Performance Protection Features Overcurrent Protection Overvoltage Protection Undervoltage Protection Thermal Protection Short-Circuit Protection Power-Good Monitoring Power Management Features Soft-Start Control Enable Functionality Phase Balancing Fault Monitoring Sequencing Support Compensation External Compensation Network Support for Loop Stability Optimization Efficiency Features Synchronous Rectification Support Multi-Phase Interleaving for Reduced Ripple Current Optimized Gate Drive Timing Package Type QFN Surface-Mount Package Mounting Type Surface Mount Technology Temperature Range Industrial Operating Temperature Range Target Applications Server Motherboards High-Performance Embedded Computing Networking Equipment Telecommunications Infrastructure Industrial Processing Systems Graphics and Accelerator Platforms #commonpartslibrary #integratedcircuit #powermanagement #hotswapcontrollers

8 Position Card Connector Micro SIM Surface Mount, Right Angle Gold ## Engineering Specification ## General Description The **693022010811** is a Würth Elektronik **WR-CRD Micro SIM card connector** designed for compact electronic devices requiring secure SIM card retention and reliable board-level electrical connection. It is intended for surface-mount printed circuit board assembly and is suitable for communication modules, wireless devices, embedded systems, IoT hardware, and networking equipment. The connector uses a hinged lid mechanism to hold the Micro SIM card in place during operation. ## Device Identification Manufacturer Part Number: **693022010811** Manufacturer: **Würth Elektronik** Product Series: **WR-CRD** Device Category: **Connector and Interconnect Component** Device Type: **Micro SIM Card Connector** Connector Style: **Hinge Type** Mounting Type: **Surface Mount, Right Angle** ## Functional Description The device functions as a board-mounted Micro SIM card interface. It provides mechanical retention and electrical contact between the SIM card and the host printed circuit board. The hinged lid design allows the SIM card to be placed into the connector and secured during operation, helping maintain contact stability in compact electronic assemblies. ## Mechanical Description The connector is designed with a low-profile surface-mount construction suitable for space-constrained PCB layouts. It uses a hinged card-retention mechanism and is intended for horizontal or right-angle card installation. The mechanical structure supports reliable insertion, retention, and removal of the Micro SIM card during normal use. ## Electrical Description The connector is intended for signal-level SIM card interface applications. It provides multiple gold-plated contact positions for stable electrical connection between the SIM card and the host circuit. The device should be used within the manufacturer’s specified voltage, current, contact resistance, and insulation limits. ## Material and Contact Description The connector uses copper alloy contacts with gold plating for reliable signal transfer and corrosion resistance. The housing and mechanical retention structure are designed for surface-mount assembly and repeated card handling within the rated operating conditions. ## Mounting and Assembly Description The component is suitable for automated surface-mount PCB assembly. Proper land pattern design, soldering profile control, and mechanical clearance should be followed according to the manufacturer’s recommended layout and assembly guidance. The PCB design should provide stable grounding, correct pad alignment, and adequate clearance for SIM card insertion and lid operation. ## Application Suitability The **693022010811** is suitable for cellular communication devices, IoT modules, wireless routers, embedded modems, tracking systems, smart meters, industrial communication equipment, portable electronics, and other products requiring a Micro SIM card interface. ## Design Considerations The connector should be placed in an accessible area of the PCB to allow SIM card installation and removal. Designers should avoid excessive mechanical stress on the hinged lid, improper solder joint loading, contamination of the contact area, and operation beyond the specified environmental and electrical ratings. ## Hashtags #commonpartslibrary #connector #simconnector #microsimconnector #wurthelektronik #wrcrd #cardconnector #memoryconnector #interconnect #pcbconnector #surfacemount #rightangleconnector #smtcomponent #goldplatedcontacts #embeddedhardware #iotdevices #wirelessmodules #communicationdevices #networkingequipment #pcbdesign #hardwaredesign #electronicscomponents #electronicparts #componentlibrary #engineeringparts #electronicsengineering

Board to Board & Mezzanine Connectors .050\" SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 400 Position Connector High Density Array, Male Surface Mount, Right Angle Gold SEAM-40-01-L-10-2-RA-K-TR is a high-speed, high-density board-to-board mezzanine connector from the Samtec SEARAY™ series. It features a right-angle, surface-mount design with 400 positions arranged in a 10-row open-pin-field array on a 1.27 mm (0.050") pitch. The connector utilizes Samtec's Edge Rate® contact system, providing excellent signal integrity, durability, and support for high-speed differential pair routing in demanding communication, networking, and embedded computing applications. Key Features High-density 400-position open-pin-field array connector 1.27 mm (0.050") contact pitch for compact board-to-board interconnects Right-angle, surface-mount termination Rugged Edge Rate® contact system for reliable high-speed performance Supports high-speed serial protocols and differential pair routing Suitable for power, ground, and signal connections within the same connector Gold-plated contacts for enhanced reliability and corrosion resistance Board-guide feature for improved mating alignment Current rating up to 1.9 A per contact Voltage rating up to 240 VAC / 339 VDC Tape-and-reel packaging for automated assembly processes RoHS compliant and designed for high-reliability applications #Samtec #SEARAY #SEAM4001L102RAKTR #BoardToBoardConnector #MezzanineConnector #HighSpeedConnector #HighDensityInterconnect #EdgeRate #SurfaceMount #RightAngleConnector #EmbeddedSystems #TelecomEquipment #NetworkingHardware #IndustrialElectronics #PCBDesign

ARM® Cortex®-M7 STM32H7 Microcontroller IC 32-Bit 480MHz 2MB (2M x 8) FLASH 100-LQFP (14x14) # STM32H743VIT6 ## General Description The STM32H743VIT6 is a high-performance microcontroller manufactured by STMicroelectronics and based on the Arm Cortex-M7 core. It is designed for advanced embedded applications requiring exceptional processing capability, extensive peripheral integration, high-speed memory access, and real-time control performance. The device combines powerful computational resources, floating-point processing, digital signal processing capabilities, large embedded memory, and a comprehensive set of communication interfaces within a compact package. Its architecture is optimized for industrial automation, motor control, human-machine interfaces, medical devices, robotics, data acquisition systems, audio processing, edge computing, and high-performance IoT applications. ## Key Features ### Processing Architecture * Arm Cortex-M7 processor core * High-performance real-time processing capability * Floating-point unit support * Digital signal processing functionality * Advanced instruction set architecture * Optimized embedded computing performance ### Memory Resources * Embedded Flash memory * High-speed SRAM architecture * Memory protection support * Efficient code and data execution * High-bandwidth memory access capability * Advanced cache architecture ### Communication Interfaces * USART and UART communication interfaces * SPI communication interfaces * I²C communication interfaces * CAN communication support * USB connectivity capability * Ethernet networking support * SDMMC storage interface support * Flexible external communication options ### Analog Features * High-resolution analog-to-digital conversion * Digital-to-analog conversion capability * Precision signal acquisition * Analog monitoring functionality * Sensor interface compatibility ### Timer and Control Features * Advanced control timers * General-purpose timers * PWM signal generation * Encoder interface support * Motor-control functionality * Real-time clock integration * Event-driven control architecture ### Multimedia and Processing Capabilities * Audio processing support * Signal processing applications * Graphics and display interface support * High-speed data acquisition capability * Real-time analytics support * Edge computing functionality ### Power Characteristics * Optimized performance-to-power ratio * Multiple low-power operating modes * Dynamic power management support * Efficient embedded system operation ### Package Characteristics * Surface-mount package construction * Industrial-grade packaging * High-pin-count peripheral integration * Automated assembly compatible * Suitable for complex embedded designs ### Material Construction * Advanced semiconductor technology * RoHS-compliant materials * Lead-free package construction * High-reliability integrated circuit design ### Environmental Characteristics * Suitable for industrial and commercial environments * Long operational service life * Reliable continuous operation * Stable performance across operating conditions * Robust embedded processing platform ### Application Areas * Industrial Automation Systems * Robotics and Motion Control * Motor Drive Applications * Human-Machine Interfaces * Medical Equipment * Audio Processing Systems * Data Acquisition Equipment * Embedded Computing Platforms * Industrial Networking Devices * Edge Computing Solutions * Smart Energy Systems * Advanced IoT Devices * Test and Measurement Equipment * Consumer Electronics ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade High-Performance Microcontroller Solution ## Manufacturer STMicroelectronics ## Product Family STM32H7 High-Performance Microcontroller Series #STM32H743VIT6 #STM32H7 #STMicroelectronics #CortexM7 #Microcontroller #EmbeddedSystems #IndustrialAutomation #MotorControl #Robotics #EdgeComputing #IoT #DataAcquisition #EmbeddedDesign #FirmwareDevelopment #ElectronicsEngineering

Electronic Fuse Regulator High-Side 60A 26-VQFN-HR (5x4.5) The TPS259850RQPR is an integrated eFuse power protection device designed for robust power path management in low-voltage DC systems. Manufactured by Texas Instruments, this device provides advanced protection features including overvoltage protection, undervoltage protection, overcurrent limiting, short-circuit protection, reverse current blocking, and thermal shutdown. The device is optimized for applications requiring controlled inrush current, fault isolation, and system reliability in industrial, automotive, telecommunications, and embedded electronic systems. The TPS259850RQPR supports a wide operating input voltage range and integrates programmable protection thresholds to allow flexible system-level configuration. The device includes an internal MOSFET with low on-resistance for efficient power delivery while minimizing power dissipation. Fast fault response and automatic retry functionality enhance system robustness and reduce the need for external supervisory circuitry. The device is housed in a compact QFN package suitable for space-constrained PCB designs and supports high-current operation with efficient thermal performance. The integrated protection architecture simplifies power subsystem design while improving reliability and fault tolerance. Electrical Characteristics Input operating voltage range supports low-voltage DC power rails commonly used in embedded and industrial systems. Integrated low-RDS(on) MOSFET minimizes conduction losses and improves overall efficiency. Programmable current limiting enables configurable overcurrent protection. Fast short-circuit response protects downstream circuitry during fault events. Adjustable overvoltage and undervoltage thresholds allow flexible supply monitoring. Reverse current blocking prevents back-drive conditions and protects power sources. Thermal shutdown protection disables the device during excessive junction temperature conditions. Controlled output slew rate limits inrush current during startup and hot-plug events. Automatic retry and latch-off fault management modes are supported. Power-good indication output provides system power status monitoring. Protection Features Overcurrent protection with programmable current limit threshold. Short-circuit protection with rapid fault response. Input overvoltage protection. Input undervoltage lockout protection. Reverse current and reverse polarity protection support. Thermal shutdown with automatic recovery capability. Fault timer control for transient fault management. Safe hot-swap and hot-plug operation support. Mechanical Characteristics Package type is QFN with compact footprint optimized for high-density PCB layouts. Surface-mount device compatible with automated assembly processes. Thermally enhanced package construction improves heat dissipation. RoHS-compliant and suitable for lead-free manufacturing processes. Applications Industrial power distribution systems. Automotive electronic subsystems. Telecommunication and networking equipment. Server and storage platforms. Hot-swappable modules. USB Type-C and power delivery systems. Embedded computing platforms. FPGA and processor power rail protection. Battery-powered and portable electronic equipment. #commonpartslibrary #integratedcircuit #powermanagement #regulator