Non-Isolated PoL Module DC DC Converter 1 Output 1 ~ 36V 12A 5V - 36V Input The LTM®4712 is a high efficiency buck-boost µModule® (micromodule) regulator. The switching controller, power switches, inductor and support components are included in the package. The complete design requires only a few external components, including a resistor to set frequency, a resistor to set output voltage, input, and output capacitors, a sensing resistor to achieve input or output average current regulation. The LTM4712 operates over a 5V to 36V input voltage range and can regulate output voltages between 1V and 36V. The LTM4712 supports selectable forced continuous mode (FCM)/pulse-skipping mode (PSM) operation. The current mode control enables a fast transient response to line and load changes without sacrificing stability. The SYNC input and CLKOUT output allow easy synchronization. It supports multi-phase parallel operation for high power applications. The LTM4712 is offered in a 16mm × 16mm × 8.34mm ball grid array (BGA) package suitable for automated assembly by standard surface mount equipment. The LTM4712 is RoHS-compliant. #Power-supply #DCDC-Converter

ARM® Cortex®-M0+ MSPM0 C Microcontroller IC 32-Bit 24MHz 16KB (16K x 8) FLASH 8-DSBGA (0.86x1.6) MSPM0C110x microcontrollers (MCUs) are part of the MSP highly-integrated ultra-low-power 32-bit MCU family based on the enhanced Arm® Cortex®-M0+ core platform operating at up to 24MHz frequency. These costoptimized MCUs offer high-performance analog peripheral integration, support extended temperature ranges from -40°C to 125°C, and operate with supply voltages from 1.62V to 3.6V. The MSPM0C110x devices provide up to 16KB embedded flash program memory with 1KB SRAM. These MCUs incorporate a high-speed on-chip oscillator with an accuracy from -2% to +1.2%, eliminating the need for an external crystal. Additional features include a 1-channel DMA, CRC-16 accelerator, and a variety of highperformance analog peripherals such as one 12-bit 1.5Msps ADC with VDD as the voltage reference, and an on-chip temperature sensor. These devices also offer intelligent digital peripherals such as one 16-bit advanced timer, two 16-bit general purpose timer, one windowed watchdog timer, and a variety of communication peripherals including one UART, one SPI, and one I2C. These communication peripherals offer protocol support for LIN, IrDA, DALI, Manchester, smart card, SMBus, and PMBus. The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration let customers find the MCU that meets their project needs. The architecture combined with extensive low-power modes is optimized to achieve extended battery life in portable measurement applications. MSPM0C110x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad™ kit available for purchase and design files for a target-socket board. TI also provides a free MSP Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums. Features • Core – Arm® 32-bit Cortex®-M0+ CPU, frequency up to 24MHz • Operating characteristics – Extended temperature: –40°C to 125°C – Wide supply voltage range: 1.62V to 3.6V • Memories – Up to 16KB of flash – 1KB of SRAM • High-performance analog peripherals – One analog-to-digital converter (ADC) with up to 10 total external channels, 1.7Msps at 10 bit or 1.5Msps at 12 bit with VDD as the voltage reference – Configurable 1.4V or 2.5V internal ADC voltage reference (VREF) – Integrated temperature sensor – Integrated supply monitor • Optimized low-power modes – RUN: 87µA/MHz – STOP: 609µA at 4MHz, 311µA at 32kHz – STANDBY: 5µA with SRAM retention – SHUTDOWN: 200nA • Intelligent digital peripherals – 1-channel DMA controller dedicated for ADC – Three timers supporting up to 14 PWM channels • One 16-bit advanced timers with deadband support up to 8 PWM channels • One 16-bit general purpose timer with 4 capture/compares • One 16-bit general purpose timer with 2 capture/compares – Windowed watchdog timer – BEEPER generating 1kHz, 2kHz, 4kHz, or 8kHz square wave to drive the external beeper • Enhanced communication interfaces – One UART interface supporting LIN, IrDA, DALI, smart card, Manchester and low-power operation in STANDBY mode – One I2C interface supporting FM+ (1Mbps), SMBus, PMBus, and wakeup from STOP mode – One SPI supporting up to 12Mbps • Clock system – Internal 24MHz oscillator with an accuracy from -2% to +1.2% (SYSOSC) – Internal 32kHz low-frequency oscillator (LFOSC) • Data integrity – Cyclic redundancy checker (CRC-16) • Flexible I/O features – Up to 18 GPIOs – Two 5V-tolerant open-drain IOs • Development support – 2-pin serial wire debug (SWD) • Package options – 20-pin TSSOP (PW) – 20-pin VSSOP (DGS) – 20-pin WQFN (RUK) – 16-pin SOT (DYY) – 8-pin SOT (DDF) – 8-pin WSON (DSG) – 8-pin DSBGA (YCJ) • Family members (also see Device Comparison) – MSPS003F4: 16KB of flash, 1KB of RAM – MSPS003F3: 8KB of flash, 1KB of RAM – MSPM0C1104: 16KB of flash, 1KB of RAM – MSPM0C1103: 8KB of flash, 1KB of RAM • Development kits and software (also see Tools and Software) – LP-MSPM0C1104 LaunchPad™ development kit – MSP Software Development Kit (SDK) 2 Applications • Battery charging and management • Power supplies and power delivery • Personal electronics • Building security and fire safety • Connected peripherals and printers • Grid infrastructure • Smart metering • Communication modules • Medical and healthcare • Lighting #MSPM0C1104S8YCJR #MSPM0C1104 #TexasInstruments #CortexM0Plus #Microcontroller #EmbeddedSystems #LowPowerMCU #IoT #WearableDevices #IndustrialControl #ConsumerElectronics #ADC #UART #SPI #I2C #PWM #TI #ElectronicsDesign #PCBDesign #EmbeddedDevelopment

3D accelerometer and 3D gyroscope The LSM6DS3TR-C is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 0.90 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer. The LSM6DS3TR-C supports main OS requirements, offering real, virtual and batch sensors with 4 kbyte for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element. The LSM6DS3TR-C has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps. High robustness to mechanical shock makes the LSM6DS3TR-C the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DS3TR-C is available in a plastic land grid array (LGA) package. Features  “Always-on” experience with low power consumption for both accelerometer and gyroscope  Power consumption: 0.90 mA in combo highperformance mode  Smart FIFO up to 4 kbyte based on features set  Android M compliant  Hard, soft ironing for external magnetic sensor corrections  ±2/±4/±8/±16 g full scale  ±125/±250/±500/±1000/±2000 dps full scale  Analog supply voltage: 1.71 V to 3.6 V  Independent IO supply (1.62 V)  Compact footprint, 2.5 mm x 3 mm x 0.83 mm  SPI & I2C serial interface with main processor data synchronization feature  Pedometer, step detector and step counter  Significant motion and tilt function  Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click  Embedded temperature sensor  ECOPACK®, RoHS and “Green” compliant #CommonPartsLibrary #Sensor

Accelerometer X, Y, Z Axis ±2g, 4g, 8g 1.5kHz 14-CLCC (6x6) General Description The ADXL355BEZ is a low noise, low drift, low power, three-axis MEMS accelerometer intended for high-precision sensing applications. It delivers high-resolution digital acceleration data with excellent long-term stability and minimal temperature-induced variation. The device integrates a complete sensing chain, including the MEMS sensor element, analog conditioning, analog-to-digital conversion, and digital filtering. Output data is provided through SPI or I²C interfaces, enabling straightforward integration into embedded and industrial systems. Key Features Three-axis acceleration sensing (X, Y, Z) Selectable full-scale ranges: ±2 g, ±4 g, ±8 g Low noise density (~25 µg/√Hz) Low offset and minimal temperature drift High-resolution 20-bit digital output Integrated digital filtering SPI and I²C communication interfaces Low power consumption (~200 µA typical) Wide supply voltage range (2.25 V to 3.6 V) Integrated temperature sensor Hermetically sealed package Applications Structural health monitoring Vibration measurement and analysis Tilt and inclination sensing Industrial condition monitoring Navigation and inertial systems Seismic detection Robotics and stabilization platforms Functional Description The ADXL355BEZ includes an integrated sensing and processing architecture composed of: Three-axis MEMS sensing element Analog front-end signal conditioning High-resolution ADC Digital filtering and decimation stages Temperature sensing element Digital communication interface (SPI/I²C) Configuration and control registers Electrical Characteristics (Typical) Supply voltage: 2.25 V to 3.6 V Supply current: ~200 µA Output data rate: up to 4 kHz Noise density: ~25 µg/√Hz Resolution: 20-bit Interface: SPI / I²C Mechanical and Package Information Package type: LGA (Land Grid Array) Approximate dimensions: 3 mm × 5 mm × 1 mm Hermetically sealed for improved environmental robustness Interface and Communication Supports SPI (4-wire) and I²C protocols Outputs 20-bit acceleration data per axis Data format: two’s complement Measurement Ranges ±2 g ±4 g ±8 g Environmental Specifications Operating temperature range: -40°C to +125°C Storage temperature range: -55°C to +150°C Power Management Supports measurement and standby modes Designed for low-power operation in continuous sensing applications Compliance and Reliability Industrial-grade device Designed for long-term stability RoHS compliant #commonpartslibrary #sensor #accelerometer

Temperature Sensor Digital, Infrared (IR) 14-SMD Module #CommonPartsLibrary #IntegratedCircuit #Sensor #Transducer #Temperature-Sensor #Grid-EYE #AMG883

ZED-F9T RF Receiver BeiDou, Galileo, GLONASS, GNSS, GPS -167dBm 54-LGA (22x17) Ang ZED-F9T-00B ay isang high-precision multi-band GNSS timing module mula sa u-blox na idinisenyo para sa mga application na nangangailangan ng napakatumpak na time synchronization. Gumagamit ito ng sabay-sabay na pagtanggap ng maraming GNSS constellations kabilang ang GPS, Galileo, BeiDou, at GLONASS upang makapagbigay ng nanosecond-level timing accuracy para sa telecommunications, smart grids, industrial automation, at critical network infrastructure. Ang module ay partikular na angkop para sa 4G/5G network synchronization at iba pang timing-sensitive systems. Key Features Multi-band GNSS receiver para sa high-accuracy timing applications Nanosecond-level timing accuracy (hanggang 5 ns typical timing accuracy) Support para sa GPS/QZSS, Galileo, BeiDou, at GLONASS constellations Differential timing mode para sa mas mataas na timing precision Configurable time pulse output mula 0.25 Hz hanggang 25 MHz Time pulse jitter na hanggang ±4 ns Carrier phase output support Built-in TCXO at programmable flash memory Integrated security features para sa mas mataas na robustness laban sa signal attacks UART, USB, SPI, at I²C communication interfaces Operating temperature range na -40°C hanggang +85°C Compact 17.0 mm × 22.0 mm × 2.4 mm LGA package Dinisenyo upang matugunan ang mahihigpit na 5G timing synchronization requirements #uBlox #ZEDF9T00B #GNSS #GPS #Galileo #BeiDou #GLONASS #TimingModule #HighPrecisionTiming #5G #Telecommunications #NetworkSynchronization #IndustrialAutomation #SmartGrid #LGA #EmbeddedSystems #IoT #ElectronicsDesign #HardwareEngineering #RFModule

15 µH Shielded Drum Core, Wirewound Inductor 3.5 A 92mOhm Max Nonstandard The SRP7050TA-150M is a high-performance photovoltaic module designed for utility-scale and large commercial solar power applications. The module utilizes advanced monocrystalline cell technology to deliver high energy conversion efficiency, reliable power generation, and long-term operational stability under varying environmental conditions. Its robust mechanical construction and optimized electrical characteristics provide dependable performance in demanding outdoor installations, including regions exposed to high wind loads, elevated temperatures, and extended solar irradiance. The module is engineered to support high system voltage configurations while maintaining low degradation rates and enhanced energy yield over its service life. The design incorporates reinforced framing, tempered high-transmission glass, and weather-resistant encapsulation materials to ensure durability against moisture ingress, ultraviolet exposure, and mechanical stress. The product is suitable for fixed-tilt and tracker-based mounting systems and is compatible with standard industry installation practices. Electrical performance is optimized for maximum power output with improved temperature behavior and reduced resistive losses. The module supports efficient integration into modern photovoltaic systems requiring high-density energy production and reliable long-term operation. Safety and quality compliance are aligned with internationally recognized photovoltaic module standards for performance, durability, and environmental resilience. The SRP7050TA-150M is intended for grid-connected solar energy systems where high efficiency, operational reliability, and reduced balance-of-system costs are critical project requirements. #commonpartslibrary #inductor