Connector Header Through Hole 18 position 0.100" (2.54mm) # TSW-118-07-G-S ## General Description The TSW-118-07-G-S is a through-hole board-to-board and wire-to-board interconnect header manufactured by Samtec. It belongs to the TSW series of standard terminal strip headers designed for reliable signal transmission in electronic assemblies, embedded systems, industrial controls, telecommunications equipment, instrumentation, and general-purpose printed circuit board applications. The component features precision-machined contacts, robust mechanical construction, and compatibility with a wide range of mating connectors. Its design supports secure electrical connections while maintaining excellent durability during repeated mating cycles and long-term operation in demanding environments. ## Key Features ### Mechanical Characteristics * Through-hole mounting configuration * Single-row terminal strip header design * Straight vertical orientation * Precision-machined contact system * High-reliability board-level interconnection ### Contact System * Gold-plated contact surface * Enhanced conductivity and signal integrity * Corrosion-resistant contact finish * Suitable for repeated insertion and removal cycles ### Electrical Characteristics * Low contact resistance * Reliable signal transmission * Suitable for low-power and signal-level applications * Stable electrical performance across operating conditions ### Material Construction * High-temperature thermoplastic insulator * Durable metallic contact structure * RoHS-compliant materials * Lead-free manufacturing compatibility ### Environmental Characteristics * Industrial-grade operating capability * Resistant to mechanical wear during mating cycles * Suitable for automated and manual assembly processes ### Application Areas * Embedded Systems * Microcontroller Development Boards * Industrial Automation Equipment * Telecommunications Hardware * Test and Measurement Instruments * Medical Electronics * Data Acquisition Systems * Prototyping Platforms * Consumer Electronic Devices * PCB Interconnection Applications ### Compliance * RoHS Compliant * Lead-Free Compatible * Industry-standard connector footprint ## Manufacturer Samtec Inc. ## Product Family TSW Series Terminal Strip Headers #Samtec #TSW11807GS #TerminalStripHeader #PCBConnector #BoardToBoardConnector #WireToBoardConnector #ElectronicsComponents #EmbeddedSystems #IndustrialElectronics #InterconnectSolutions #ThroughHoleConnector #ElectronicDesign #HardwareEngineering #PCBAssembly #CommonPartsLibrary #Connector #Header #TSW pin header 1x18 2.54mm

Connector Header Through Hole, Right Angle 10 position 0.100" (2.54mm) The 1761607-3 is a pluggable terminal block connector manufactured by TE Connectivity. It is designed for reliable wire-to-board connections in industrial and electronic applications. The connector supports screw-clamp termination, allowing secure and reusable wire connections. Its modular design enables easy installation and maintenance, making it suitable for control systems, power distribution, and signal interfacing. Key Features Pluggable terminal block connector Screw-clamp wire termination Reliable mechanical and electrical connection Modular and field-serviceable design Suitable for industrial environments Electrical Characteristics Rated voltage: up to 300 V (typical, application dependent) Rated current: up to 8 A (depending on wire size and conditions) Contact resistance: low contact resistance for stable conductivity Insulation resistance: high insulation resistance Mechanical Characteristics Number of positions: 3 Pitch: 3.5 mm Termination type: screw clamp Wire size range: typically 26 AWG to 16 AWG Mounting type: through-hole PCB Mating type: pluggable header interface Material Properties Housing material: high-temperature thermoplastic Contact material: copper alloy Contact plating: tin plating Flammability rating: UL94 V-0 Environmental Specifications Operating temperature range: −40°C to +105°C RoHS compliant Suitable for industrial applications Applications Industrial control systems Power supply connections Signal interface modules Automation equipment HVAC and building control systems Compliance & Standards RoHS compliant UL recognized (application dependent) IEC standard compliant terminal block design #commonpartslibrary #connector #header

ARM® Cortex®-M33 STM32H5 Microcontroller IC 32-Bit 250MHz 2MB (2M x 8) FLASH 144-LQFP (20x20) # STM32H573ZIT6 ## General Description The STM32H573ZIT6 is a high-performance microcontroller from STMicroelectronics based on the Arm Cortex-M33 core. It is designed to deliver advanced processing capability, enhanced security, and extensive peripheral integration for industrial, medical, consumer, communications, and embedded control applications. The device combines powerful computational performance with low-power operation, making it suitable for real-time control, edge computing, human-machine interfaces, industrial automation, IoT gateways, motor control systems, and secure connected devices. Integrated security features, high-speed memory architecture, and comprehensive communication interfaces enable the development of robust and scalable embedded solutions. ## Key Features ### Processing Architecture * Arm Cortex-M33 processor core * TrustZone security architecture * Digital signal processing capabilities * Floating-point computation support * Optimized real-time processing performance ### Memory Resources * Embedded Flash memory * Integrated SRAM architecture * Error correction capability for enhanced reliability * High-speed memory access structure ### Security Features * Secure boot functionality * Hardware cryptographic accelerators * Secure firmware update support * Memory protection mechanisms * Tamper detection capabilities * Trusted execution environment * Secure key management support ### Communication Interfaces * USART and UART communication interfaces * SPI serial communication interfaces * I²C communication interfaces * CAN FD connectivity * USB connectivity support * Ethernet interface capability * SDMMC memory card interface * Flexible external communication options ### Analog Features * High-performance analog-to-digital conversion * Digital-to-analog conversion capability * Analog comparators * Precision signal acquisition support ### Timer and Control Functions * Advanced control timers * General-purpose timers * PWM generation capability * Encoder interface support * Motor-control functionality * Real-time clock integration ### Power Characteristics * Low-power operating modes * Dynamic power optimization * Battery-powered application support * Efficient performance-to-power ratio ### Package Characteristics * LQFP package construction * Surface-mount technology compatibility * Industrial-grade mechanical design * Suitable for automated assembly processes ### Application Areas * Industrial Automation Systems * Motor Control Equipment * Human-Machine Interfaces * Smart Energy Systems * Medical Electronics * IoT Gateways * Secure Embedded Devices * Industrial Networking Equipment * Building Automation Systems * Consumer Electronics * Data Acquisition Systems * Edge Computing Applications ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial and Commercial Application Support ## Manufacturer STMicroelectronics ## Product Family STM32H5 Series High-Performance Microcontrollers #STM32H573ZIT6 #STM32H5 #STMicroelectronics #CortexM33 #Microcontroller #EmbeddedSystems #IndustrialAutomation #SecureMCU #IoT #EdgeComputing #MotorControl #EmbeddedDesign #ElectronicsEngineering #FirmwareDevelopment #IndustrialElectronics

Buck Switching Regulator IC Positive Adjustable 0.8V 1 Output 3.5A SOT-23-6 Thin, TSOT-23-6 The LMR51635YFDDCR specification defines the engineering requirements for a synchronous step-down DC-DC converter integrated circuit designed for high-efficiency power regulation in embedded and industrial electronic systems. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure stable voltage conversion, efficient power management, and long-term operational reliability. The device is intended for use in industrial automation, telecommunications equipment, consumer electronics, test and measurement instruments, distributed power systems, and embedded applications requiring regulated low-voltage power rails from higher-voltage DC sources. It integrates high-performance switching circuitry to provide efficient voltage conversion while minimizing external component count and overall system power loss. Engineering Requirements The DC-DC converter shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure consistent electrical performance, low power consumption, and reliable long-term operation. The device shall maintain stable functionality under specified input voltage, output load, temperature, and environmental operating conditions. Electrical characteristics shall provide accurate output voltage regulation, high conversion efficiency, low output ripple, and fast transient response during load and input voltage variations. The converter shall maintain stable switching operation while supporting continuous and dynamic power delivery with minimal performance degradation. The integrated control architecture shall ensure reliable startup, controlled shutdown, and stable operation under varying load conditions. Built-in protection mechanisms shall support safe operation during abnormal conditions, including overload, overcurrent, thermal stress, and short-circuit events, thereby enhancing overall system reliability. Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical integrity and long-term reliability. The package shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. Mechanical construction shall withstand thermal cycling, vibration, mechanical handling, and environmental exposure without degradation of electrical or mechanical performance. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, or structural inconsistencies that could adversely affect device functionality or reliability. Inspection, validation, and testing shall be conducted using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical performance specifications, application guidelines, thermal characterization reports, qualification records, inspection reports, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #DCDCConverter #BuckConverter #PowerManagement #PowerElectronics #EmbeddedSystems #IndustrialElectronics #VoltageRegulator #QualityAssurance #EngineeringDocumentation

Thermal Image Sensor 32H x 24V TO-39 # MLX90640ESF-BAB-000-TU Engineering Specifications **General Description** The MLX90640ESF-BAB-000-TU is a contactless infrared thermal imaging sensor manufactured by Melexis. It incorporates a microbolometer array that detects infrared radiation emitted by objects and converts the captured thermal energy into temperature data, enabling the creation of thermal images without physical contact. The device is designed for compact and cost-effective thermal imaging applications, offering high thermal sensitivity and accurate temperature measurement capabilities. It integrates a digital signal-processing engine, calibration data memory, and a digital communication interface, allowing direct connection to microcontrollers, embedded systems, and industrial monitoring equipment. The sensor provides real-time thermal mapping across its field of view and is suitable for applications involving human presence detection, predictive maintenance, industrial automation, smart building systems, medical screening, consumer electronics, robotics, and thermal monitoring solutions. Its factory calibration ensures stable performance throughout its operating life while minimizing external calibration requirements. **Engineering Specifications** **Manufacturer:** Melexis **Manufacturer Part Number:** MLX90640ESF-BAB-000-TU **Component Type:** Infrared thermal imaging sensor **Sensor Technology:** Microbolometer thermal sensor array **Measurement Method:** Non-contact infrared temperature sensing **Output Type:** Digital thermal image data **Communication Interface:** I²C-compatible serial interface **Temperature Measurement Capability:** Object temperature monitoring and thermal imaging **Thermal Imaging Function:** Real-time thermal map generation **Integrated Processing:** On-chip signal processing and calibration management **Calibration:** Factory calibrated with stored calibration parameters **Power Supply Configuration:** Single-supply operation **Power Consumption:** Optimized for low-power embedded applications **Refresh Rate:** Programmable thermal frame refresh operation **Thermal Sensitivity:** High-sensitivity infrared detection **Field of View Variant:** Wide-angle thermal imaging configuration **Accuracy Characteristics:** High-precision temperature measurement with integrated compensation algorithms **Memory Features:** Internal EEPROM for calibration coefficients **Operating Mode:** Continuous and programmable thermal acquisition **Data Output Format:** Digital temperature and thermal pixel information **Environmental Stability:** Designed for reliable operation across varying ambient conditions **Electromagnetic Compatibility:** Suitable for embedded and industrial electronic systems **Package Type:** Surface-mount package with infrared-transparent window **Mounting Style:** Surface mount technology **Package Construction:** Reflow-solderable assembly **Lead Finish:** Lead-free finish **Environmental Compliance:** RoHS compliant and halogen-free **Reliability Features:** Factory-tested and production-calibrated thermal imaging device **Typical Applications** Thermal cameras Human presence detection systems Occupancy monitoring Industrial predictive maintenance Electrical equipment inspection Smart building automation HVAC monitoring systems Medical screening devices Consumer electronics Robotics and autonomous systems Fire detection and prevention systems Industrial process monitoring Energy management systems Automotive thermal sensing applications Security and surveillance equipment #MLX90640 #MLX90640ESF #Melexis #ThermalSensor #InfraredSensor #ThermalImaging #Microbolometer #TemperatureSensor #IndustrialAutomation #EmbeddedSystems #IoT #PredictiveMaintenance #SmartBuilding #ThermalCamera #ElectronicComponents #EngineeringSpecifications

2 Position Wire to Board Terminal Block Horizontal with Board 0.375" (9.53mm) Through Hole # 1714971 ## General Description The 1714971 is a high-current printed circuit board terminal block manufactured by Phoenix Contact and designed for secure power and signal connections in industrial and commercial electronic equipment. The component utilizes a screw-clamp termination mechanism that provides reliable wire retention, low contact resistance, and long-term electrical stability. Its robust construction and through-hole mounting design make it suitable for applications requiring dependable field wiring, high-current handling capability, and resistance to mechanical stress. The terminal block is commonly used in power supplies, industrial automation systems, motor controllers, battery management systems, energy distribution equipment, instrumentation, and other applications requiring secure PCB-mounted power connections. ## Key Features ### Mechanical Characteristics * Through-hole PCB mounting * Screw-clamp wire termination * Side-entry wire connection * High-strength housing construction * Secure field-wire installation * Designed for repeated maintenance and servicing operations ### Electrical Characteristics * High-current carrying capability * Low contact resistance * Reliable electrical conductivity * Stable performance under demanding operating conditions * Suitable for power distribution and control applications ### Contact System * Corrosion-resistant conductive contacts * Screw-actuated clamping mechanism * Secure conductor retention * Reliable electrical connection during vibration and mechanical stress ### Material Construction * Industrial-grade thermoplastic housing * High-conductivity metal contacts * Flame-resistant insulation materials * RoHS-compliant construction ### Environmental Characteristics * Suitable for industrial environments * Resistant to mechanical wear * Durable under continuous operation * Designed for long service life ### Application Areas * Industrial Automation Equipment * Power Supply Systems * Motor Control Circuits * Battery Management Systems * Renewable Energy Equipment * Electrical Distribution Panels * Instrumentation Systems * Process Control Equipment * Embedded Power Electronics * Industrial Control Systems ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade PCB Interconnect Solution ## Manufacturer Phoenix Contact ## Product Family COMBICON PCB Terminal Blocks #PhoenixContact #1714971 #COMBICON #TerminalBlock #PCBTerminalBlock #ScrewTerminal #PowerConnector #IndustrialElectronics #PowerDistribution #IndustrialAutomation #EmbeddedSystems #ControlSystems #ElectronicsDesign #PCBAssembly #ElectricalEngineering

470 nH Shielded Molded Inductor 9.1 A 8.36mOhm Max 1616 (4040 Metric) The XFL4015-471MEC specification establishes the engineering requirements for the designated electronic component, defining its intended functionality, mechanical characteristics, electrical performance, material requirements, manufacturing quality, and inspection criteria. This specification serves as the primary technical reference to ensure the component consistently meets design expectations, operational reliability, and applicable industry standards throughout production and field use. Engineering Requirements The component shall be manufactured using approved materials and controlled production processes to ensure consistent electrical and mechanical performance. All dimensions, tolerances, and physical characteristics shall conform to the latest approved engineering documentation. The component shall be suitable for its intended operating environment and shall maintain performance within the specified electrical and environmental conditions. Workmanship shall be free from defects including cracks, contamination, corrosion, deformation, or any condition that could adversely affect reliability or functionality. All manufacturing and inspection processes shall be performed using calibrated equipment and verified in accordance with established quality management procedures. Testing and validation shall confirm compliance with electrical, mechanical, and environmental performance requirements prior to product acceptance. Any deviation from this specification shall require formal engineering review, documented approval, and appropriate revision control before implementation. Documentation Supporting documentation shall include engineering drawings, material certifications, inspection reports, test records, process documentation, and revision-controlled manufacturing specifications. All documentation shall be maintained in accordance with the organization's quality management and document control requirements. Revision Control Changes to this specification shall be managed through the approved engineering change process to ensure traceability, technical accuracy, and continued compliance with applicable design and quality requirements. #EngineeringSpecification #TechnicalSpecification #ElectronicComponents #ElectricalEngineering #QualityControl #Manufacturing #EngineeringDocumentation #Compliance

27.12 MHz ±10ppm Crystal 10pF 50 Ohms 4-SMD, No Lead # 7M-27.120MEEQ-T Crystal Unit Engineering Specification ## General Description The 7M-27.120MEEQ-T is a surface-mount quartz crystal resonator designed to provide a stable and accurate frequency reference for digital, wireless, communication, NFC, RFID, microcontroller, and embedded system applications. Manufactured by TXC Corporation, this crystal offers reliable frequency stability, low equivalent series resistance, and compact packaging suitable for space-constrained designs. Its surface-mount construction enables automated assembly while maintaining excellent electrical performance across a wide range of operating conditions. ## Features * Fundamental mode quartz crystal resonator * Surface-mount device package for automated PCB assembly * High frequency accuracy and stability * Low equivalent series resistance * Low power consumption * Suitable for clock generation and timing circuits * RoHS compliant construction * Reliable performance for industrial and consumer electronics applications ## Electrical Characteristics * Nominal Frequency: 27.120 MHz * Crystal Type: Fundamental Mode * Load Capacitance: 10 pF * Frequency Tolerance: ±20 ppm * Frequency Stability: ±20 ppm * Equivalent Series Resistance: 60 Ω Maximum * Drive Level: Low-power operation * Operating Temperature Range: Industrial grade * Storage Temperature Range: Extended environmental capability ## Mechanical Characteristics * Package Type: Surface-Mount Crystal * Mounting Style: SMD/SMT * Compact footprint optimized for high-density PCB layouts * Four-pad no-lead package construction ## Applications * PN532 NFC Controllers * RFID Readers and Writers * Microcontroller Clock Sources * Wireless Communication Modules * Embedded Systems * Industrial Control Electronics * Consumer Electronic Devices * IoT and Smart Device Platforms ## Compliance * RoHS Compliant * Lead-Free Construction * Suitable for Automated Assembly Processes #7M27_120MEEQT #TXC #CrystalResonator #SMDCrystal #QuartzCrystal #27_120MHz #PN532 #NFC #RFID #EmbeddedSystems #TimingReference #ElectronicsDesign

10 µH Shielded Drum Core, Wirewound Inductor 7.5 A 30mOhm Max Nonstandard # Engineering Specification ## Product Name SRP1038A-100M ## General Description SRP1038A-100M is a shielded surface mount power inductor designed for use in high-efficiency DC-DC conversion and power management applications. The device is intended to support energy storage and current smoothing functions in switching regulator circuits, where stable inductance performance and low power loss are critical. The inductor utilizes a ferrite core construction with a shielded magnetic structure to minimize electromagnetic interference and reduce magnetic flux leakage. This enables improved circuit density and reduced noise coupling in compact electronic assemblies. The design is optimized for use in high current power conversion systems, including buck converters, point-of-load regulators, and distributed power architectures. The component is widely used in industrial, automotive, telecommunications, and embedded systems where reliable energy transfer, thermal stability, and efficient power delivery are required. Its surface mount form factor supports automated PCB assembly and compact system integration while maintaining mechanical robustness under thermal and electrical stress. The design emphasizes low direct current resistance, high current handling capability, and stable inductance behavior under load conditions. It is suitable for applications requiring efficient power conversion with minimal energy loss and stable electromagnetic performance. ## Functional Requirements ### Energy Storage The device shall store energy in a magnetic field during switching operation in power conversion circuits. ### Current Filtering The device shall smooth current ripple in switching regulator applications to maintain stable output conditions. ### Electromagnetic Shielding The device shall reduce electromagnetic interference through a shielded magnetic structure. ### Power Conversion Support The component shall support efficient operation in DC-DC conversion systems. ## Electrical Requirements ### Inductive Performance The device shall provide stable inductance characteristics suitable for power conversion and filtering applications. ### Low Loss Operation The inductor shall minimize resistive and core losses to improve overall system efficiency. ### High Current Capability The device shall support operation under elevated current conditions typical of switching power supplies. ### Thermal Stability The inductor shall maintain performance consistency under thermal loading and temperature variation. ## Mechanical Requirements ### Surface Mount Package The device shall be supplied in a surface mount configuration suitable for automated PCB assembly processes. ### Structural Integrity The component shall withstand mechanical stress during assembly, operation, and thermal cycling. ### PCB Integration The design shall support compact layout integration in multilayer printed circuit board systems. ## Environmental Requirements ### Operating Conditions The device shall operate reliably under conditions typical of industrial and embedded electronic systems. ### Thermal Performance The component shall maintain stable operation under continuous power cycling and heat generation. ### Storage and Handling The device shall retain structural and electrical integrity during storage, transportation, and handling. ## Quality Requirements ### Reliability The inductor shall provide consistent long-term performance under continuous electrical and thermal stress. ### Verification Electrical and thermal characteristics shall be validated through appropriate qualification and testing procedures. ### Compliance The product shall conform to applicable standards for magnetic components used in power electronics applications. ## Documentation Requirements Technical documentation shall include application guidance, layout recommendations for switching power designs, thermal considerations, electrical characteristics, and integration practices for DC-DC converter systems. ## Classification Tags #SRP1038A100M #PowerInductor #ShieldedInductor #SMDInductor #MagneticComponent #EnergyStorageInductor #DCDCConverter #BuckConverter #PowerElectronics #SMPSDesign #ElectromagneticCompatibility #EMIShielding #PCBDesign #ElectricalEngineering #EmbeddedPower #IndustrialElectronics #AutomotiveElectronics #CommonPartsLibrary #ComponentLibrary #EngineeringSpecification #PowerManagement #CircuitDesign #HighCurrentInductor