Low capacitance unidirectional fivefold ESD protection diode array, 3.3V, Common Anode, SOT-666 diode SOT?666*

Bipolar (BJT) Transistor Array 8 P-Channel 400mA 18-SOP

The ESP-PSRAM64 and ESP-PSRAM64H, introduced by Espressif Systems, are 64 Mbit serial pseudo SRAM devices designed for high-speed, low-power memory applications. These components are organized in an 8Mx8 bit configuration and are fabricated using high-performance, high-reliability CMOS technology. The ESP-PSRAM64 operates at a voltage of 1.8V and supports a maximum clock rate of 144 MHz, while the ESP-PSRAM64H operates at 3.3V with a maximum clock rate of 133 MHz. Both devices feature a Serial Peripheral Interface (SPI) for standard communication, with the addition of Quad Peripheral Interface (QPI) support for applications requiring faster data rates. They are designed to support unlimited reads and writes to the memory array, with burst operations across page boundaries limited to a maximum input clock frequency of 84 MHz. The components come in an SOP8-150 mil package and are specified for operation over a temperature range of -40℃ to 85℃. These PSRAM devices are ideal for applications needing high data bandwidth and storage capacity, such as in embedded systems, IoT devices, and portable electronics, offering engineers flexibility in power management and interface options.

The 8-channel analog line tracking module, ideal for line robots, accurately detects the path through infrared sensors. It operates at 5V, provides analog outputs that are easy to read by the microcontroller, allows for fine contrast calibration and interpretation, and the QTR8 configuration covers different bandwidths for stable and fast tracking. QRE1113GR series Phototransistor Sensor Evaluation Board QTR8A QTR8 QTR QTR-8RC Reflectance Sensor Array

GW2AR-LV18QN88C8/I7 GOWIN GW2ANR series FPGA, non-volatile Arora family FPGA with integrated SDRAM and NOR Flash, fabricated on 55nm SRAM technology, 1.0V core voltage, low-power architecture with dynamic clock control, high-performance DSP resources, high-speed LVDS interfaces, abundant block SRAM memory, hot-swap support, configurable I/O standards including LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS and MLVDS, programmable drive strength and pull-up/pull-down options, designed for high-speed, low-cost embedded, industrial, communication and signal-processing applications. Search Keywords: GW2ANR, GOWIN GW2ANR, Arora FPGA, GOWIN FPGA, non volatile FPGA, FPGA with SDRAM, FPGA with NOR Flash, 55nm FPGA, low power FPGA, LVDS FPGA, DSP FPGA, embedded FPGA, GW2ANR series, GOWIN Arora family, programmable logic device Hashtags: #GW2ANR #GOWINGW2ANR #GOWINFPGA #AroraFPGA #FPGAFPGA - Field Programmable Gate Array GW2ANR-LV18QN88C8/I7

ESD DIODE 15VC SOT-23-6 The UMW USBLC6-2SC6 is a low-capacitance TVS/ESD protection diode array designed to protect high-speed data interfaces such as USB 2.0 and Ethernet from electrostatic discharge (ESD), electrical fast transients (EFT), and surge events. It integrates dual protection channels in a compact SOT-23-6 package, making it suitable for space-constrained portable and embedded designs. Key Features Dual-line ESD protection for high-speed signal interfaces Supports USB 2.0, 10/100 Ethernet, and other sensitive data lines Very low capacitance (~0.8 pF typical) to preserve signal integrity Operating voltage: 5 V Low clamping voltage for improved downstream IC protection IEC 61000-4-2 ESD protection: ±30 kV air discharge ±30 kV contact discharge IEC 61000-4-4 EFT protection up to 40 A (5/50 ns) IEC 61000-4-5 surge protection up to 6 A (8/20 µs) Peak pulse power capability: 150 W Ultra-low leakage current in the nA range Fast response time (<1 ns typical) Compact SOT-23-6 surface-mount package RoHS, Pb-free, and halogen-free compliant Typical Applications USB data line protection Ethernet interfaces Portable electronics Notebook and desktop PCs Digital cameras Embedded systems and microcontroller USB ports #CommonPartsLibrary #TVS-Diode

JEU0524P is a unidirectional TVS diode array in DFN2510-10L package, designed for ESD protection with 5V reverse working voltage, 6.0 to 9.0V breakdown voltage, ultra low capacitance of 0.5pF typical, and peak pulse power of 100W at 8/20μs waveform.TVS SEU0524PC DFN2510-10_L2.5-W1.0-P0.50-BL LCSC Part Number: C964550 JLCPCB Part Class: Extended Part Manufactured by SALLTECH(萨瑞)

The ESP-PSRAM64 and ESP-PSRAM64H, introduced by Espressif Systems, are 64 Mbit serial pseudo SRAM devices designed for high-speed, low-voltage applications in the electronics industry. These components are organized in an 8Mx8 bit configuration and utilize high-performance CMOS technology for reliability and efficiency. The ESP-PSRAM64 operates at a voltage of 1.8V and supports a maximum clock rate of 144 MHz, while the ESP-PSRAM64H is designed for 3.3V operations with a maximum clock rate of 133 MHz. Both variants offer flexible access through Serial Peripheral Interface (SPI) and Quad Peripheral Interface (QPI) modes, catering to applications requiring fast data rates. They are packaged in SOP8-150 mil, ensuring compatibility with standard PCB layouts. Key features include burst operations with a lower max input clock frequency of 84 MHz when crossing page boundaries, unlimited reads and writes to the memory array, and a self-initialization process upon power-up. These PSRAM devices are ideal for applications in embedded systems where high bandwidth and low power consumption are critical.

QTR-8AQRE1113GR series Phototransistor Sensor Evaluation Board QTR-8A REFLECTANCE SENSOR ARRAY QTR-8A

Board to Board & Mezzanine Connectors 0.50 mm Q Strip High-Speed Ground Plane Socket Strip 40 Position Connector Differential Pair Array, Female Surface Mount Gold

BGA-16 1.92mm x 1.92mm 4X4 Pitch 0.5mm Ball Grid Array Footprint #generic-part-template

Darlington transistor array driver ULN2803A SOP-18_L11.4-W7.6-P1.27-LS10.6-BL LCSC Part Number: C845537 JLCPCB Part Class: Extended Part Manufactured by UMW(友台半导体)

LGA-16 is a small surface-mount package commonly used for electronic components. It has a body size of approximately 3 mm x 3 mm (L x W) with 16 pins. The lead pitch between the pins is typically 0.5 mm. The package is also known as Land Grid Array 16 or LGA-16. #part #template

LGA-12 is a small surface-mount package commonly used for electronic components. It has a body size of approximately 2 mm x 2 mm (L x W) with 12 pins. The lead pitch between the pins is typically 0.5 mm. The package is also known as Land Grid Array 12 or LGA-12. #part #template

ESD DIODE 5VWM 14VC SOT-666-6 The USBLC6-2P6 is a dual-line, rail-to-rail transient voltage suppressor (TVS) diode array in a compact SOT-666 package. It is specifically optimized for protecting USB D+ and D− lines (and similar high-speed differential pairs) while maintaining very low signal distortion due to its low capacitance design. It clamps high-voltage ESD events to safe levels, protecting sensitive ICs such as MCUs, USB PHYs, and transceivers. Designed for USB and high-speed data protection Ideal for USB 2.0 (480 Mbps) interfaces Very low line capacitance Minimizes signal distortion on high-speed differential pairs Bidirectional ESD protection Protects both positive and negative voltage transients Low clamping voltage Typical clamp around ~17 V during surge events High peak pulse current capability Handles ESD strikes (IEC 61000-4-2 compliant, typically ±15 kV air / ±8 kV contact in similar ST USBLC family devices) Rail-to-rail protection structure Protects signal lines relative to VCC and GND Compact SOT-666 package Suitable for very small PCB layouts (phones, USB ports, embedded systems) 2-channel configuration Typically used for D+ / D− pair protection Typical Applications USB 2.0 ports (D+ / D− protection) Smartphones and tablets Embedded systems with external connectors HDMI / Ethernet signal protection (low-capacitance variants also used) Any exposed high-speed data interface requiring ESD protection #CommonPartsLibrary #Diode

LGA-8 is a small surface-mount package commonly used for integrated circuits. It has a body size of approximately 3 mm x 5 mm (L x W) with 8 pins. The lead pitch between the pins is typically 1.25 mm. The package is also known as Land Grid Array 8 or LGA-8. #part #template

ESD and Surge Protection (TVS/ESD) TPD2E001DRLR SOT-553-5_L1.6-W1.2-P0.50-LS1.6-BR LCSC Part Number: C3040099 JLCPCB Part Class: Extended Part Manufactured by Leiditech(雷卯电子) Texas Instruments TPD2E001 low-capacitance 2-channel ESD/TVS protection diode array for high-speed data interfaces, IEC 61000-4-2 Level 4 ESD protection, ±8kV contact discharge and ±15kV air-gap discharge, 1.5pF typical IO capacitance, 1nA max leakage current, 0.9V to 5.5V supply voltage range, suitable for USB 2.0, Ethernet, FireWire, LVDS and other high-speed signal line protection, available in SOT-5, WSON-6, USON-6 and SOP-4 packages. Search Keywords: TPD2E001, TI TPD2E001, Texas Instruments TPD2E001, TPD2E001 ESD protection, TPD2E001 TVS diode, TPD2E001 USB protection, TPD2E001DRL, TPD2E001DRLR, TPD2E001 low capacitance, 2 channel ESD protection, USB 2.0 ESD protection diode, high speed data line protection, low capacitance TVS array, TPD2E001 datasheet, TPD2E001 SOT-5, TPD2E001 WSON-6, TPD2E001 USON-6 Hashtags: #TPD2E001 #TPD2E001DRL #TPD2E001DRLR #TexasInstruments #TIESDProtection #ESDProtection #TVSDiode #TVSArray #ESDDiodeArray #LowCapacitanceTVS #2ChannelESDProtection #USBProtection #USB2Protection #HighSpeedDataProtection #SignalLineProtection #IEC6100042 #Level4ESD #SOT5 #WSON6 #USON6 #SOP4

14.5V (Typ) Clamp 3A (8/20µs) Ipp Tvs Diode Surface Mount SC-70-6 The TPD4E1B06DCKR is a four-channel transient voltage suppression and electrostatic discharge protection device manufactured by Texas Instruments. This integrated protection component is designed to safeguard sensitive electronic interfaces and signal lines from electrostatic discharge events, transient overvoltage conditions, and electrical fast transients commonly encountered in portable and high-speed electronic systems. The device features low capacitance characteristics that make it suitable for protecting high-speed communication interfaces while maintaining signal integrity. It is commonly used in USB interfaces, HDMI ports, communication systems, embedded electronics, consumer devices, and industrial control equipment. The TPD4E1B06DCKR provides robust ESD protection while occupying minimal PCB space due to its compact surface-mount package. Its multi-channel architecture simplifies circuit design by integrating multiple protection lines within a single package, reducing component count and improving overall system reliability in environments exposed to static discharge and transient electrical disturbances. Engineering Specification Device Type Multi-channel ESD and transient protection diode array Protection Configuration Four-channel transient voltage suppression architecture Protection Function Electrostatic discharge protection and transient suppression Interface Compatibility Suitable for high-speed signal and communication interfaces Capacitance Characteristics Low capacitance design for signal integrity preservation Response Characteristics Fast transient response for sensitive electronic protection Signal Integrity Optimized for minimal impact on high-speed data transmission Voltage Protection Clamps transient overvoltage conditions to safe operating levels Package Type SC70 surface-mount package Mounting Style Surface mount technology Reliability Features Robust ESD tolerance and transient immunity enhancement Applications USB interface protection Communication ports Embedded systems Consumer electronics Industrial electronics Portable devices Signal line protection Data interface protection High-speed digital systems I/O port protection Manufacturer Texas Instruments #commonpartslibrary #esdprotection #transientprotection #tvsdiode #signalprotection #texasinstruments #highspeedinterfaces #embeddedhardware #surfaceountcomponents #electronicsdesign #usbprotection #industrialelectronics #communicationinterfaces #circuitprotection #powerelectronics

TVS SM24CANB-02HTG SOT-23-3_L2.9-W1.3-P1.90-LS2.4-BR LCSC Part Number: C2937019 JLCPCB Part Class: Extended Part Manufactured by TECH PUBLIC(台舟) The SM24CANB TVS Diode Array is designed to protect automotive Controller Area Network (CAN) lines from damage due to electrostatic discharge (ESD), electrical fast transient (EFT), and other overvoltage transients. The SM24CANB Series can absorb repetitive ESD strikes above the maximum level specified in the IEC 61000-4-2 international standard without performance degradation and safely dissipate 10A of 8/20µs surge current (IEC 61000-4-5 2nd Edition) with very low clamping voltages.

ESD Protection Devices SP0503BAHTG SOT-143-4_L2.9-W1.3-P1.92-LS2.4-BL LCSC Part Number: C3040626 JLCPCB Part Class: Extended Part Manufactured by TECH PUBLIC(台舟) Littelfuse SP050xBA TVS diode array family designed for electrostatic discharge (ESD) and transient overvoltage protection of low-voltage signal, control and data lines up to 5VDC. Available in 2, 3, 4, 5 and 6 channel configurations, utilizing avalanche TVS diode technology with low clamping voltage, low off-state capacitance and fast response time below 1ns. Provides IEC 61000-4-2 Level 4 ESD protection up to 30kV air discharge and 30kV contact discharge. Suitable for USB, GPIO, communication interfaces, portable electronics, keyboards, digital cameras, handheld devices and embedded systems. Available in SC70, SOT23, SOT143 and MSOP surface-mount packages. Search Keywords: SP0502BA, SP0503BA, SP0504BA, SP0505BA, SP0506BA, Littelfuse SP0502BA, Littelfuse SP0503BA, Littelfuse SP0504BA, Littelfuse SP0505BA, Littelfuse SP0506BA, SP050xBA, TVS diode array, ESD protection array, multi-channel TVS diode, low capacitance TVS, signal line protection, USB ESD protection, GPIO protection diode, IEC6100042 protection, 30kV ESD protection, transient voltage suppressor array, SC70 TVS diode, SOT23 TVS diode, SOT143 TVS diode, MSOP TVS array Hashtags: #SP0502BA #SP0503BA #SP0504BA #SP0505BA #SP0506BA #SP050xBA #LittelfuseSP0502BA #LittelfuseTVS #TVSDiodeArray #ESDProtection #TransientProtection #SignalLineProtection #USBProtection #GPIOProtection #LowCapacitanceTVS #IEC6100042 #30kVESDProtection #AvalancheTVSDiode #SC70Package #SOT23Package #SOT143Package #MSOPPackage #CircuitProtection #EmbeddedHardware

SPI Flash Memory with Dual/Quad SPI The W25Q128JV (128M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 1µA for power-down. All devices are offered in space-saving packages. The W25Q128JV array is organized into 65,536 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q128JV has 4,096 erasable sectors and 256 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See Figure 2.) The W25Q128JV supports the standard Serial Peripheral Interface (SPI), Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 and I/O3. SPI clock frequencies of W25Q128JV of up to 133MHz are supported allowing equivalent clock rates of 266MHz (133MHz x 2) for Dual I/O and 532MHz (133MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories.  New Family of SpiFlash Memories – W25Q128JV: 128M-bit / 16M-byte – Standard SPI: CLK, /CS, DI, DO – Dual SPI: CLK, /CS, IO0, IO1 – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – Software & Hardware Reset(1)  Highest Performance Serial Flash – 133MHz Single, Dual/Quad SPI clocks – 266/532MHz equivalent Dual/Quad SPI – 66MB/S continuous data transfer rate – Min. 100K Program-Erase cycles per sector – More than 20-year data retention  Efficient “Continuous Read” – Continuous Read with 8/16/32/64-Byte Wrap – As few as 8 clocks to address memory – Allows true XIP (execute in place) operation  Low Power, Wide Temperature Range – Single 2.7 to 3.6V supply – <1µA Power-down (typ.) – -40°C to +85°C operating range – -40°C to +105°C operating range Flexible Architecture with 4KB sectors – Uniform Sector/Block Erase (4K/32K/64K-Byte) – Program 1 to 256 byte per programmable page – Erase/Program Suspend & Resume  Advanced Security Features – Software and Hardware Write-Protect – Power Supply Lock-Down – Special OTP protection – Top/Bottom, Complement array protection – Individual Block/Sector array protection – 64-Bit Unique ID for each device – Discoverable Parameters (SFDP) Register – 3X256-Bytes Security Registers with OTP locks – Volatile & Non-volatile Status Register Bits  Space Efficient Packaging – 8-pin SOIC 208-mil – 16-pin SOIC 300-mil (additional /RESET pin) – 8-pad WSON 6x5-mm / 8x6-mm – 24-ball TFBGA 8x6-mm (6x4/5x5 ball array) – 24-ball WLCSP – Contact Winbond for KGD and other options #CommonPartsLibrary #IntegratedCircuit #Memory

Magnetic Sensors QMC5883L LGA-16_L3.0-W3.0-P0.50-BL_SQ The QMC5883L is a multi-chip three-axis magnetic sensor. This surface -mount, small sized chip has integrated magnetic sensors with signal condition ASIC, targeted for high precision applications such as compassing, navigation and gaming in drone, robot, mobile and personal hand-held devices. The QMC5883L is based on our state-of-the-art, high resolution, magneto-resistive technology licensed from Honeywell AMR technology. Along with custom-designed 16-bit ADC ASIC, it offers the advantages of low noise, high accuracy, low power consumption, offset cancellation and temperature compensation. QMC5883L enables 1° to 2° compass heading accuracy. The I²C serial bus allows for easy interface. The QMC5883L is in a 3x3x0.9mm3 surface mount 16-pin land grid array (LGA) package.  3-Axis Magneto-Resistive Sensors in a 3x3x0.9 mm3 Land Grid Array Package (LGA), guaranteed to operate over an extended temperature range of -40 °C to +85 °C.  Small Size for Highly Integrated Products. Signals Have Been Digitized And Calibrated.  16 Bit ADC With Low Noise AMR Sensors Achieves 2 Milli-Gauss Field Resolution  Enables 1° To 2° Degree Compass Heading Accuracy , Allows for Navigation and LBS Applications  Wide Magnetic Field Range (±8 Gauss)  Maximizes Sensor’s Full Dynamic Range and Resolution  Temperature Compensated Data Output and Temperature Output  Automatically Maintains Sensor’s Sensitivity Under Wide Operating Temperature Range  I 2C Interface with Standard and Fast Modes.  High-Speed Interfaces for Fast Data Communications. Maximum 200Hz Data Output Rate  Wide Range Operation Voltage (2.16V To 3.6V) and Low Power Consumption (75A)  Compatible with Battery Powered Applications  Lead Free Package Construction  RoHS Compliance  Software And Algorithm Support Available  Compassing Heading, Hard Iron, Soft Iron, and Auto Calibration Libraries Available #CommonPartsLibrary #Sensor

11-Channel Spectral Sensor Frontend The AS7341-DLGM is a multi-channel spectral sensor developed by ams OSRAM, designed for advanced color measurement, spectral analysis, and ambient light sensing applications. The device integrates multiple optical channels covering visible and near-infrared wavelengths, enabling precise detection of light characteristics across a broad spectrum. Its compact surface-mount package, integrated analog front-end, and digital processing capabilities make it suitable for consumer electronics, industrial instrumentation, smart lighting systems, display calibration, agricultural sensing, and portable analytical devices. The sensor features highly sensitive photodiodes combined with optical filters that allow accurate spectral discrimination. Communication is performed through a standard digital interface, facilitating integration with microcontrollers, embedded systems, and IoT platforms. The AS7341 supports configurable measurement modes, programmable gain control, and interrupt functions for efficient system-level implementation. Key Features Multi-channel spectral sensing architecture Visible and near-infrared light detection capability Integrated optical interference filters High-sensitivity photodiode array Ambient light sensing functionality Advanced color measurement and analysis Programmable gain and integration settings Digital output with I²C communication interface Low-power operating characteristics Integrated interrupt and event detection functions Compact surface-mount package Suitable for portable and battery-powered designs High accuracy across varying lighting conditions Supports spectral identification and classification applications Optimized for display, lighting, and environmental monitoring systems Applications Color measurement instruments Spectral analysis equipment Smart lighting control systems Display color calibration Industrial automation sensors Agricultural monitoring devices Ambient light sensing applications Consumer electronics Wearable devices IoT sensing platforms Scientific and laboratory instruments Optical monitoring systems Electrical and Functional Characteristics Multi-channel optical sensing engine Digital signal processing architecture Configurable integration timing Adjustable sensitivity and gain control Low-noise measurement performance High dynamic range operation Fast measurement response capability Integrated spectral filtering technology Embedded register-based configuration Interrupt-driven event monitoring support Mechanical Characteristics Compact surface-mount package PCB-friendly footprint RoHS-compliant construction Suitable for automated assembly processes Optimized optical window design #commonpartslibrary #sensor #opticalsensor #spectralsensor #colorsensor #ambientlightsensor #amsosram #embeddedsystems #industrialelectronics #iot #measurement #environmentalsensing #consumerelectronics #smartlighting #electronicsdesign

3D accelerometer and 3D gyroscope The LSM6DS3TR-C is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 0.90 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer. The LSM6DS3TR-C supports main OS requirements, offering real, virtual and batch sensors with 4 kbyte for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element. The LSM6DS3TR-C has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps. High robustness to mechanical shock makes the LSM6DS3TR-C the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DS3TR-C is available in a plastic land grid array (LGA) package. Features  “Always-on” experience with low power consumption for both accelerometer and gyroscope  Power consumption: 0.90 mA in combo highperformance mode  Smart FIFO up to 4 kbyte based on features set  Android M compliant  Hard, soft ironing for external magnetic sensor corrections  ±2/±4/±8/±16 g full scale  ±125/±250/±500/±1000/±2000 dps full scale  Analog supply voltage: 1.71 V to 3.6 V  Independent IO supply (1.62 V)  Compact footprint, 2.5 mm x 3 mm x 0.83 mm  SPI & I2C serial interface with main processor data synchronization feature  Pedometer, step detector and step counter  Significant motion and tilt function  Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click  Embedded temperature sensor  ECOPACK®, RoHS and “Green” compliant #CommonPartsLibrary #Sensor

SPI Flash 32M-BIT Serial Flash Memory with Dual, Quad SPI The W25Q32JV (32M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on 2.7V to 3.6V power supply with current consumption as low as 1µA for power-down. The W25Q32JV array is organized into 16,384 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q32JV has 1,024 erasable sectors and 64 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See Figure 2.) The W25Q32JV supports the standard Serial Peripheral Interface (SPI), and a high performance Dual/Quad output as well as Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2, and I/O3. SPI clock frequencies of up to 133MHz are supported allowing equivalent clock rates of 266MHz (133MHz x 2) for Dual I/O and 532MHz (133MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O instructions. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories.  New Family of SpiFlash Memories – W25Q32JV: 32M-bit / 4M-byte – Standard SPI: CLK, /CS, DI, DO – Dual SPI: CLK, /CS, IO0, IO1, – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – Software & Hardware Reset(1)  Highest Performance Serial Flash – 133MHz Single, Dual/Quad SPI clocks – 266/532MHz equivalent Dual/Quad SPI – 66MB/S continuous data transfer rate – Min. 100K Program-Erase cycles per sector – More than 20-year data retention  Efficient “Continuous Read” – Continuous Read with 8/16/32/64-Byte Wrap – As few as 8 clocks to address memory – Allows true XIP (execute in place) operation – Outperforms X16 Parallel Flash  Low Power, Wide Temperature Range – Single 2.7V to 3.6V supply – <1µA Power-down (typ.) – -40°C to +85°C operating range – -40°C to +105°C operating range  Flexible Architecture with 4KB sectors – Uniform Sector/Block Erase (4K/32K/64K-Byte) – Program 1 to 256 byte per programmable page – Erase/Program Suspend & Resume  Advanced Security Features – Software and Hardware Write-Protect – Special OTP protection(2) – Top/Bottom, Complement array protection – Individual Block/Sector array protection – 64-Bit Unique ID for each device – Discoverable Parameters (SFDP) Register – 3X256-Bytes Security Registers – Volatile & Non-volatile Status Register Bits #CommonPartsLibrary #IntegratedCircuit