• LHE10-20B12

    LHE10-20B12

    Power Modules LHE10-20B12 PWRM-TH_LHE10-20BXX LCSC Part Number: C970739 JLCPCB Part Class: undefined Manufactured by MORNSUN(金升阳)

    lcsc

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    jharwinbarrozo

    1 Comment


  • 203456-0003

    203456-0003

    Mirror Mezz Hermaphroditic Connector, 5.50mm Connector Height, BGA-Attach Mounting, 7 Pair, 11 Row, 699 Circuits, 0.76m Gold (Au) Plating The 203456-0003 is a board-to-board mezzanine connector manufactured by Molex. It belongs to a family of high-density, fine-pitch connectors designed to provide reliable electrical and mechanical connections between stacked PCBs. This connector is typically used in compact electronic designs where space-saving and high pin-count interconnections are required, such as consumer electronics, embedded systems, industrial equipment, and communication devices. It is engineered to support stable signal transmission, including high-speed signals, while maintaining a low-profile form factor suitable for modern, miniaturized designs. Key Characteristics (General) Connector Type: Board-to-board (mezzanine) Mounting Style: Surface-mount (SMT) High pin density for compact PCB layouts Low profile height (ideal for slim devices) Designed for reliable mating cycles Supports signal integrity for high-speed applications Typical Applications Embedded modules and carrier boards Consumer electronics (tablets, handheld devices) Industrial control systems Communication and networking equipment #CommonPartsLibrary #Connector #Mirror Mezz 203456

    adrian95

    2 Uses


  • MIMXRT1189XVM8C

    MIMXRT1189XVM8C

    ARM® Cortex®-M33F, ARM® Cortex®-M7F RT1180 Microcontroller IC 32-Bit Dual-Core 240MHz, 800MHz 160KB (160K x 8) ROM 289-LFBGA (14x14) The MIMXRT1189XVM8C is a high-performance crossover microcontroller from the NXP Semiconductors i.MX RT1180 family, designed for advanced industrial and real-time embedded applications. It combines the real-time performance of a microcontroller with the connectivity and security features typically found in application processors. The device integrates dual Arm® Cortex® cores, high-speed networking with Time-Sensitive Networking (TSN), and advanced EdgeLock® security technology, making it ideal for industrial automation, robotics, motor control, automotive gateways, and Industry 4.0 systems. Key Features Dual-core architecture: Arm® Cortex®-M7 core running up to 800 MHz Arm® Cortex®-M33 core running up to 300 MHz Integrated Gigabit TSN Ethernet switch for deterministic real-time networking Supports industrial Ethernet protocols including: EtherCAT PROFINET Ethernet/IP CC-Link IE Advanced EdgeLock® Secure Enclave for secure boot, cryptography, and tamper detection Up to 1.5 MB on-chip SRAM with ECC protection High-speed external memory interfaces Multiple communication peripherals: CAN-FD UART SPI I2C USB Ethernet High-resolution ADCs and advanced PWM/timer modules Supports MCUXpresso SDK and Zephyr RTOS Industrial temperature range operation from -40°C to +125°C BGA package optimized for compact industrial designs #Commonpartlibrary #Microcontroller #MIMXRT1189

    adrian95


  • SoM with AMD Zynq™ 7030-1I incl. Heat Spreader

    SoM with AMD Zynq™ 7030-1I incl. Heat Spreader

    The Trenz Electronic TE0745-03-71I31-AK are industrial-grade SoC modules integrating a AMD/Xilinx Zynq™ 7030, 1 GByte DDR3L SDRAM, 64 MByte QSPI Flash memory for configuration and operation and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking strips. This module is identical with TE0745-03-71I31-A except the mounted heat spreader. All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants. All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options. #Module #part

    adrian95

    11 Uses

    1 Star


  • TPSM84A21MOJR

    TPSM84A21MOJR

    Power Modules TPSM84A21MOJR QFM-20_L15.0-W9.0-P1.00_TPSM84A21MOJT LCSC Part Number: C2878955 JLCPCB Part Class: undefined Manufactured by TI(德州仪器)

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    jharwinbarrozo

    1 Comment


  • TPSM84A21MOJT

    TPSM84A21MOJT

    Power Modules TPSM84A21MOJT QFM-20_L15.0-W9.0-P1.00_TPSM84A21MOJT LCSC Part Number: C2878954 JLCPCB Part Class: undefined Manufactured by TI(德州仪器)

    lcsc

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    jharwinbarrozo

    1 Comment


  • CSD86356Q5D

    CSD86356Q5D

    Power Modules CSD86356Q5D HVSON-8_L3.0-W3.0-P0.65-TL-EP LCSC Part Number: C2863237 JLCPCB Part Class: undefined Manufactured by TI(德州仪器)

    lcsc

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    jharwinbarrozo

    1 Comment


  • K7805MT-500R4

    K7805MT-500R4

    Power Modules K7805MT-500R4 PWRM-SMD_K78XXMT-500R4 LCSC Part Number: C2684892 JLCPCB Part Class: undefined Manufactured by MORNSUN(金升阳)

    lcsc

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    jharwinbarrozo

    1 Comment


  • NCP1247DD065R2G

    NCP1247DD065R2G

    Power Modules NCP1247DD065R2G SOIC-8_7P-L4.9-W3.9-P1.27-LS6.0-BL-PE7_ONSEMI_NCP1247XXX LCSC Part Number: C603525 JLCPCB Part Class: undefined Manufactured by onsemi(安森美)

    lcsc

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    jharwinbarrozo

    1 Comment