Temperature and Humidity Sensor Node Design

flux

0:03

Work done
  • Reconfigured the PCB to a Standard 2 Layer stackup while preserving the 50 mm × 50 mm board and 2 mm rounded corners.
  • Set the routing intent to top copper for signal/power and bottom copper as the primary reference/plane layer.
  • Re-placed the board for the 2-layer strategy: J1 at the left edge, U1 at the top antenna edge, U2 away from the power cluster, and D1/U3/U4 near USB-C input.
  • Updated the Implementation Notes with the 2-layer stackup, placement strategy, verification status, and remaining work.
Success criteria review
  • ✅ 2-layer stackup is configured and board dimensions are retained.
  • ✅ Component placement is optimized for USB-C access, ESP32 antenna position, power-path compactness, and sensor thermal separation.
  • ❌ Routing is not fabrication-ready yet: the latest check still reports 49 airwires, meaning copper routing remains incomplete.
  • ❌ Final fabrication readiness is blocked until routing is completed and the airwire check is clean.
Next steps
Complete PCB routing next, prioritizing USB D+/D−, VBUS/5V, 3V3, GND, and I2C, then re-run checks before export/manufacturing.
Route remaining nets
Run DRC check
Review placement bottlenecks
Add stitching vias
a day
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USB-C ESP32 Environmental Sensor

USB-C ESP32 Environmental Sensor
Created
Last updated by satrioxpz
2 Contributor(s)
satrioxpz
satrioxpzz

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