Temperature and Humidity Sensor Node Design
Thought
- Set Layout's traceWidth to "0.25"
- Set Layout's preferredTraceWidths to "0.25,0.5,1.0"
Thought for 3 mins 9 sec
Placed 20 component(s): C6, U3, U4, R5, C3, C8, R3, C1, R2, U1, D1, R4, R7, J1, C2, R6, R1, C7, R8, U2
Thought for 3 sec
Work done
- Reconfigured the PCB to a Standard 2 Layer stackup while preserving the 50 mm × 50 mm board and 2 mm rounded corners.
- Set the routing intent to top copper for signal/power and bottom copper as the primary reference/plane layer.
- Re-placed the board for the 2-layer strategy: J1 at the left edge, U1 at the top antenna edge, U2 away from the power cluster, and D1/U3/U4 near USB-C input.
- Updated the Implementation Notes with the 2-layer stackup, placement strategy, verification status, and remaining work.
- ✅ 2-layer stackup is configured and board dimensions are retained.
- ✅ Component placement is optimized for USB-C access, ESP32 antenna position, power-path compactness, and sensor thermal separation.
- ❌ Routing is not fabrication-ready yet: the latest check still reports 49 airwires, meaning copper routing remains incomplete.
- ❌ Final fabrication readiness is blocked until routing is completed and the airwire check is clean.
Complete PCB routing next, prioritizing USB D+/D−, VBUS/5V, 3V3, GND, and I2C, then re-run checks before export/manufacturing.
Route remaining nets
Run DRC check
Review placement bottlenecks
Add stitching vias
