Power Distribution Network Analysis

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Accessing knowledge base.

Here’s a concise classification of the four PDN-droop levels, each defined by its local L–C interface:

Table

Droop LevelLocationL–C InterfaceKey Characteristics
Zeroth (On-Die)Within the siliconOn-die interconnect inductance & embedded capacitance• Decoupling caps embedded in the die (< nH L, < nF C)
• Fastest transient response (ps–ns)
First (Chip-Package)Chip package pins and ballsBond-wire or paddle inductance (~1–5 nH) + package decoupling (1–10 µF)• Handles die-to-package switching currents
• Response in ns–tens of ns
Second (Package-Board)PCB land pattern & package footprintLead-frame or ball inductance (5–20 nH) + board-side decoupling (10–100 µF)• Bridges package to board planes
• Response in tens–ns to hundreds-ns
Third (Board-VRM)VRM output to PCB planesBulk inductance of VRM-to-plane path (10–100 nH) + bulk capacitance (100–1000 µF)• Governs slowest transients (µs–ms)
• Sets overall voltage droop under load steps
  • Each level “droops” (voltage sags) under fast load steps until the next-closest L–C stage can respond.
  • Proper PDN design ensures enough capacitance at each level so that the switching current is first met by the fastest (lowest-L) stage, then handed off progressively to bulk stages.
  • Tuning L–C values at each interface (e.g., package caps, board ceramic arrays, bulk electrolytics) controls both the magnitude of droop and the transient-recovery time at that hierarchy level.
Package decap selection
Board decap selection
Bulk cap options
PDN impedance analysis
Simulate droop response
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U4
DSG_CSN
DSG_VOSN
DSG_SW1
DSG_FB
DSG_VOSN
DSG_FB
DSG_HDV2
DSG_HDV1
DSG_Vo
DSG_CSP
GND_DSG
DSG_Vo
DSG_VCC
PACK+
VI_COB
GND_DSG
GND_DSG
PACK+
D10
C36
Capacitance
220pF
C37
Capacitance
0.033uF
C40
Capacitance
0.047uF
C35
Capacitance
0.1uF
C34
Capacitance
0.22uF
C45
Capacitance
0.22uF
D4
C38
Capacitance
39pF
C33
Capacitance
1uF
C44
Capacitance
100pF
C43
Capacitance
100pF
C39
Capacitance
100pF
R42
Resistance
1.5kΩ
R34
Resistance
1.5kΩ
R41
Resistance
1.5kΩ
R35
Resistance
10 Ω
R40
Resistance
1.5kΩ
R36
Resistance
100kΩ
Q10
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  • Generic Capacitor
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  • Generic Inductor
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  • Terminal
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  • RMCF0805JT47K0
    RMCF0805JT47K0
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  • CTL1206FYW1T
    CTL1206FYW1T
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USB type-C PD DFP [ALT_1_ML1&2PP] [Net Pri Set]

USB type-C PD DFP [ALT_1_ML1&2PP] [Net Pri Set] thumbnail
USB Type-C PD Downstream-Facing Port design featuring TPS25740 PD controller, LM5175 buck converter, integrated protections and precision monitoring..

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