Storage Options for ESP32

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Dispatching Library tool to find: "SPI NAND 8Gb"

Creating search plan for: "eMMC 8GB"

Creating search plan for: "eMMC 8 GByte"

Creating search plan for: "eMMC 64Gb"

Creating search plan for: "SPI NAND 8Gb"

Searching: "Searching for a non-volatile memory device: an 8Gb SPI NAND flash chip intended for storage applications in embedded systems. The device should support the standard SPI interface with basic 8Gb capacity."

Searching: "Looking for an 8Gb SPI NAND flash memory chip used in microcontroller and embedded systems. The focus is on standard SPI interface, reliability in non-volatile storage, and general purpose embedded applications without a specific package constraint."

Searching: "Targeting a high-capacity, 8Gb SPI NAND flash memory component for embedded systems. The part should offer standard SPI interface performance, be suitable for applications requiring large non-volatile storage, and match common package types used in modern electronics."

Searching: "Search for an 8GB embedded MultiMediaCard (eMMC) memory device, used as non-volatile storage in embedded systems and consumer electronics. The key requirement is an 8 GByte capacity component that adheres to standard eMMC interfaces."

Searching: "Locate an 8 GByte eMMC flash memory component typically utilized for embedded storage where performance and reliability for boot and application storage are critical. Consider devices with standard voltage ranges (typically 3.3V) and common package forms suitable for PCB mounting."

Searching: "Identify an embedded memory solution featuring 8GB of eMMC storage. Focus on parts that offer robust data retention and fast access for system boot-up and application data logging in environments like mobile, automotive, or industrial applications."

Searching: "Find an 8GB eMMC memory device tailored for industrial or high-reliability applications. The targeted component should offer extended temperature ranges and meet performance standards for critical embedded systems."

Found 45 results.

Searching: "SPI NAND 8Gb"

Searching: "Searching for embedded MultiMediaCard (eMMC) devices with 64Gb capacity for use in consumer or industrial embedded systems. The part should provide non-volatile storage with integrated flash memory controller according to JEDEC standards."

Searching: "Looking for eMMC components designed to serve as integrated storage solutions in system-on-chip designs. Key criteria include 64Gb capacity, robust flash management, and compatibility with standard MMC host interfaces."

Searching: "Search for eMMC products that comply with the JEDEC eMMC 5.1 specification, ensuring high-speed data transfer, improved power efficiency, and enhanced reliability in embedded applications requiring 64Gb storage."

Searching: "Identify eMMC devices with 64Gb capacity that also meet potential automotive or industrial reliability standards. Emphasis on robust construction, extended temperature range, and secure data management features for mission-critical applications."

Searching: "Find eMMC memory chips offering 64Gb capacity with high endurance and reliability ratings. Suitable for embedded systems that demand long-term data retention and robust performance under frequent read/write cycles."

Found 60 results.

Searching: "eMMC 8 GByte"

Searching: "Searching for an 8GB embedded MultiMedia Card (eMMC) flash memory used for on-board non-volatile storage in embedded systems. This is a standard eMMC part per JEDEC, suitable for applications that require moderate capacity and reliable performance for firmware and data storage."

Searching: "Looking for an 8GB flash memory device that conforms to eMMC standards (e.g., eMMC 4.41 or 5.0) for embedded applications. The part should support high-speed data read/write operations and integrate an onboard flash controller, making it ideal for portable electronics and industrial systems."

Searching: "Targeting a PCB-mounted 8GB eMMC memory in a BGA package, ideally supporting more advanced specifications like eMMC 5.1 if available. The component is required as an integrated non-volatile storage solution for high-performance embedded devices with strict board space and reliability requirements."

Found 75 results.

Searching: "eMMC 64Gb"

Found 45 results.

Searching: "eMMC 8GB"

Completed 4 component searches.

Looking for "Power sequencing requirements and recommendations for VCC, VCCQ rails." in 2007301503_Samsung-KLM8G1GETF-B041_C499918.pdf

Looking for "Supported I/O voltage levels and whether VCCQ supports 1.8V and 3.3V." in 2007301503_Samsung-KLM8G1GETF-B041_C499918.pdf

Looking for "Recommended operating conditions for VCC and VCCQ (supply voltage ranges)." in 2007301503_Samsung-KLM8G1GETF-B041_C499918.pdf

Looking for "Bus width support (x1/x4/x8) and maximum interface frequency or speed mode (eMMC 5.1)." in 2007301503_Samsung-KLM8G1GETF-B041_C499918.pdf

Looking for "Decoupling capacitor recommendations and placement for VCC and VCCQ." in 2007301503_Samsung-KLM8G1GETF-B041_C499918.pdf

Looking for "Bus width support (x1/x4/x8) and maximum interface frequency or speed mode (eMMC)." in AllianceMemory_8GB_ASFC8G31M-51BIN_eMMCdatasheet_Jan2022_v1.1.pdf

Looking for "Recommended operating conditions for VCC and VCCQ (supply voltage ranges)." in AllianceMemory_8GB_ASFC8G31M-51BIN_eMMCdatasheet_Jan2022_v1.1.pdf

Looking for "Supported I/O voltage levels and whether VCCQ supports 1.8V and 3.3V." in AllianceMemory_8GB_ASFC8G31M-51BIN_eMMCdatasheet_Jan2022_v1.1.pdf

Looking for "Power sequencing requirements and recommendations for VCC, VCCQ rails." in AllianceMemory_8GB_ASFC8G31M-51BIN_eMMCdatasheet_Jan2022_v1.1.pdf

Looking for "Decoupling capacitor recommendations and placement for VCC and VCCQ." in AllianceMemory_8GB_ASFC8G31M-51BIN_eMMCdatasheet_Jan2022_v1.1.pdf

Looking for "Maximum or peak current consumption on VCC and VCCQ during read/write (ICC values)." in 2007301503_Samsung-KLM8G1GETF-B041_C499918.pdf

Looking for "Decoupling and bypass capacitor recommendations (values per VCC/VCCQ ball)." in 2007301503_Samsung-KLM8G1GETF-B041_C499918.pdf

Starting 1 component search

Dispatching Library tool to find: "LDO 1.8V 300mA"

Creating search plan for: "LDO 1.8V 300mA"

Searching: "Searching for a low dropout regulator needed to generate a stable voltage rail. This broad query will help uncover regulators that might be adapted to deliver approximately 1.8V, but later filtering by current rating and dropout performance will be needed."

Searching: "Seeking a low dropout regulator specifically rated for a 1.8V output with a 300mA current supply. This search term is focused on regulators that can support moderate load currents with low dropout performance, making them suitable for powering sensitive 1.8V circuits."

Searching: "Looking for an ultra-low dropout regulator designed to deliver 1.8V at 300mA. Include consideration for potential package types such as SOT-23 or SOT-223 if board space is constrained. This query addresses applications requiring precise voltage control with minimal voltage overhead, ideal for battery-powered or high stability needs."

Found 51 results.

Searching: "LDO 1.8V 300mA"

Completed 1 component search.

Looking for "CMD/DAT line pull-up or pull-down requirements for eMMC host; any external pull-ups needed?" in 2007301503_Samsung-KLM8G1GETF-B041_C499918.pdf

Looking for "RESET pin (RST_n) requirements: polarity, default pull-up, recommended external resistor, and connection guidance." in 2007301503_Samsung-KLM8G1GETF-B041_C499918.pdf

Considering eMMC and ESP32-S3 compatibility.

If you truly need 8 GB (gigabytes), use eMMC instead of SPI NAND. SPI NAND parts commonly top out at a few gigabits each; reaching 8 GB would require multiple dies and a Flash Translation Layer in firmware. eMMC integrates the NAND + controller + FTL/ECC, giving you managed, high‑capacity storage with a simple SD/MMC‑style interface.
Recommended 8 GB eMMC options (in Flux library) eMMC candidates

Table


PartMPNPackageKey notes
ASFC8G31M-51BINASFC8G31M-51BINBGA153 11.5x13eMMC 5.x, x1/x4/x8, 200 MHz. See Datasheet. Power sequencing guidance and bulk decoupling called out.
KLM8G1GETF-B041KLM8G1GETF-B041BGA153 11.5x13Samsung eMMC 5.1, supports x1/x4/x8, 0–200 MHz. VCC 2.7–3.6 V, VCCQ 1.70–1.95 V per datasheet.
Power rails and currents (from datasheets)
  • Samsung KLM8G1GETF-B041
    • VCC (NAND core): 2.7–3.6 V.
    • VCCQ (I/O): 1.70–1.95 V.
    • Bus width: 1/4/8-bit; clock up to 200 MHz.
    • Active RMS current (8 GB): up to 180 mA on VCCQ and 50 mA on VCC (measured at x8, HS400; table notes).
  • Alliance ASFC8G31M-51BIN
    • Notes require VCCQ to ramp before or at the same time as VCC; prefer VCCQ first. Place a 10 µF (or higher) bulk capacitor on each rail close to the device, and decouple each VCC ball locally.
Add a 1.8 V rail for VCCQ Suitable 1.8 V LDOs (pick one, sized for ≥300 mA to cover VCCQ headroom):
How to integrate eMMC on your current design
  • Replace microSD: Remove the microSD socket U4. Place the BGA153 eMMC near the ESP32 module U1.
  • Reuse the SDIO nets (4‑bit bus):
    • CLK: U1 IO10 (Net 29) → eMMC CLK.
    • CMD: U1 IO9 (Net 25) → eMMC CMD.
    • DAT0: U1 IO11 (Net 9) → eMMC DAT0.
    • DAT1: U1 IO12 (Net 24) → eMMC DAT1.
    • DAT2: U1 IO3 (Net 28) → eMMC DAT2.
    • DAT3: U1 IO46 (Net 27) → eMMC DAT3.
    • Keep trace lengths short, reference to solid GND, and length‑match data lines to CLK within a few millimeters.
  • Power:
    • Tie eMMC VCC to your 3.3 V rail.
    • Generate 1.8 V (VCCQ) with the LDO above; sequence VCCQ up before or at the same time as VCC (Alliance datasheet requirement). Ensure VCC ramp is monotonic.
  • Reset:
    • RST_n is the hardware reset pin (active low). Hold high for normal operation; optionally connect to an ESP32 GPIO for controlled resets. Use a pull‑up to VCCQ as specified in the chosen eMMC’s datasheet.
  • Pull resistors (per Samsung datasheet):
    • CMD pull‑up RCMD in the range 4.7 kΩ to 100 kΩ to prevent bus floating.
    • DAT0–DAT7 pull‑ups RDAT in the range 10 kΩ to 100 kΩ. For a 4‑bit bus, populate DAT0–DAT3.
  • Decoupling and bulk caps:
    • Place a bulk capacitor of 10 µF (or higher) on VCC and on VCCQ near the eMMC (Alliance datasheet).
    • Add high‑frequency decoupling at each VCC/VCCQ ball (place as close as possible as directed by the datasheet).
  • Signal integrity:
    • If needed, add small series damping (for example, 22–33 Ω) at the source on CLK (and optionally CMD/DAT) to tame ringing; tune by measurement on your PCB.
Would you like me to swap out U4 for KLM8G1GETF-B041, add a 1.8 V LDO (AP131-18WG-7 or LP3982IMM-1.8/NOPB), and wire the SDIO lines for a 4‑bit eMMC interface?
Clarify storage type
Choose Samsung eMMC
Ask for LDO choice
Request schematic help
Ask layout constraints
57 days

Ready.


MK2
End of Life
J1
MK1
End of Life
U1
How many 12s channels does the U1 have. Can it support 2 I2s microphones?

How would I connect MK1 to the I2S0 bus on U1?

7
Connect the Thermistor connector to U3.

9
Connect BATT CONN to U3.

15
https://www.youtube.com/watch?v=1jUmu3DQEYM

23
what is the reason for R3 in the U2 reference design?

16
connect MK2 to I2S1 bus on U1.

8
Are there any missing peripheral components in U3? Perform a check comparing to ...

19
What is the quiecent current of this buck boost converter.

5
based on the datasheet of U3 what peripheral components are needed to have U3 op...

10
confirm that pins 18 and 19 are USB D+ and USB D- on U1

20
Perform a design review check of Iset if the max charging current is supposed to...

21
In U1 list out the GPIOs that can be used for I2S

1
Perform a design review check on the inductor for U2 if the desired output is 3....

18
Using SDIO connect the SD card (U4) to U1

17
what peripheral components are needed to have U2 opperate as a buck boost conver...

11
I want to configure U2 to output a constant 3.3V. What are the recommended value...

12
In order for U3 to function what peripheral components am I missing

14
PP5V0
C7
Capacitance
10u F
C13
Capacitance
22u F
SDIO_DAT0
PP3V3
USBC2.0_D_N
U2
Manufacturer Part Number
LM2623AMM/NOPB
INDICATOR_LED
I2S0_WS
D1
PP3V3_FREQ
R8
Resistance
1k Ω
I2S1_WS
C4
Capacitance
0.1u F
PP3V3
SDIO_DAT3
R11
Resistance
10k Ω
SDIO_CMD
C2
Capacitance
10u F
I2S0_BCK
C14
Capacitance
22u F
PP3V3_FREQ
PP3V3
PP3V3
R3
Resistance
5.1k Ω
SDIO_DAT2
PP5V0
PP3V3_SW
USBC2.0_D_N
I2S1_BCK
SDIO_DAT0
I2S1_SDI
R6
Resistance
100k Ω
SDIO_DAT2
I2S0_BCK
PP3V3
PP3V3_SW
C10
Capacitance
22u F
PP3V3
SDIO_DAT3
PP3V3
VBAT_OUT
C8
Capacitance
10u F
C9
Capacitance
10u F
R5
Resistance
150k Ω
I2S0_SDI
R2
Resistance
5.1k Ω
USBC2.0_D_P
SDIO_DAT1
VBAT_OUT
I2S1_SDI
PP3V3
I2S0_WS
C16
Capacitance
0.1u F
C6
Capacitance
0.1u F
SDIO_DAT1
C12
Capacitance
22u F
SDIO_CLK
C15
Capacitance
10u F
C11
Capacitance
4.7p F
PP3V3
C5
Capacitance
10u F
USBC2.0_D_P
R10
Resistance
1k Ω
R1
Resistance
10k Ω
SDIO_CLK
INDICATOR_LED
I2S1_BCK
C1
Capacitance
10u F
I2S1_WS
PP3V3
SDIO_CMD
I2S0_SDI
C3
Capacitance
0.1u F
SW1
LED1
U4
U3
L1
Inductance
4.7u H
R7
Resistance
165k Ω


  • Ground
    A common return path for electric current. Commonly known as ground.
  • Net Portal
    Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
  • Power Net Portal
    Wirelessly connects power nets on schematic. Identical to the net portal, but with a power symbol. Used to organize schematics and separate functional blocks. To wirelessly connect power net portals, give them the same designator. #portal #power
  • Generic Resistor
    A generic fixed resistor for rapid developing circuit topology. Save precious design time by seamlessly add more information to this part (value, footprint, etc.) as it becomes available. Standard resistor values: 1.0Ω 10Ω 100Ω 1.0kΩ 10kΩ 100kΩ 1.0MΩ 1.1Ω 11Ω 110Ω 1.1kΩ 11kΩ 110kΩ 1.1MΩ 1.2Ω 12Ω 120Ω 1.2kΩ 12kΩ 120kΩ 1.2MΩ 1.3Ω 13Ω 130Ω 1.3kΩ 13kΩ 130kΩ 1.3MΩ 1.5Ω 15Ω 150Ω 1.5kΩ 15kΩ 150kΩ 1.5MΩ 1.6Ω 16Ω 160Ω 1.6kΩ 16kΩ 160kΩ 1.6MΩ 1.8Ω 18Ω 180Ω 1.8KΩ 18kΩ 180kΩ 1.8MΩ 2.0Ω 20Ω 200Ω 2.0kΩ 20kΩ 200kΩ 2.0MΩ 2.2Ω 22Ω 220Ω 2.2kΩ 22kΩ 220kΩ 2.2MΩ 2.4Ω 24Ω 240Ω 2.4kΩ 24kΩ 240kΩ 2.4MΩ 2.7Ω 27Ω 270Ω 2.7kΩ 27kΩ 270kΩ 2.7MΩ 3.0Ω 30Ω 300Ω 3.0KΩ 30KΩ 300KΩ 3.0MΩ 3.3Ω 33Ω 330Ω 3.3kΩ 33kΩ 330kΩ 3.3MΩ 3.6Ω 36Ω 360Ω 3.6kΩ 36kΩ 360kΩ 3.6MΩ 3.9Ω 39Ω 390Ω 3.9kΩ 39kΩ 390kΩ 3.9MΩ 4.3Ω 43Ω 430Ω 4.3kΩ 43KΩ 430KΩ 4.3MΩ 4.7Ω 47Ω 470Ω 4.7kΩ 47kΩ 470kΩ 4.7MΩ 5.1Ω 51Ω 510Ω 5.1kΩ 51kΩ 510kΩ 5.1MΩ 5.6Ω 56Ω 560Ω 5.6kΩ 56kΩ 560kΩ 5.6MΩ 6.2Ω 62Ω 620Ω 6.2kΩ 62KΩ 620KΩ 6.2MΩ 6.8Ω 68Ω 680Ω 6.8kΩ 68kΩ 680kΩ 6.8MΩ 7.5Ω 75Ω 750Ω 7.5kΩ 75kΩ 750kΩ 7.5MΩ 8.2Ω 82Ω 820Ω 8.2kΩ 82kΩ 820kΩ 8.2MΩ 9.1Ω 91Ω 910Ω 9.1kΩ 91kΩ 910kΩ 9.1MΩ #generics #CommonPartsLibrary
  • Generic Capacitor
    A generic fixed capacitor ideal for rapid circuit topology development. You can choose between polarized and non-polarized types, its symbol and the footprint will automatically adapt based on your selection. Supported options include standard SMD sizes for ceramic capacitors (e.g., 0402, 0603, 0805), SMD sizes for aluminum electrolytic capacitors, and through-hole footprints for polarized capacitors. Save precious design time by seamlessly add more information to this part (value, footprint, etc.) as it becomes available. Standard capacitor values: 1.0pF 10pF 100pF 1000pF 0.01uF 0.1uF 1.0uF 10uF 100uF 1000uF 10,000uF 1.1pF 11pF 110pF 1100pF 1.2pF 12pF 120pF 1200pF 1.3pF 13pF 130pF 1300pF 1.5pF 15pF 150pF 1500pF 0.015uF 0.15uF 1.5uF 15uF 150uF 1500uF 1.6pF 16pF 160pF 1600pF 1.8pF 18pF 180pF 1800pF 2.0pF 20pF 200pF 2000pF 2.2pF 22pF 20pF 2200pF 0.022uF 0.22uF 2.2uF 22uF 220uF 2200uF 2.4pF 24pF 240pF 2400pF 2.7pF 27pF 270pF 2700pF 3.0pF 30pF 300pF 3000pF 3.3pF 33pF 330pF 3300pF 0.033uF 0.33uF 3.3uF 33uF 330uF 3300uF 3.6pF 36pF 360pF 3600pF 3.9pF 39pF 390pF 3900pF 4.3pF 43pF 430pF 4300pF 4.7pF 47pF 470pF 4700pF 0.047uF 0.47uF 4.7uF 47uF 470uF 4700uF 5.1pF 51pF 510pF 5100pF 5.6pF 56pF 560pF 5600pF 6.2pF 62pF 620pF 6200pF 6.8pF 68pF 680pF 6800pF 0.068uF 0.68uF 6.8uF 68uF 680uF 6800uF 7.5pF 75pF 750pF 7500pF 8.2pF 82pF 820pF 8200pF 9.1pF 91pF 910pF 9100pF #generics #CommonPartsLibrary
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    Terminal
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Inspect

SPeedy AI Pendent

SPeedy AI Pendent
Description

Created
Last updated by nico
2 Contributor(s)
ryanf
nico

Controls

Properties

Software
Python
Connectivity
USB, WiFi, Bluetooth
Wireless Protocol
Wi-Fi, Bluetooth
Operating Voltage
3.3V
Operating Humidity
10 to 90%
Compliance
RoHS, FCC, CE
Operating Temperature Range
-10°C to 70°C
Antenna
PCB Trace
Human Interface
RGB LED ring and 1 Button
Reliability
20,000 hrs
Life Cycle Expectancy
10 years
Form Factor
Wearables
Number of sensors
3
Sensor Type
2 Microphones and 1 Button
Domain Application
Consumer Electronics
Battery Type
LiPo 2000 mAh

Availability & Pricing

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