Diseño de PCB desde Cero

STRICT EDIT MODE: Modify the existing PCB only. Do not create a new board from scratch. Do not reuse any previous initialization prompt that rebuilds the entire board. Do not replace or redesign the existing ESP32 + HX711 section. Preserve the current working PCB as the source of truth.
TASK: Update the existing PCB by adding only reserved attachment positions for two separate external modules:
  1. PN532 module
  2. External LED module
IMPORTANT: These two items are separate external modules. They must NOT be merged into the main PCB as onboard circuitry. Do NOT place a PN532 chip on the board. Do NOT redesign the LED module as onboard LED-driver circuitry. Do NOT rebuild the existing ESP32 + HX711 design. Only reserve soldering / header / mounting positions so these modules can be connected later as separate boards.
PRESERVATION RULES: Keep the existing ESP32, HX711, USB-C, power, buttons, LEDs, and load-cell circuitry unchanged unless a minimal shift is strictly required for mechanical clearance. Do not disturb the existing antenna keepout for the ESP32. Do not change validated routing unless absolutely necessary. Do not reroute the board for cosmetic reasons.
MODULE RESERVATION RULES: Add one reserved footprint area for the PN532 module. Add one reserved footprint area for the external LED module. These reserved areas must be clearly separated from the main integrated circuitry. If the exact module footprint is not available, use generic 2.54mm plated through-hole header pads as placeholders. If exact dimensions are unknown, create clearly labeled reserved connection pads plus silkscreen outlines for each module area.
PLACEMENT: Place the reserved PN532 module area in a location that does not interfere with:
  • the ESP32 antenna region
  • USB-C insertion/access
  • mounting holes
  • buttons
  • load-cell connector
  • existing right-side analog section
Place the reserved LED module area in a practical location for later wiring and assembly. Keep both reserved module areas accessible for soldering and manual assembly. Maintain reasonable edge clearance.
ELECTRICAL INTENT: Do not guess missing circuitry. Do not auto-create onboard support circuits for PN532 or the LED module. Only create reserved pads / headers for later connection.
SILKSCREEN LABELING: Clearly label the reserved PN532 pads with functional names where appropriate, for example: PN532_VCC PN532_GND PN532_SDA PN532_SCL PN532_RST PN532_IRQ
Clearly label the reserved LED module pads with functional names where appropriate, for example: LED_VCC LED_GND LED_SIG
If the exact final pin mapping is not known, keep the pads as unconnected placeholders and label them clearly for later manual assignment.
ROUTING RULES: Do not modify existing validated power routing unless required. Maintain the existing stackup and plane strategy. Keep Layer 2 as solid GND if already implemented. If any new routing is required, use minimal routing only. Use 45-degree trace angles only. Do not place copper under the ESP32 antenna area.
MECHANICAL RULES: Add silkscreen outlines to show the reserved PN532 module area. Add silkscreen outlines to show the reserved LED module area. Make both reservation areas easy to identify during assembly.
OUTPUT EXPECTATION: Return an updated version of the current PCB, preserving the existing ESP32 + HX711 design, and adding only the reserved attachment positions for the separate PN532 module and separate LED module. Do not redesign the board from zero. Do not integrate these modules into the PCB as native onboard circuits.

1:14

Deciding on PCB action.

Thinking deeply about your request.

Working on your request.

Analyzing the PCB layout.

Analyzing the schematic.

Creating a high-level plan.

Working on your request.

Drafting a plan.

You want to preserve the current board and add only two reserved external-module attachment areas.
  • I’ve prepared the Plan to:
    • keep the existing design intact
    • add separate placeholder attachment areas
    • add labels and outlines
    • verify no conflicts with keepouts or critical regions
Click Start in the plan bar to execute it. Let me know if you want different reservation locations before starting.
UPDATE THE PLAN BEFORE EXECUTION.
IMPORTANT: The component set is defined, but the final PCB outline is NOT finalized yet. Do NOT assume a square board is the final mechanical shape. Do NOT optimize the layout for a fixed rectangular outline at this stage.
BOARD-SHAPE STATUS: The usable area is closer to a semi-circular or partially rounded shape, but the exact outline is still undecided. Therefore, treat the current board shape as temporary only.
EXECUTION MODE: Proceed in provisional placement mode only.
GOAL: Preserve the existing working circuitry and create a tentative layout strategy that can later be adapted to a custom rounded outline.
STRICT RULES:
  • Do not lock the design to a final square mechanical boundary.
  • Do not make placement decisions that depend on the board being rectangular.
  • Keep the existing ESP32 + HX711 design intact.
  • Add only the reserved external-module attachment areas for:
    1. PN532 module
    2. external LED module
  • Keep all placements flexible for later board-outline reshaping.
PLACEMENT PRIORITY:
  • Prioritize functional grouping, routing clarity, antenna keepout, USB access, button access, and analog integrity.
  • Leave margin around the outer region so the final outline can be reshaped later.
  • Avoid pushing important components into corners that only work on a square board.
  • Keep the ESP32 antenna edge condition valid for a future custom outline.
  • Keep the HX711 and load-cell area compact and protected from noisy rerouting.
OUTPUT EXPECTATION: Do not finalize the PCB as a square production board. Create a provisional, mechanically flexible placement that preserves the design and can be re-fit later into the final custom board outline.



  • Ground
    A common return path for electric current. Commonly known as ground.
  • Net Portal
    Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
  • Power Net Portal
    Wirelessly connects power nets on schematic. Identical to the net portal, but with a power symbol. Used to organize schematics and separate functional blocks. To wirelessly connect power net portals, give them the same designator. #portal #power
  • Generic Resistor
    A generic fixed resistor ideal for rapid circuit topology development. Its footprint automatically adapts based on the selected package case code—supporting 0402, 0603, 0805, 1203, and many other standard SMD packages, as well as axial horizontal and vertical configurations. Save precious design time by seamlessly add more information to this part (value, footprint, etc.) as it becomes available. Standard resistor values: 1.0 ohm, 10 ohm, 100 ohm, 1.0k ohm, 10k ohm, 100k ohm, 1.0M ohm 1.1 ohm, 11 ohm, 110 ohm, 1.1k ohm, 11k ohm, 110k ohm, 1.1M ohm 1.2 ohm, 12 ohm, 120 ohm, 1.2k ohm, 12k ohm, 120k ohm, 1.2M ohm 1.3 ohm, 13 ohm, 130 ohm, 1.3k ohm, 13k ohm, 130k ohm, 1.3M ohm 1.5 ohm, 15 ohm, 150 ohm, 1.5k ohm, 15k ohm, 150k ohm, 1.5M ohm 1.6 ohm, 16 ohm, 160 ohm, 1.6k ohm, 16k ohm, 160k ohm, 1.6M ohm 1.8 ohm, 18 ohm, 180 ohm, 1.8K ohm, 18k ohm, 180k ohm, 1.8M ohm 2.0 ohm, 20 ohm, 200 ohm, 2.0k ohm, 20k ohm, 200k ohm, 2.0M ohm 2.2 ohm, 22 ohm, 220 ohm, 2.2k ohm, 22k ohm, 220k ohm, 2.2M ohm 2.4 ohm, 24 ohm, 240 ohm, 2.4k ohm, 24k ohm, 240k ohm, 2.4M ohm 2.7 ohm, 27 ohm, 270 ohm, 2.7k ohm, 27k ohm, 270k ohm, 2.7M ohm 3.0 ohm, 30 ohm, 300 ohm, 3.0K ohm, 30K ohm, 300K ohm, 3.0M ohm 3.3 ohm, 33 ohm, 330 ohm, 3.3k ohm, 33k ohm, 330k ohm, 3.3M ohm 3.6 ohm, 36 ohm, 360 ohm, 3.6k ohm, 36k ohm, 360k ohm, 3.6M ohm 3.9 ohm, 39 ohm, 390 ohm, 3.9k ohm, 39k ohm, 390k ohm, 3.9M ohm 4.3 ohm, 43 ohm, 430 ohm, 4.3k ohm, 43K ohm, 430K ohm, 4.3M ohm 4.7 ohm, 47 ohm, 470 ohm, 4.7k ohm, 47k ohm, 470k ohm, 4.7M ohm 5.1 ohm, 51 ohm, 510 ohm, 5.1k ohm, 51k ohm, 510k ohm, 5.1M ohm 5.6 ohm, 56 ohm, 560 ohm, 5.6k ohm, 56k ohm, 560k ohm, 5.6M ohm 6.2 ohm, 62 ohm, 620 ohm, 6.2k ohm, 62K ohm, 620K ohm, 6.2M ohm 6.8 ohm, 68 ohm, 680 ohm, 6.8k ohm, 68k ohm, 680k ohm, 6.8M ohm 7.5 ohm, 75 ohm, 750 ohm, 7.5k ohm, 75k ohm, 750k ohm, 7.5M ohm 8.2 ohm, 82 ohm, 820 ohm, 8.2k ohm, 82k ohm, 820k ohm, 8.2M ohm 9.1 ohm, 91 ohm, 910 ohm, 9.1k ohm, 91k ohm, 910k ohm, 9.1M ohm #generics #CommonPartsLibrary
  • Generic Capacitor
    A generic fixed capacitor ideal for rapid circuit topology development. You can choose between polarized and non-polarized types, its symbol and the footprint will automatically adapt based on your selection. Supported options include standard SMD sizes for ceramic capacitors (e.g., 0402, 0603, 0805), SMD sizes for aluminum electrolytic capacitors, and through-hole footprints for polarized capacitors. Save precious design time by seamlessly add more information to this part (value, footprint, etc.) as it becomes available. Standard capacitor values: 1.0pF, 10pF, 100pF, 1000pF, 0.01uF, 0.1uF, 1.0uF, 10uF, 100uF, 1000uF, 10000uF 1.1pF, 11pF, 110pF, 1100pF 1.2pF, 12pF, 120pF, 1200pF 1.3pF, 13pF, 130pF, 1300pF 1.5pF, 15pF, 150pF, 1500pF, 0.015uF, 0.15uF, 1.5uF, 15uF, 150uF, 1500uF 1.6pF, 16pF, 160pF, 1600pF 1.8pF, 18pF, 180pF, 1800pF 2.0pF, 20pF, 200pF, 2000pF 2.2pF, 22pF, 220pF, 2200pF, 0.022uF, 0.22uF, 2.2uF, 22uF, 220uF, 2200uF 2.4pF, 24pF, 240pF, 2400pF 2.7pF, 27pF, 270pF, 2700pF 3.0pF, 30pF, 300pF, 3000pF 3.3pF, 33pF, 330pF, 3300pF, 0.033uF, 0.33uF, 3.3uF, 33uF, 330uF, 3300uF 3.6pF, 36pF, 360pF, 3600pF 3.9pF, 39pF, 390pF, 3900pF 4.3pF, 43pF, 430pF, 4300pF 4.7pF, 47pF, 470pF, 4700pF, 0.047uF, 0.47uF, 4.7uF, 47uF, 470uF, 4700uF 5.1pF, 51pF, 510pF, 5100pF 5.6pF, 56pF, 560pF, 5600pF 6.2pF, 62pF, 620pF, 6200pF 6.8pF, 68pF, 680pF, 6800pF, 0.068uF, 0.68uF, 6.8uF, 68uF, 680uF, 6800uF 7.5pF, 75pF, 750pF, 7500pF 8.2pF, 82pF, 820pF, 8200pF 9.1pF, 91pF, 910pF, 9100pF #generics #CommonPartsLibrary
  • Generic Inductor
    A generic fixed inductor suitable for rapid circuit topology development. The footprint automatically adapts based on the selected package, supporting standard SMD sizes (e.g., 0402, 0603, 0805) as well as well-known inductor packages such as SDR1806, PA4320, SRN6028, and SRR1260. Standard inductor values: 1.0 nH, 10 nH, 100 nH, 1.0 µH, 10 µH, 100 µH, 1.0 mH 1.2 nH, 12 nH, 120 nH, 1.2 µH, 12 µH, 120 µH, 1.2 mH 1.5 nH, 15 nH, 150 nH, 1.5 µH, 15 µH, 150 µH, 1.5 mH 1.8 nH, 18 nH, 180 nH, 1.8 µH, 18 µH, 180 µH, 1.8 mH 2.2 nH, 22 nH, 220 nH, 2.2 µH, 22 µH, 220 µH, 2.2 mH 2.7 nH, 27 nH, 270 nH, 2.7 µH, 27 µH, 270 µH, 2.7 mH 3.3 nH, 33 nH, 330 nH, 3.3 µH, 33 µH, 330 µH, 3.3 mH 3.9 nH, 39 nH, 390 nH, 3.9 µH, 39 µH, 390 µH, 3.9 mH 4.7 nH, 47 nH, 470 nH, 4.7 µH, 47 µH, 470 µH, 4.7 mH 5.6 nH, 56 nH, 560 nH, 5.6 µH, 56 µH, 560 µH, 5.6 mH 6.8 nH, 68 nH, 680 nH, 6.8 µH, 68 µH, 680 µH, 6.8 mH 8.2 nH, 82 nH, 820 nH, 8.2 µH, 82 µH, 820 µH, 8.2 mH #generics #CommonPartsLibrary
  • Terminal
    Terminal
    An electrical connector acting as reusable interface to a conductor and creating a point where external circuits can be connected.
  • RMCF0805JT47K0
    General Purpose Thick Film Standard Power and High-Power Chip Resistor 47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film Features: - RMCF – standard power ratings - RMCP – high power ratings - Nickel barrier terminations standard - Power derating from 100% at 70ºC to zero at +155ºC - RoHS compliant, REACH compliant, and halogen free - AEC-Q200 compliant
  • 875105359001
    10 µF 16 V Aluminum - Polymer Capacitors Radial, Can - SMD 30mOhm 2000 Hrs @ 105°C #commonpartslibrary #capacitor #aluminumpolymer #radialcan
  • CTL1206FYW1T
    Yellow 595nm LED Indication - Discrete 1.7V 1206 (3216 Metric)

ESP32 HX711 Load Cell Board Rev A

ESP32 HX711 Load Cell Board Rev A thumbnail
Welcome to your new project. Imagine what you can build here.

Properties

Properties describe core aspects of the project.

Pricing & Availability

Distributor

Qty 1

Arrow

$0.50–$1.32

Digi-Key

$5.53–$6.89

LCSC

$14.03–$14.39

Mouser

$10.37

TME

$0.00

Verical

$3.13–$17.76

Controls