Built the core schematic around Q1, Q2, Q3, Q4, Q5, and U1, with Eurorack power input on J1 and jack I/O on J2, J3, and J4
Assigned 1% metal-film values to R1 through R13, set C1 as the NP0/C0G timing capacitor, and added the required 10 uF plus 100 nF rail decoupling with C2, C3, C4, and C5
✅ Required active devices, precision resistors, NP0 timing capacitor, and rail decoupling are present in the design
✅ Layout size is set to 100 mm x 50 mm and the board stackup is now 2-layer
✅ BOM and netlist exports were generated
❌ The 4 mounting holes were added in the schematic but have not yet been position-verified in the PCB
❌ The detailed 2-layer routing plan is only partially implemented: the critical guidance is to keep the C1 / Q1 / Q2 high-impedance summing region compact, place U1 and the square-output path away from that node, route saw and square outputs separately, and use the bottom layer as a continuous ground reference, but actual placement optimization and routing verification still remain
Next steps
Finish PCB placement by positioning the four mounting holes and analog core, then run airwire review and finalize the low-bleed routing strategy. I can continue with that next.