I’ll review the connector’s current metadata, find and attach the official datasheet if missing, then verify symbol/footprint/pin details against it and summarize any issues.
Reviewed the Molex 206832-0401 part against available project data and Molex documentation. The Datasheet URL was already populated, so I did not overwrite it; I also found the official Molex sales drawing URL for reference: https://www.molex.com/content/dam/molex/molex-dot-com/products/automated/en-us/salesdrawingpdf/206/206832/2068320401_sd.pdf.
Key specs confirmed: Micro-Fit+ vertical PCB header, 3.00 mm pitch, dual-row, 4 circuits, through-hole, tin over nickel plating, black LCP housing, 12.5 A/contact max, 600 V max, −40 °C to +105 °C per loaded datasheet text.
Mismatches / flags:
Package or Case Code = “TO” looks incorrect for this connector; it should describe a through-hole vertical Micro-Fit+ header, not a transistor-outline package.
Part Type = “Connectors” is acceptable but less precise than “PCB Header” / “Wire-to-Board Connector.”
Symbol has 4 terminals numbered 1–4, matching circuit count, but pin descriptions are unspecified.
Footprint includes 4 signal pads plus 1 mounting/peg pad, consistent with a polarized through-hole header; detailed pad dimensions were not exposed in the layout readback, so I could not fully verify hole sizes/pad geometry against the sales drawing.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant
Connector Header Through Hole 4 position 0.118" (3.00mm)
2068320401 is a 4-position vertical PCB header from the Micro-Fit+ series by Molex. It is a shrouded, through-hole wire-to-board power connector designed for applications requiring compact size, secure mating, and high current capability. The connector features a 3.00 mm pitch, locking ramp retention, and robust construction suitable for industrial, telecommunications, medical, and general-purpose power distribution systems.
Key Features
4-position (2×2) vertical header
3.00 mm pitch (Micro-Fit+ family)
Through-hole PCB mounting
Shrouded design with locking ramp for secure mating
Current rating up to 12.5 A per contact
Voltage rating up to 600 VAC/DC
Tin-plated copper alloy contacts
Operating temperature range: -40°C to +105°C
Glass-filled LCP housing with UL94 V-0 flammability rating
Board guide feature for improved PCB assembly alignment
Suitable for wire-to-board power and signal applications
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