Part Project Review Checklist

Part Review Summary 1) Available Project Information

Table


FieldValue
Project / partThis part project is for LM25117PSQE/NOPB
ManufacturerTexas Instruments
MPNLM25117PSQE/NOPB
Designator prefixU
Datasheet URL present in projectYes - PDF
Package in project footprintQFN50P400X400X80-25N
Footprint source assetQFN50P400X400X80-25N.kicad_mod
3D model presentYes - STEP model is attached
Schematic pin count24 terminals
Footprint pad count in asset25 pads total, including exposed pad 25
Project descriptionLM25117PSQE/NOPB RTW24_2P6X2P6_TEX RTW24_2P6X2P6_TEX-M RTW24_2P6X2P6_TEX-L
2) Datasheet Status

Table


CheckResult
Datasheet already set?Yes
Web search needed?No
Property update needed?No
3) Datasheet Metadata Extraction Device Overview and Special Features

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CategorySummary
FunctionSynchronous buck controller for high-voltage / wide-input step-down regulators
Control methodEmulated peak current mode control
Input operating range4.5 V to 42 V
Frequency rangeProgrammable from 50 kHz to 750 kHz
Output programmingProgrammable output from 0.8 V reference
Gate driveExternal high-side and low-side NMOS gate drivers, adaptive dead-time control
Notable featuresDiode emulation mode, analog current monitor, programmable current limit, hiccup overcurrent protection, soft-start/tracking, programmable UVLO, thermal shutdown
Internal bias behaviorInternal high-voltage bias regulator, with optional switchover to external bias supply
Ordering / Package Metadata

Table


ItemDatasheet Value
Exact orderableLM25117PSQE/NOPB
Package familyWQFN (RTW)
Pin count24 pins
Body size4.00 mm x 4.00 mm
Max package height0.8 mm max
MSLLevel-1-260C-UNLIM
Part markingL25117P
Absolute Maximum Ratings

Table


ParameterMinMaxUnit
VIN to AGND-0.345V
SW to AGND-3.045V
HB to SW-0.315V
VCC to AGND-0.315V
HO to SW-0.3HB + 0.3V
LO to AGND-0.3VCC + 0.3V
FB, DEMB, RES, VCCDIS, UVLO to AGND-0.315V
CM, COMP to AGND-0.37V
SS, RAMP, RT to AGND-0.37V
CS, CSG, PGND to AGND-0.30.3V
Storage temperature-55150°C
Junction temperature-40150°C
Recommended Operating Conditions

Table


ParameterMinMaxUnit
VIN4.542V
VCC4.514V
HB to SW4.514V
Junction temperature-40125°C
Key Electrical Characteristics

Table


CategoryParameterMinTypMaxUnit
VIN supplyOperating current-4.86.2mA
VIN supplyShutdown current-1640µA
VCC regulatorRegulation6.857.68.2V
VCC regulatorSourcing current limit-3042mA
VCC UVLORising threshold3.754.04.15V
VCCDISRising threshold1.221.251.29V
UVLORising threshold1.221.251.29V
Soft-startSS current source71012µA
FeedbackFB reference voltage788800812mV
Error ampDC gain-80-dB
Error ampUnity gain bandwidth-3-MHz
OscillatorRT = 25 kOhm180200220kHz
OscillatorRT = 10 kOhm430480530kHz
Current limitSense threshold106120135mV
HO driverPeak source current-2.2-A
HO driverPeak sink current-3.3-A
LO driverPeak source current-2.5-A
LO driverPeak sink current-3.3-A
ThermalShutdown-165-°C
Pin Descriptions

Table


WQFN PinNameDatasheet TypeDatasheet Description
1DEMBInputEnables diode emulation when low; internal 50 kOhm pull-down
2RESOutputRestart timer for hiccup mode using external capacitor
3SSInputSoft-start ramp capacitor input with internal 10 µA source
4RTInputOscillator programming / sync input
5AGNDGroundAnalog ground
6NCNCNo electrical contact
7VCCDISInputDisables internal VCC regulator when above 1.25 V
8FBInputFeedback input, regulation threshold 0.8 V
9COMPOutputError amplifier output
10CMOutputAverage sensed inductor current monitor
11RAMPInputPWM ramp signal input
12CSInputCurrent sense input, high side of sense resistor
13CSGInputKelvin ground sense to current sense resistor
14PGNDGroundPower ground return for low-side gate driver
15LOOutputLow-side NMOS gate drive
16VCCPower / Output / InputBias supply pin, decouple locally to PGND
17NCNCNo electrical contact
18SWInput / OutputSwitching node
19HOOutputHigh-side NMOS gate drive
20HBPowerBootstrap supply
21NCNCNo electrical contact
22VINPower / InputSupply input for VCC regulator
23NCNCNo electrical contact
24UVLOInputUndervoltage lockout programming pin
25EPExposed padElectrically isolated; should be soldered to ground plane for thermal performance
Package Dimensions and Land Pattern

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ItemDatasheet Value
Package codeRTW0024A
Package typeWQFN
Package size A4.1 / 3.9 mm
Package size B4.1 / 3.9 mm
Lead pitch0.5 mm
Lead width0.3 / 0.2 mm
Lead length0.5 / 0.3 mm
Exposed pad2.6 mm +/- 0.1 mm square
Board-layout terminal pad example24x (0.25 mm x 0.6 mm)
Pad clearance around body0.07 mm min / 0.07 mm max all around
Stencil guidance78% printed solder coverage on exposed pad
Mask styleNon-solder-mask-defined preferred
4) Symbol / Footprint Cross-Check Cross-Check Findings

Table


AreaResultRiskDetails
MPN vs packagePassLowProject MPN and datasheet orderable both match LM25117PSQE/NOPB, which is the 24-pin RTW WQFN version.
Symbol pin count vs datasheetPassLowSymbol has 24 terminals, matching the package pin count.
Footprint package familyPassLowFootprint asset name indicates 4.0 mm x 4.0 mm, 0.5 mm pitch, 25-pad QFN, consistent with datasheet package family.
Exposed pad presencePartial passMediumFootprint asset includes pad 25 at 2.6 mm x 2.6 mm, matching datasheet EP size.
Exposed pad in symbolNeeds reviewMediumThe symbol exposes only 24 terminals and does not include an EP terminal. Since the datasheet says EP is electrically isolated, that is electrically acceptable, but the package note still requires it to be soldered for thermal/mechanical performance.
Exposed pad soldering guidanceConcernHighDatasheet says EP should be soldered to the ground plane and is critical for thermal/mechanical performance. If this footprint instance does not preserve pad 25 and its paste/mask correctly in manufacturing output, assembly reliability can suffer.
Perimeter pad sizeDeviationMediumDatasheet example land pattern is 0.25 mm x 0.6 mm. Imported footprint pads appear to be about 0.27 mm x 0.86 mm. That is noticeably longer than TI's example and should be verified against the intended IPC or source-library footprint.
EP stencil coverageMismatchHighDatasheet calls for 78% solder coverage under EP. The footprint asset appears to define a single paste opening about 1.64 mm x 1.64 mm, which is only about 39.8% of EP area. That is a significant mismatch.
Pin naming consistencyPassLowSymbol terminal names line up with datasheet names and pin numbers.
Pin type metadataMismatchLow to MediumSeveral pin electrical types in the symbol metadata do not match datasheet function. This usually will not break manufacturing, but can weaken ERC quality and part correctness.
No-connect pinsPassLowNC pins are present in symbol and footprint positions consistent with datasheet.
Pin-Type Metadata Mismatches

Table


PinDatasheet RoleCurrent Project RoleImpact
VIN, pin 22Power / InputInputERC quality issue
UVLO, pin 24InputUnspecifiedERC quality issue
RES, pin 2OutputUnspecifiedERC quality issue
HB, pin 20PowerUnspecifiedERC quality issue
SW, pin 18Input / OutputUnspecifiedERC quality issue
CSG, pin 13InputUnspecifiedERC quality issue
AGND, pin 5GroundPower InERC semantics issue
PGND, pin 14GroundPower InERC semantics issue
VCC, pin 16Power / Output / InputPower InSlight semantic mismatch
RAMP, pin 11InputUnspecifiedERC quality issue
Bottom Line

Table


SeverityFinding
HighThe exposed-pad stencil definition appears inconsistent with the datasheet's 78% paste recommendation.
HighThe thermal / mechanical exposed-pad implementation must be verified in final manufacturing outputs.
MediumThe perimeter copper pad size deviates from TI's example board layout and should be confirmed against the intended footprint source.
Low / MediumSeveral symbol pin types should be corrected to improve rule checking and part accuracy.
Recommended Fixes

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PriorityAction
1Verify that exposed pad 25 is truly present in the generated footprint/manufacturing outputs and not lost due to missing symbol mapping.
2Adjust the exposed-pad paste pattern to match TI's stencil guidance much more closely.
3Recheck perimeter pad dimensions against TI's RTW example land pattern or the exact source-library recommendation used to generate this footprint.
4Correct symbol electrical pin types for VIN, UVLO, RES, HB, SW, CSG, AGND, PGND, VCC, and RAMP.
If you want, I can turn this into a clean pass/fail checklist file for this part project.
Make checklist file
Inspect exposed pad
Review pin metadata


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LM25117PSQE/NOPB

LM25117PSQE/NOPB thumbnail
Buck Regulator Positive Output Step-Down DC-DC Controller IC 24-WQFN (4x4) #CommonPartsLibrary #IntegratedCircuit #PowerManagement #switching-regulator #LM25117

Properties

LM25117PSQE/NOPB

Texas Instruments

Power Management

U

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