I reviewed the part project against its datasheet and the current symbol/footprint setup. I followed the standard part-project sync workflow: verify the datasheet URL first, then compare project metadata, terminals, and footprint against the datasheet pinout and package data
Result
The Datasheet URL property is already set, so no web lookup or property update was needed.
The project has the correct 4-terminal structure for this crystal.
The footprint pin numbering and pad geometry match the datasheet land pattern.
I found metadata mismatches and missing terminal details that should be corrected.
Current project statusProject properties currently present
The datasheet explicitly lists the layout as #1 HOT, #2 GND, #3 HOT, #4 GND, which matches the existing project numbering. For simple crystal parts, the pin-type mapping should follow the standard passive/ground treatment rather than leaving terminals as Unspecified
Footprint verificationDatasheet recommended land pattern
Table
Parameter
Value
Pad size
1.05 mm × 1.30 mm
Horizontal pad pitch
2.30 mm
Vertical pad pitch
1.85 mm
Body size
3.20 mm × 2.50 mm
Current footprint asset
The project footprint asset CX3225SB16000D0GZJC1.kicad_mod contains:
Table
Pad
Position (mm)
Size (mm)
Rotation
1
(-1.150, 0.925)
1.050 × 1.300
90°
2
(1.150, 0.925)
1.050 × 1.300
90°
3
(1.150, -0.925)
1.050 × 1.300
90°
4
(-1.150, -0.925)
1.050 × 1.300
90°
Derived spacing:
Horizontal center-to-center: 2.300 mm
Vertical center-to-center: 1.850 mm
Footprint verdict
Pad count: match
Pad numbering: match
Pad sizes: match
Pad spacing: match
Body outline: consistent with 3.2 mm × 2.5 mm
So the PCB footprint looks correct against the datasheet.
Mismatches and issues found1) Operating temperature in the project description is wrong
Your project description says:
−25°C to +85°C
But the datasheet says:
Operating:-10°C to +75°C
Storage:-40°C to +85°C
So the description appears to have mixed up storage and operating limits.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant
16 MHz ±15ppm Crystal 8pF 60 Ohms 4-SMD, No Lead
The CX3225SB16000D0GZJC1, manufactured by Kyocera AVX, is a 16.000 MHz crystal oscillator element designed to provide precise frequency reference for microcontrollers, communication ICs, and digital systems. It belongs to the CX3225SB series, known for compact size and stable frequency performance.
Key Characteristics
Type: Quartz crystal (passive frequency component)
Frequency: 16 MHz
Load Capacitance: 8 pF
Frequency Stability: ±15 ppm
Frequency Tolerance: ±15 ppm
Operating Mode: Fundamental
ESR (Equivalent Series Resistance): ~60–80 Ω
Mechanical Details
Package: 4-SMD, no-lead (surface mount)
Size: 3.2 mm × 2.5 mm (3225 package)
Height: ~0.6 mm (low profile)
Operating Conditions
Temperature Range: −25°C to +85°C
Mounting Type: Surface mount (SMT)
Function (Simple Explanation)
This component:
Generates a stable clock signal (16 MHz)
Acts as the timing reference for MCUs, processors, or RF modules
Works together with internal oscillator circuits inside ICs
Microcontroller clock sources (e.g., ESP32, STM32, AVR)
Communication modules
Embedded systems
Consumer electronics
IoT devices
#CommonPartsLibrary#Crystal#Oscillator#resonator