Part Metadata Review and Cross-Check

Thought for 3 mins 5 sec

flux

Here is the requested end-to-end part review and cross-check for BM20B(0.8)-20DS-0.4V(53).

Review of current part info (from this part project)

MPN: BM20B(0.8)-20DS-0.4V(53)
Manufacturer: Hirose
Series: BM20
Description: Board to Board & Mezzanine Connectors 20P DR RCP B2B/B2FPC 0.8 mm H 0.4 mm P VSM
Pin count in symbol: 20 signal pins plus 4 mechanical pads (MP1–MP4) present as terminals:
- Top row: 2, 4, 6, 8, 10, 12, 14, 16, 18, 20
- Bottom row: 1, 3, 5, 7, 9, 11, 13, 15, 17, 19
- Mechanical pads: MP1, MP2, MP3, MP4
Designator prefix (project property): J
Package/Case code (project property): TO (note: likely incorrect for this connector; see cross-check)
Datasheet: Datasheet

Datasheet property check

Datasheet URL already set: Datasheet
No update required.

Datasheet scan and metadata extraction

Electrical and environmental

Rated current (per contact): 0.3 A
Rated voltage: 30 V AC / 30 V DC
Withstanding voltage: 100 V max
Contact resistance: 100 mΩ max
Insulation resistance: 50 MΩ min (at 100 V DC)
Operating temperature: -35 °C to +85 °C
Mating/unmating durability: 10 cycles

Mechanical and features

Connector type: Receptacle, SMT, straight
Number of positions: 20
Contact pitch: 0.4 mm
Mated height: 0.8 mm
Contact plating: Gold, thickness 0.05 μm
Housing: LCP, black, UL94V-0

Outline dimensions

Length: 6.48 mm
Width: 2.3 mm
Height: 0.8 mm
2D drawing: 2D Drawing (Hirose)
- https://www.hirose.com/en/product/document?clcode=CL0684-9009-7-53&documentid=0001234244&documenttype=2DDrawing&lang=en&productname=BM20B%280.8%29-20DS-0.4V%2853%29&series=BM20

Recommended PCB land pattern (highlights)

Contact pad size: 0.23 mm × 0.42 mm (typical; matches footprint data)
Contact pitch: 0.4 mm
Vertical pad span to achieve approx. 2.6 mm overall (consistent with pad centers ±1.09 mm and pad length 0.42 mm)
Mechanical hold-down pads present (dimensions per drawing)

Packaging and logistics

Packaging type: Reel
Purchase unit: 1000 pcs
Mass: 0.016 g

Mating headers

Cross-check: symbol and footprint vs datasheet

Schematic symbol

Pin count: 20 signal pins present and 4 mechanical pads (OK).
Row numbering orientation: Mismatch found.
- Symbol has even-numbered pins on the top row (2, 4, …, 20) and odd on the bottom row (1, 3, …, 19).
- The footprint (and standard numbering in the drawing) place odd pins on the top row and even pins on the bottom row (pad 1 at top-left, pad 2 bottom-left, then alternating by column).
- Impact: If left uncorrected, symbols-to-footprint pin mappings will be inverted by row, leading to incorrect connectivity in downstream designs.
- Action recommended: Swap the symbol’s row numbering so the top row is odd (1, 3, 5, …, 19) and bottom row is even (2, 4, 6, …, 20), matching the footprint’s pin map.

Footprint

Pad count and names: 20 signal pads (1–20) plus 4 mechanical pads (MP1–MP4) present (OK).
Pitch: Pads are placed at x = -1.800, -1.400, -1.000, -0.600, -0.200, 0.200, 0.600, 1.000, 1.400, 1.800 mm (Δx = 0.4 mm), matching the 0.4 mm pitch (OK).
Pad size: 0.23 mm × 0.42 mm for signal pads, matching datasheet recommendations (OK).
Row spacing: Pad centers at y = ±1.09 mm; with 0.42 mm pad length this yields approx. 2.60 mm overall pad span, aligning with land pattern guidance (OK).
Mechanical pads: MP1/MP4 at x = -3.010, y = ±0.925; MP2/MP3 at x = 3.010, y = ±0.925; size 0.30 mm × 0.75 mm (reasonable; consistent with hold-down features in the drawing).
Pin 1 indicator: Present in silkscreen at the top-left corresponding to pad 1 (OK).
Outline: F.Fab outline is 6.48 mm × 2.3 mm (OK vs outline dimensions).

Project properties

Package/Case code: Set to “TO”. This does not match the connector’s package; recommend updating to a connector-appropriate code/description (e.g., “Board-to-board mezzanine, 0.4 mm pitch, 20 pos, 0.8 mm mated height”). Leaving “TO” risks confusion and incorrect sourcing.

Summary of issues to fix

Symbol pin row orientation is inverted relative to the footprint (must flip so top row is odd, bottom row even).
Project package/case code “TO” is incorrect for this connector (update to accurate connector packaging description).

If you want, I can proceed to:

Re-number the symbol terminals to match the footprint (odd top, even bottom).
Update the package/case property to a connector-appropriate value.

Run full design review

Check pin numbering

Verify footprint dims

Fix symbol mapping

BOM metadata check

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