Powering Project with PC and Battery

flux

1:33

Checking if I can make the changes for you.

I’ll fix your GND connectivity by enabling stitching, repouring fills, and tying any islands.
Planned steps:
  1. Verify a single GND net across the schematic.
  2. Set GND Fill Stitching Density to 5 mm 5 mm and apply a small offset.
  3. Repour fills; add stitching vias near BUCK_MODULE1, PROG_MODULE1, and J1 shield.
  4. Add short GND traces/vias where pours can’t reach and re-run DRC.
Click Start on the plan bar to run this.
193 days

Started implementing a plan

#Goal

- Resolve the ground connectivity issues in the On Air R2 Demo PCB by ensuring that all GND islands are connected through proper copper fills, stitching vias, and tied traces where necessary.

#Implementation plan

1. Verify schematic ground net consistency

1. Inspect the schematic to ensure that a single GND net is utilized throughout the design.

2. Replace any custom ground portals with the standard Ground symbol if needed.

2. Configure PCB fill stitching for the GND net

1. Set the copper fill stitching density for the GND net to 5 mm x 5 mm.

2. Apply a small fill stitching offset if necessary to improve connectivity near critical areas.

3. Repour copper fills and identify isolated islands

1. Repour the copper fills on the PCB and inspect for isolated GND islands.

2. Place stitching vias to bridge top and bottom layers near [BUCK_MODULE1], [PROG_MODULE1], and [J1] shield pads.

4. Tie remaining ground islands

1. Check for any unrouted GND pads or islands caused by pour keepouts.

2. Add short traces or vias to connect any remaining isolated GND islands to the main GND pour.

5. Validate connectivity

1. Rerun the DRC to confirm that all GND airwires and floating copper issues are resolved.

#Success criteria

- A single, consistent GND net is present both in the schematic and PCB layout.

- The copper fills on the PCB are repoured with a stitching density of 5 mm x 5 mm, and stitching vias are properly placed near [BUCK_MODULE1], [PROG_MODULE1], and [J1].

- All isolated GND islands are connected via traces or vias, with no remaining DRC errors related to ground connectivity.

193 days

Worked

0:10

Started: Replace any custom ground portal components with the standard Ground symbol in the schematic.

193 days

Worked

0:12

Started: Review the schematic and ensure all ground connections use the standard Ground symbol (net GND); remove any Ground net portals or custom ground symbols and replace them with the standard Ground symbol.

193 days

Worked

0:10

Started: Set GND copper fill stitching density to 5 mm x 5 mm in the PCB layout.

193 days

Worked

0:08

Started: Set top and bottom copper layers as power planes for the GND net.

193 days

Worked

0:11

Started: Configure the GND pour stitching density to 5 mm × 5 mm and apply a small fill offset.

193 days

Worked

0:09

Started: Set the GND net pour stitching density to 5 mm × 5 mm.

193 days

Worked

0:08

Started: Set the fill stitching density of the GND net copper pour on the top copper layer to 5 mm × 5 mm.

193 days

flux

0:00

I’ve replaced all custom ground portals with the standard Ground symbol, so the schematic now uses a single GND net. However, none of the PCB‐side steps (copper pours, stitching, via placement, or DRC validation) were applied. As a result, the copper fills were not repoured, stitching vias weren’t placed, and isolated islands remain. The ground‐connectivity issues on the PCB are still unresolved.
193 days

Stopped due to a problem. Please try again.

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BUCK_MODULE1
PROG_MODULE1
J4
C10
Capacitance
1uF
C9
Capacitance
0.1uF
C8
Capacitance
1uF
M2
C7
Capacitance
1uF
M4
3.3V
5V/BATT
MCU_RX
RESET
0V-1.9V
BUCKEN
0V-1.9V
USB_DP
0V-1.9V
0V-1.9V
SW2
J2
Not Recommended for New Designs
GPIO0
3.3V
5V/BATT
0V-1.9V
U3 IO13/HSPI_COPI - BUCK_MODULE BUCK_SPI_COPI
U3 IO15/HSPI_CS0 - BUCK_MODULE BUCK_SPI_CS
Test Breakout
U3 IO14/HSPI_CLK - BUCK_MODULE BUCK_SPI_CLK
R9
Resistance
10kΩ
U3 IO14/HSPI_CLK - BUCK_MODULE BUCK_SPI_CLK
3.3V
3.3V
0V-1.9V
R10
Resistance
10kΩ
USB_DP
3.3V
GPIO0
RESET
3.3V
3.3V
GPIO0
GPIO0
BUCKEN
MCU_TX
MCU_TX
MCU_RX
3.3V
3.3V
3.3V
USB_DN
RESET
U3 IO14/HSPI_CLK - BUCK_MODULE BUCK_SPI_CLK
RESET
0V-1.9V
5V/BATT
U3 IO15/HSPI_CS0 - BUCK_MODULE BUCK_SPI_CS
BUCKEN
USB_DN
MCU_TX
5V_USB
R7
Resistance
5.1kΩ
U3 IO15/HSPI_CS0 - BUCK_MODULE BUCK_SPI_CS
MCU_RX
U3 IO13/HSPI_COPI - BUCK_MODULE BUCK_SPI_COPI
SW1
U3 IO13/HSPI_COPI - BUCK_MODULE BUCK_SPI_COPI
U4
Manufacturer Part Number
ME6206A33XG
U3
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On Air R2 Demo thumbnail
Daddy's second circuit board. A sign to let my wife know when I'm on a call. Activates with a slide switch and is powered by USB-C. R2 changes: -Moving to Letter Modules for ease of design -Adding ESP32 for WiFi On/Off and intensity control
-Optional: Add unpopulated AA Battery Holder for battery option
R1 changes: -Changed LED part to Red LEDs -adjusted resistor value of buck converter -Changed source for USB-C Connector -Removed exposed soldermask on buck converter with negative soldermask expansion -Order with black soldermask
Modified by markwu2001:
Adjustable Brightness,
85-90% Drive Efficiency
<5W Operation (Can use 5V 1A Plug) This project can be purchased from LCSC

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