Powering Project with PC and Battery

1:33

Checking if I can make the changes for you.

I’ll fix your GND connectivity by enabling stitching, repouring fills, and tying any islands.

Planned steps:

Verify a single GND net across the schematic.
Set GND Fill Stitching Density to 5 mm 5 mm and apply a small offset.
Repour fills; add stitching vias near BUCK_MODULE1, PROG_MODULE1, and J1 shield.
Add short GND traces/vias where pours can’t reach and re-run DRC.

Click Start on the plan bar to run this.

Plan

#Goal

Resolve the ground connectivity issues in the On Air R2 Demo PCB by ensuring that all GND islands are connected through proper copper fills, stitching vias, and tied traces where necessary.

#Implementation plan

Verify schematic ground net consistency
1. Inspect the schematic to ensure that a single GND net is utilized throughout the design.
2. Replace any custom ground portals with the standard Ground symbol if needed.
Configure PCB fill stitching for the GND net
1. Set the copper fill stitching density for the GND net to 5 mm x 5 mm.
2. Apply a small fill stitching offset if necessary to improve connectivity near critical areas.
Repour copper fills and identify isolated islands
1. Repour the copper fills on the PCB and inspect for isolated GND islands.
2. Place stitching vias to bridge top and bottom layers near [BUCK_MODULE1], [PROG_MODULE1], and [J1] shield pads.
Tie remaining ground islands
1. Check for any unrouted GND pads or islands caused by pour keepouts.
2. Add short traces or vias to connect any remaining isolated GND islands to the main GND pour.
Validate connectivity
1. Rerun the DRC to confirm that all GND airwires and floating copper issues are resolved.

#Success criteria

A single, consistent GND net is present both in the schematic and PCB layout.
The copper fills on the PCB are repoured with a stitching density of 5 mm x 5 mm, and stitching vias are properly placed near [BUCK_MODULE1], [PROG_MODULE1], and [J1].
All isolated GND islands are connected via traces or vias, with no remaining DRC errors related to ground connectivity.

198 days

Started implementing a plan

#Goal

- Resolve the ground connectivity issues in the On Air R2 Demo PCB by ensuring that all GND islands are connected through proper copper fills, stitching vias, and tied traces where necessary.

#Implementation plan

1. Verify schematic ground net consistency

1. Inspect the schematic to ensure that a single GND net is utilized throughout the design.

2. Replace any custom ground portals with the standard Ground symbol if needed.

2. Configure PCB fill stitching for the GND net

1. Set the copper fill stitching density for the GND net to 5 mm x 5 mm.

2. Apply a small fill stitching offset if necessary to improve connectivity near critical areas.

3. Repour copper fills and identify isolated islands

1. Repour the copper fills on the PCB and inspect for isolated GND islands.

2. Place stitching vias to bridge top and bottom layers near [BUCK_MODULE1], [PROG_MODULE1], and [J1] shield pads.

4. Tie remaining ground islands

1. Check for any unrouted GND pads or islands caused by pour keepouts.

2. Add short traces or vias to connect any remaining isolated GND islands to the main GND pour.

5. Validate connectivity

1. Rerun the DRC to confirm that all GND airwires and floating copper issues are resolved.

#Success criteria

- A single, consistent GND net is present both in the schematic and PCB layout.

- The copper fills on the PCB are repoured with a stitching density of 5 mm x 5 mm, and stitching vias are properly placed near [BUCK_MODULE1], [PROG_MODULE1], and [J1].

- All isolated GND islands are connected via traces or vias, with no remaining DRC errors related to ground connectivity.

198 days

Worked