Project Start

I started the full wiring pass and made real schematic changes, but I’m blocked now because there are no available ACUs, so I can’t continue executing mutations or ERC cleanup.
What was completed:
  • Added support passives for USB VBUS, eFuse, AP63203 buck, isolated power filtering, LDOs, MCU decoupling, isolated I2C pull-ups, SRC4392 decoupling, clock decoupling, reset, and AES3 termination.
  • Wired USB-C VBUS/GND, USB D+/D− with ESD, CC1/CC2 to TUSB320, TPS25210 eFuse, AP63203 3.3 V buck, and TUSB320 power/config/I2C.
  • Datasheet check found an important correction: AP63203 is fixed 3.3 V, so the added FB divider must be removed and FB tied to the 3.3 V output sense.
  • Datasheet check also confirmed RT1024 needs internal DCDC support: 4.7 µH inductor, 33 µF output cap, and delayed DCDC_PSWITCH assertion.
Open items:
  • Remove AP63203 FB divider R4/R5 and tie U5 FB to 3V3_MCU.
  • Change AP63203 inductor L1 from 2.2 µH to 3.9 µH.
  • Add/wire RT1024 internal DCDC parts and 24 MHz MCU clock source.
  • Finish MCU power/reset/debug, isolation barrier, SRC4392, clocks, AES3 transformer/XLR wiring.
  • Run ERC and fix both electrical issues and schematic-wire collision/label cleanup once ACUs are available.
Fix AP63203 first
Manual AP63203 steps
RT1024 DCDC wiring
Check SRC4392 datasheet
Prioritize ERC cleanup
J1
Y2
U1
End of Life
U5
C46
Capacitance
100nF
C49
Capacitance
100nF
C20
Capacitance
100nF
C17
Capacitance
100nF
C45
Capacitance
100nF
C41
Capacitance
100nF
C48
Capacitance
100nF
C25
Capacitance
10uF
C7
Capacitance
22uF
C40
Capacitance
100nF
C16
Capacitance
22uF
C14
Capacitance
1uF
C3
Capacitance
10nF
C1
Capacitance
10uF
C10
Capacitance
1uF
C21
Capacitance
100nF
C13
Capacitance
1uF
C24
Capacitance
100nF
C26
Capacitance
100nF
C6
Capacitance
22uF
C23
Capacitance
100nF
C5
Capacitance
10uF
C22
Capacitance
100nF
C47
Capacitance
100nF
C4
Capacitance
100nF
C9
Capacitance
1uF
C44
Capacitance
10uF
C27
Capacitance
1uF
C12
Capacitance
2.2uF
C8
Capacitance
100nF
C43
Capacitance
100nF
C15
Capacitance
10nF
C11
Capacitance
1uF
C2
Capacitance
100nF
C42
Capacitance
100nF
R40
Resistance
110Ω
R30
Resistance
10kΩ
PS1
U6
R2
Resistance
100kΩ
R20
Resistance
4.7kΩ
R1
Resistance
20kΩ
R31
Resistance
10kΩ
R42
Resistance
56Ω
R3
Resistance
10kΩ
R41
Resistance
56Ω
R21
Resistance
4.7kΩ
R5
Resistance
158kΩ
R23
Resistance
4.7kΩ
R32
Resistance
10kΩ
R4
Resistance
499kΩ
R22
Resistance
4.7kΩ
D2
J4
L1
Inductance
2.2uH
U2
FB1
Inductance
Ferrite bead 600Ω@100MHz H
J3
U8
T1
U12
U7
U10
Y1
T2
U3
U11
U4
D1
U9
J2

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Rev A Component Selection — AES3-USB
Status: Rev A schematic-selection draft
Date: 2026-07-26
Project: AES3-USB
1. Selection Summary
This Rev A selection keeps the frozen architecture:
  • USB-C power/data and MIMXRT1024 remain on the USB/UI side.
  • SRC4392, AES3 transformers/XLRs, and dual low-jitter oscillators remain on the isolated audio side.
  • OLED, LEDs, and UI/prototype I2C remain on the USB/UI side.
  • The isolation barrier is crossed only by isolated power and intentional digital isolators.
  • No USB Power Delivery; use USB-C 5 V with CC/current-awareness.
Two exact preferred parts are not currently available as verified Flux library parts and need part creation/import before schematic capture:
  1. NXP MIMXRT1024DAG5A — confirmed real NXP 144-LQFP i.MX RT1024 with 4 MB on-chip flash, but not found as an exact Flux library component.
  2. Crystek CCHD-957-25-22.5792 — preferred low-jitter 22.5792 MHz companion oscillator exists at distributors, but the exact part was not found in Flux.
Missing-part requests were submitted for both.
2. Primary Rev A Parts

Table


BlockSelected partMPN / familyFlux statusNotes
MCUNXP i.MX RT1024MIMXRT1024DAG5ANeeds part creation/importPreferred exact MCU: Cortex-M7, 500 MHz, 4 MB on-chip flash, 144-LQFP. Avoid mandatory external QSPI for Rev A unless firmware needs extra storage.
Audio interface / SRCTI SRC4392SRC4392IPFBLibrary candidates foundUse TQFP-48. Verify chosen library symbol/footprint against TI datasheet before wiring.
USB-C receptacleGCT USB-C USB 2.0 receptacleUSB4215-03-A or equivalent 16-pin USB-C 2.0 receptacleLibrary candidate foundUSB 2.0 data + VBUS + CC pins only.
USB-C CC/current awarenessTI Type-C CC controllerTUSB320LAIRWBRLibrary candidate foundUse sink/UFP behavior to detect advertised Type-C current. No PD contract.
USB data ESDTI low-cap ESD arrayTPD4E02B04DQALibrary candidate foundPlace adjacent to USB-C connector.
VBUS TVS5 V unidirectional TVSSMF5.0A preferred for robust VBUS surgeLibrary candidate foundUse on 5 V entry; place close to connector/eFuse input.
USB input protectionTI eFuseTPS25210LRPWRLibrary candidate foundSet ILIM around the selected USB current policy; recommended starting point about 1 A, not unlimited.
USB-side 3.3 V buckDiodes synchronous buckAP63203WU-7Library candidate foundActive, fixed 3.3 V, 2 A, spread-spectrum. Replaces PAM2305 because PAM2305 fixed variants are not recommended for new designs.
Isolated 5 V supplyXP Power isolated DC/DCISU0205S05Library candidate found5 V in, isolated 5 V out, 2 W / 400 mA class. Treat as noisy pre-regulator; add filtering and post-regulators.
Audio 3.3 V LDOMPS low-noise LDOMP20051DQ-LF-PLibrary candidate foundGeneral 3V3_AUDIO_CLEAN post-regulator. Verify output-set network and stability caps.
Clock 3.3 V LDOMPS fixed low-noise LDOMP20056GJ-33-ZLibrary candidate foundDedicated 3V3_CLK_CLEAN for oscillators and, if quiet enough, clock buffer. Consider premium LT3042/TPS7A/ADM715x class if noise testing requires it.
SRC 1.8 V LDOTI low-noise LDOTPS79318-EPLibrary candidate found1.8 V, 200 mA; enough for SRC4392 VDD18 design margin based on ~58 mA high-rate typical.
I2C isolationTI isolated I2CISO1541 preferred, ISO1540 alternateLibrary candidates foundISO1541 is preferred if MCU is sole I2C controller and SRC4392 does not require SCL clock stretching across the barrier. Use ISO1540 if bidirectional SCL is required.
I2S/SAI isolationSkyworks/Silicon Labs digital isolatorsSi8641BB-B-IS1 + Si8642BB-B-IS1Library candidates foundUse only for non-MCLK cross-barrier I2S/control/status. Audio-side remains clock master where possible.
24.576 MHz XOCrystek low-jitter HCMOS XOCCHD-957-25-24.576Library candidate foundAudio-side oscillator for 48 kHz-family rates.
22.5792 MHz XOCrystek low-jitter HCMOS XOCCHD-957-25-22.5792Needs part creation/importPreferred companion oscillator for 44.1 kHz-family rates. Abracon ASELJ-E-22.5792MHZ-L-R-T is a library fallback but not preferred for low-jitter audio.
Clock mux/bufferTI low-jitter clock mux/fanoutCDCLVC1310RHBRLibrary candidate found25 fs typ additive jitter, but 3:10 is overkill. Tie off/disable unused outputs and revisit if a smaller low-jitter 2:1 mux becomes available.
AES3 transformersMurata digital audio transformerDA101CLibrary candidate foundUse one per AES3 input/output channel. Verify termination topology against SRC4392/AES3 reference circuit.
AES3 input XLRNeutrik female PCB XLRNC3FAH2 preferredLibrary candidate foundPrefer separate shell/ground contact so pin-1/chassis strategy remains explicit.
AES3 output XLRNeutrik male PCB XLRNC3MAHLibrary candidate foundConfirm exact shell/pin-1 behavior during footprint verification.
OLED prototype/display0.96 in SSD1306 I2C OLED moduleFlux OLED 128x64 0.96 in candidateLibrary candidate foundKeep on USB/UI I2C and 3V3_USB_MCU only.
Status LEDs0603 LEDsGreen THG1111C-0005-TR, red 5990010007F or equivalentsLibrary candidates foundUse low current, nominal 1–2 mA each where possible.
Prototype headers2.54 mm 1x6 headersSamtec TSW-106-07-G-S or equivalentLibrary candidate foundUSB-side header: 5V_PROT, 3V3_USB_MCU, GND, SDA, SCL, spare/reset/UART as selected.
Debug connectorARM SWD 10-pin 1.27 mmCNC Tech 3220-10-0300-00 or equivalentLibrary candidate foundUse full 10-terminal part, verify pinout.
Test pointsSMT test pointsKeystone 5019/5018 or generic test padsLibrary candidate foundPut on all rails, MCLK, I2C sides, reset/status, and AES3 bring-up nodes.
Reset/boot buttonsSMT tactile switchOmron B3FS-1002P or XUNPU TS-1088Library candidates foundReset and boot/recovery access.
3. Power Budget Draft
This budget is intentionally conservative for selecting power-path parts. Exact values must be refined after schematic capture and datasheet pin-mode choices.

Table


Rail / sourceLoads includedTypical planning currentDesign allowanceSelection impact
3V3_USB_MCUMIMXRT1024, USB-side logic, TUSB320, OLED reserve, five low-current LEDs, isolator primary sides, prototype header reserve~230 mA500 mAAP63203 2 A buck gives large margin and keeps heat low.
5V_PROT direct / inputeFuse, USB-C controller, isolated DC/DC input, 3.3 V buck input~450 mA total typical USB input~750–900 mA design caseTPS25210 current limit should start near 1 A unless firmware enforces a lower advertised-current mode.
ISO_5V_AUDIOInput to audio/clock/1.8 V post-regulators and isolator secondary loads~180–230 mA~300–350 mAISU0205S05 2 W / 400 mA output is appropriate but not huge; leave filtering and thermal margin.
3V3_AUDIO_CLEANSRC4392 3.3 V rails, audio-side isolator logic, misc audio-side logic~90–120 mA200 mAMP20051DQ class 1 A LDO is electrically ample; thermal dissipation remains manageable.
3V3_CLK_CLEANTwo CCHD-957 oscillators, clock mux/buffer~65–90 mA150 mAMP20056 250 mA LDO is adequate; noise and PSRR matter more than current.
SRC_1V8SRC4392 VDD18/core rail~58 mA high-rate typical100–150 mATPS79318 200 mA is adequate.
Preliminary USB input expectation: typical operation should fit under about 500 mA if LED current is kept low. Worst-case/full-prototype allowance can approach 750–900 mA, mainly from the isolated converter plus MCU/UI margin. Therefore Rev A should keep TUSB320 current-awareness and firmware/power policy hooks, even though USB PD is intentionally not used.
4. Clocking Decision
Rev A clock policy:
  • Both audio oscillators are born on the isolated audio side.
  • Both oscillators remain continuously powered/running.
  • The selected oscillator output is muxed/buffered locally on the audio side.
  • MCLK must not cross the isolation barrier through a generic digital isolator.
  • If I2S/SAI crosses the barrier, the audio side should be clock master where feasible; only data and non-jitter-critical clocks/status cross through Si864x isolators.
The CDCLVC1310 is accepted as the current Flux-available mux/buffer because its datasheet reports very low additive jitter, but it is over-sized. During schematic capture, disable unused outputs and keep its rail/return/layout tightly controlled. If a smaller low-jitter 2:1 LVCMOS mux becomes available, it should replace CDCLVC1310 before layout.
5. Isolation and Noise Notes
  • The isolated DC/DC is not a clean audio supply by itself; it is only an isolated pre-regulator.
  • Add USB-side input filtering before the isolated converter.
  • Add isolated-side π/ferrite filtering and damping before audio/clock LDOs.
  • Keep USB_GND and ISO_GND_AUDIO separated except through intentional safety/EMC/chassis elements.
  • ESD return paths for USB shell, XLR shell/pin-1, and AES3 line protection must not accidentally defeat galvanic isolation.
  • OLED and LEDs must remain on 3V3_USB_MCU; no OLED/LED current on 3V3_AUDIO_CLEAN or 3V3_CLK_CLEAN.
6. Open Verification Items Before Schematic Capture
  1. Create/import exact MIMXRT1024DAG5A Flux part and verify NXP reference pinout, power pins, reset/boot pins, and USB routing requirements.
  2. Create/import exact CCHD-957-25-22.5792 Flux part or accept the Abracon fallback with explicit jitter-performance downgrade.
  3. Confirm exact number of AES3 inputs and outputs; the current default assumes one AES3 input and one AES3 output.
  4. Verify SRC4392 supply sequencing, reset, decoupling, and recommended AES3 input/output circuits from TI datasheet.
  5. Verify Si864x I2S timing against selected SAI mode: BCLK rate, LRCLK, setup/hold, channel skew, and direction allocation.
  6. Verify ISO1541 vs ISO1540 choice after confirming whether SRC4392 can ever stretch SCL.
  7. Confirm final USB-C current policy: default-current-safe mode vs 1.5 A-capable behavior when advertised by the source.
  8. Select exact passive values for AP63203, TPS25210, LDOs, filters, AES3 termination, LED resistors, and I2C pull-ups during schematic capture from datasheets.
  9. Confirm enclosure/chassis/pin-1/shield plan before layout.
  10. Consider swapping CDCLVC1310 to a smaller low-jitter 2:1 clock mux if a verified part becomes available.
  • 1. Selection Summary

  • 2. Primary Rev A Parts

  • 3. Power Budget Draft

  • 4. Clocking Decision

  • 5. Isolation and Noise Notes

  • 6. Open Verification Items Before Schematic Capture

AES3-USB

AES3-USB thumbnail
An aes3 usb Interface.

Properties

Properties describe core aspects of the project.

Pricing & Availability

Distributor

Qty 1

Arrow

$27.65–$34.57

Digi-Key

$32.99

HQonline

$5.63–$5.67

LCSC

$174.38–$174.48

Mouser

$104.76–$104.98

TME

$27.91–$28.03

Verical

$28.93–$48.29

Controls