Part Data Review and Verification

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Part review summary

Item	Result
MPN	AM2434BSEFHIALVR
Manufacturer	Texas Instruments
Datasheet property present	Yes
Official datasheet used	https://www.ti.com/lit/ds/symlink/am2434.pdf
Package / orderable option	ALV (FCBGA), 441 pins
Package size	17.2 mm × 17.2 mm
Ball pitch	0.8 mm
Temperature grade	-40 to 125 °C
Project symbol pin count	441 terminals
Project footprint pad count	441 pads

1) Available part information found

Field	What is present in the part project
MPN	AM2434BSEFHIALVR
Datasheet URL	`https://www.ti.com/lit/gpn/am2434` was set; official PDF resolves to `https://www.ti.com/lit/ds/symlink/am2434.pdf`
Manufacturer	Texas Instruments
Description	Project description contains the MPN and package/manufacturing notes
Package evidence	Datasheet + TI part page identify ALV FCBGA, 441 pins
Pin count evidence	BOM shows 441 terminal instances; footprint inspection shows 441 pads
Symbol style	Multi-unit terminalized symbol, one terminal per ball/signal
Footprint style	Single footprint with one pad per ball ID

2) Datasheet property step

No update was needed because a datasheet URL was already set on the part.

3) Datasheet metadata summary

Device features

Category	Summary
CPU	Up to 2× dual-core Arm Cortex-R5F clusters at up to 800 MHz and 1× Cortex-M4F at up to 400 MHz
On-chip memory	Up to 2 MB OCSRAM with ECC
External memory	DDR subsystem supports LPDDR4 / DDR4, 16-bit bus, up to 1600 MT/s, inline ECC
Industrial networking	2× PRU_ICSSG, up to 2 Ethernet ports per subsystem, multiple industrial protocol support
Connectivity	6× I2C, 9× UART, 7× SPI, 3× GPIO, 2× MCAN, USB 3.1 DRD, PCIe Gen2, SERDES
Storage / boot	MMCSD/eMMC, OSPI/QSPI, parallel flash, UART, I2C, USB, PCIe, Ethernet boot support
ADC	12-bit ADC, up to 4 MSPS, 8 analog inputs
Safety / security	Secure boot, crypto acceleration, watchdogs, BIST, ECC/parity, IEC 61508 support up to SIL 3 systematic capability, SIL 2 hardware integrity
Power features	Simplified sequencing, dual-voltage IO, integrated SDIO LDO, voltage supervisor, glitch detector

Absolute maximum ratings

Rail / class	Absolute max
0.85 V rails such as VDD_CORE, VDDR_CORE, VDD_MMC0, VDD_DLL_MMC0, VDDA_0P85_*	-0.3 V to 1.05 V
DDR IO rails VDDS_DDR, VDDS_DDR_C	-0.3 V to 1.57 V
1.8 V analog rails, VMON_1P8_*, VPP	-0.3 V to 1.98 V
3.3 V IO / analog rails VDDSHV, VDDA_3P3_	-0.3 V to 3.63 V
USB0_VBUS	-0.3 V to 3.6 V
USB0_ID	-0.3 V to 3.6 V
Storage temperature	-55 °C to 150 °C
Latch-up test	-100 mA to +100 mA

Recommended operating conditions

Rail / condition	Recommended range
VDD_CORE, VDDR_CORE, VDD_MMC0, VDD_DLL_MMC0, VDDA_0P85_*	0.81 V / 0.85 V / 0.895 V
VDDS_DDR, VDDS_DDR_C at 1.1 V mode	1.06 V / 1.1 V / 1.17 V
VDDS_DDR, VDDS_DDR_C at 1.2 V mode	1.14 V / 1.2 V / 1.26 V
1.8 V rails including VDDS_MMC0, VDDS_OSC, VDDA_MCU, VDDA_PLL*, VDDA_ADC0, VDDA_1P8_, VDDA_TEMP	1.71 V / 1.8 V / 1.89 V
3.3 V rails including VDDA_3P3_USB0, VDDA_3P3_SDIO, VMON_3P3_*	3.135 V / 3.3 V / 3.465 V
VDDSHV5 in 1.8 V mode	1.71 V / 1.8 V / 1.89 V
VDDSHV5 in 3.3 V mode	3.135 V / 3.3 V / 3.465 V
Junction temperature	-40 °C to 125 °C industrial, -40 °C to 105 °C extended industrial

Electrical characteristics extracted

Interface class	Key values found
I2C / fail-safe IO, 1.8 V mode	VIH 0.7 × VDD to 1.98 V, leakage ±10 µA, IOL 10 mA
I2C / fail-safe IO, 3.3 V mode	VIH 0.7 × VDD to 3.63 V, leakage ±10 µA, VOL 0.4 V, IOL 10 mA
IO behavior note	Only specific pins are fail-safe; all others must stay within their powered IO rail limits

Pin description structure from datasheet

The datasheet organizes pins by:

Signal name
Signal type: I, O, OD, IO, IOD, IOZ, OZ, A, PWR, GND, CAP
Description
Ball

From the part project, the symbol already encodes:

Ball IDs such as AA5, K9, T14
Pin electrical type, for example power, input, output, bidirectional
Signal names matching the datasheet naming style

Package / mechanical data

Item	Value
Package code	ALV
Package type	FCBGA
Pin count	441
Body size	17.2 mm × 17.2 mm
Pitch	0.8 mm
Variant note	Lidded flip-chip ball grid array

4) Cross-check: symbol and footprint vs datasheet

Checks performed

Check	Result	Risk
MPN vs package family	Pass - orderable device matches TI ALV package	Low
Pin count	Pass - symbol exposes 441 terminals and footprint has 441 pads	Low
Ball naming convention	Pass - symbol pin numbers are BGA ball IDs and footprint pads use same ball IDs	Low
Signal naming consistency	Pass - terminal names align with TI datasheet signal naming style	Low
Power / ground exposure	Pass - all major rail groups and many ground balls are represented	Low
Missing nets in part project	Expected for a part definition	None
Explicit package property in project metadata	Not clearly exposed in BOM output	Medium documentation risk only

Mismatches / issues flagged

Issue	Severity	Why it matters
No clear standalone package property surfaced in the part metadata output	Medium	Could make automated review or downstream verification harder, even though the MPN and footprint clearly imply ALV/441
I could not extract the full ALV mechanical drawing page text directly from the PDF scan	Low	I still verified the package family, pin count, size, and pitch from TI sources, but not every drawing callout dimension was recoverable in text

Manufacturing / ordering risk assessment

Area	Assessment
Wrong package ordered	Low risk - MPN and TI orderable-device data both indicate ALV FCBGA 441
Symbol-to-footprint pin swap	Low risk - symbol pin numbers and footprint pad IDs use the same ball codes
Missing / extra balls	Low risk - counts match at 441
Board failure from gross pinout mismatch	Low risk based on current cross-check
Remaining caution	The final manufacturing-critical check still depends on full land pattern geometry, solder mask, and courtyard being correct to TI’s ALV package drawing; this output confirms pin identity/count/package match, not every pad dimension

Bottom line

The part project is substantially consistent with the TI definition for AM2434BSEFHIALVR.
I found no pin-count mismatch, no ball-ID mismatch, and no obvious symbol/footprint mismatch likely to cause incorrect ordering or immediate pinout failure.
The main improvement I’d recommend is making sure the package metadata is explicitly captured as ALV / FCBGA / 441-pin / 17.2 mm × 17.2 mm / 0.8 mm pitch in the part properties for easier future audits.

@review check part issues

@project_docs save findings

@datasheet inspect ALV package

@schematic inspect power pins

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