Part Data Review and Verification
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Part review summary
| Item | Result |
|---|---|
| MPN | AM2434BSEFHIALVR |
| Manufacturer | Texas Instruments |
| Datasheet property present | Yes |
| Official datasheet used | https://www.ti.com/lit/ds/symlink/am2434.pdf |
| Package / orderable option | ALV (FCBGA), 441 pins |
| Package size | 17.2 mm × 17.2 mm |
| Ball pitch | 0.8 mm |
| Temperature grade | -40 to 125 °C |
| Project symbol pin count | 441 terminals |
| Project footprint pad count | 441 pads |
1) Available part information found
| Field | What is present in the part project |
|---|---|
| MPN | AM2434BSEFHIALVR |
| Datasheet URL | https://www.ti.com/lit/gpn/am2434 was set; official PDF resolves to https://www.ti.com/lit/ds/symlink/am2434.pdf |
| Manufacturer | Texas Instruments |
| Description | Project description contains the MPN and package/manufacturing notes |
| Package evidence | Datasheet + TI part page identify ALV FCBGA, 441 pins |
| Pin count evidence | BOM shows 441 terminal instances; footprint inspection shows 441 pads |
| Symbol style | Multi-unit terminalized symbol, one terminal per ball/signal |
| Footprint style | Single footprint with one pad per ball ID |
No update was needed because a datasheet URL was already set on the part.
3) Datasheet metadata summary
Device features
| Category | Summary |
|---|---|
| CPU | Up to 2× dual-core Arm Cortex-R5F clusters at up to 800 MHz and 1× Cortex-M4F at up to 400 MHz |
| On-chip memory | Up to 2 MB OCSRAM with ECC |
| External memory | DDR subsystem supports LPDDR4 / DDR4, 16-bit bus, up to 1600 MT/s, inline ECC |
| Industrial networking | 2× PRU_ICSSG, up to 2 Ethernet ports per subsystem, multiple industrial protocol support |
| Connectivity | 6× I2C, 9× UART, 7× SPI, 3× GPIO, 2× MCAN, USB 3.1 DRD, PCIe Gen2, SERDES |
| Storage / boot | MMCSD/eMMC, OSPI/QSPI, parallel flash, UART, I2C, USB, PCIe, Ethernet boot support |
| ADC | 12-bit ADC, up to 4 MSPS, 8 analog inputs |
| Safety / security | Secure boot, crypto acceleration, watchdogs, BIST, ECC/parity, IEC 61508 support up to SIL 3 systematic capability, SIL 2 hardware integrity |
| Power features | Simplified sequencing, dual-voltage IO, integrated SDIO LDO, voltage supervisor, glitch detector |
Absolute maximum ratings
| Rail / class | Absolute max |
|---|---|
| 0.85 V rails such as VDD_CORE, VDDR_CORE, VDD_MMC0, VDD_DLL_MMC0, VDDA_0P85_* | -0.3 V to 1.05 V |
| DDR IO rails VDDS_DDR, VDDS_DDR_C | -0.3 V to 1.57 V |
| 1.8 V analog rails, VMON_1P8_*, VPP | -0.3 V to 1.98 V |
| 3.3 V IO / analog rails VDDSHV*, VDDA_3P3_* | -0.3 V to 3.63 V |
| USB0_VBUS | -0.3 V to 3.6 V |
| USB0_ID | -0.3 V to 3.6 V |
| Storage temperature | -55 °C to 150 °C |
| Latch-up test | -100 mA to +100 mA |
Recommended operating conditions
| Rail / condition | Recommended range |
|---|---|
| VDD_CORE, VDDR_CORE, VDD_MMC0, VDD_DLL_MMC0, VDDA_0P85_* | 0.81 V / 0.85 V / 0.895 V |
| VDDS_DDR, VDDS_DDR_C at 1.1 V mode | 1.06 V / 1.1 V / 1.17 V |
| VDDS_DDR, VDDS_DDR_C at 1.2 V mode | 1.14 V / 1.2 V / 1.26 V |
| 1.8 V rails including VDDS_MMC0, VDDS_OSC, VDDA_MCU, VDDA_PLL*, VDDA_ADC0, VDDA_1P8_, VDDA_TEMP | 1.71 V / 1.8 V / 1.89 V |
| 3.3 V rails including VDDA_3P3_USB0, VDDA_3P3_SDIO, VMON_3P3_* | 3.135 V / 3.3 V / 3.465 V |
| VDDSHV5 in 1.8 V mode | 1.71 V / 1.8 V / 1.89 V |
| VDDSHV5 in 3.3 V mode | 3.135 V / 3.3 V / 3.465 V |
| Junction temperature | -40 °C to 125 °C industrial, -40 °C to 105 °C extended industrial |
Electrical characteristics extracted
| Interface class | Key values found |
|---|---|
| I2C / fail-safe IO, 1.8 V mode | VIH 0.7 × VDD to 1.98 V, leakage ±10 µA, IOL 10 mA |
| I2C / fail-safe IO, 3.3 V mode | VIH 0.7 × VDD to 3.63 V, leakage ±10 µA, VOL 0.4 V, IOL 10 mA |
| IO behavior note | Only specific pins are fail-safe; all others must stay within their powered IO rail limits |
The datasheet organizes pins by:
- Signal name
- Signal type:
I,O,OD,IO,IOD,IOZ,OZ,A,PWR,GND,CAP - Description
- Ball
From the part project, the symbol already encodes:
- Ball IDs such as
AA5,K9,T14 - Pin electrical type, for example power, input, output, bidirectional
- Signal names matching the datasheet naming style
Package / mechanical data
| Item | Value |
|---|---|
| Package code | ALV |
| Package type | FCBGA |
| Pin count | 441 |
| Body size | 17.2 mm × 17.2 mm |
| Pitch | 0.8 mm |
| Variant note | Lidded flip-chip ball grid array |
Checks performed
| Check | Result | Risk |
|---|---|---|
| MPN vs package family | Pass - orderable device matches TI ALV package | Low |
| Pin count | Pass - symbol exposes 441 terminals and footprint has 441 pads | Low |
| Ball naming convention | Pass - symbol pin numbers are BGA ball IDs and footprint pads use same ball IDs | Low |
| Signal naming consistency | Pass - terminal names align with TI datasheet signal naming style | Low |
| Power / ground exposure | Pass - all major rail groups and many ground balls are represented | Low |
| Missing nets in part project | Expected for a part definition | None |
| Explicit package property in project metadata | Not clearly exposed in BOM output | Medium documentation risk only |
Mismatches / issues flagged
| Issue | Severity | Why it matters |
|---|---|---|
| No clear standalone package property surfaced in the part metadata output | Medium | Could make automated review or downstream verification harder, even though the MPN and footprint clearly imply ALV/441 |
| I could not extract the full ALV mechanical drawing page text directly from the PDF scan | Low | I still verified the package family, pin count, size, and pitch from TI sources, but not every drawing callout dimension was recoverable in text |
Manufacturing / ordering risk assessment
| Area | Assessment |
|---|---|
| Wrong package ordered | Low risk - MPN and TI orderable-device data both indicate ALV FCBGA 441 |
| Symbol-to-footprint pin swap | Low risk - symbol pin numbers and footprint pad IDs use the same ball codes |
| Missing / extra balls | Low risk - counts match at 441 |
| Board failure from gross pinout mismatch | Low risk based on current cross-check |
| Remaining caution | The final manufacturing-critical check still depends on full land pattern geometry, solder mask, and courtyard being correct to TI’s ALV package drawing; this output confirms pin identity/count/package match, not every pad dimension |
- The part project is substantially consistent with the TI definition for AM2434BSEFHIALVR.
- I found no pin-count mismatch, no ball-ID mismatch, and no obvious symbol/footprint mismatch likely to cause incorrect ordering or immediate pinout failure.
- The main improvement I’d recommend is making sure the package metadata is explicitly captured as ALV / FCBGA / 441-pin / 17.2 mm × 17.2 mm / 0.8 mm pitch in the part properties for easier future audits.
@review check part issues
@project_docs save findings
@datasheet inspect ALV package
@schematic inspect power pins
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