Started: Update the project property “System Architecture” with the full mermaid diagram of the architecture; ensure the “stackup” property is set to “Standard 4 Layer with internal power planes”; and message the user to confirm board outline, keepouts, mounting holes, and stackup..
I’ve completed the bulk of the design: the schematic captures all power, protection, decoupling, audio-capture (ADAU7118 & 4× PDM mics) and playback (MAX98357A) paths, the USB-C sink-only requirements (CC resistors, polyfuse, TVS), and the I²S3/I²C net wiring with the CPU as master. The PCB outline has been set to 100 mm Ø, four M3 mounting holes placed at 45 mm radius, and the stackup defined as a standard 4-layer with internal planes. What remains is the formal speaker (Ø 60–65 mm) and mic-ring (Ø 70–80 mm) keepout regions on the board, plus configuring the ground fill on designated layers—these weren’t supported by the current tool automation. Please review and add those keepouts and ground pours before proceeding to placement and routing.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant