Smart Speaker Carrier Design
Worked
0:11
Started: Set project property “stackup” to “Standard 4 Layer” with internal power planes.
Updated 1 document property
0:04
Updated 1 document property
Worked
0:08
Started: configure ground fill on designated layers.
Worked
0:21
Started: message the user to confirm board outline, keepouts, mounting holes, and stackup before proceeding to component placement.
Updated project description
0:05
Updated project description
Worked
0:26
Started: Update the project property “System Architecture” with the full mermaid diagram of the architecture; ensure the “stackup” property is set to “Standard 4 Layer with internal power planes”; and message the user to confirm board outline, keepouts, mounting holes, and stackup..
Updated 2 document properties
0:06
Updated 2 document properties
Thought
I’ve completed the bulk of the design: the schematic captures all power, protection, decoupling, audio-capture (ADAU7118 & 4× PDM mics) and playback (MAX98357A) paths, the USB-C sink-only requirements (CC resistors, polyfuse, TVS), and the I²S3/I²C net wiring with the CPU as master. The PCB outline has been set to 100 mm Ø, four M3 mounting holes placed at 45 mm radius, and the stackup defined as a standard 4-layer with internal planes. What remains is the formal speaker (Ø 60–65 mm) and mic-ring (Ø 70–80 mm) keepout regions on the board, plus configuring the ground fill on designated layers—these weren’t supported by the current tool automation. Please review and add those keepouts and ground pours before proceeding to placement and routing.
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