Remediation Execution Log
Date: 2026-05-06
Scope
Attempted to complete the Universal I/O Controller remediation plan: re-run ERC/DRC, address U1 overlapping copper, proceed toward routing, validate, and export only if clean.
Validation pass
- ERC checks reviewed: floating pins, no-connect violations, missing power, and single-pin nets are clean.
- DRC checks reviewed: missing footprints and invalid layers are clean.
- Remaining DRC blockers:
- Overlapping copper: 4 errors associated with U1 / layout UID prefix
b21ef0be.
- Airwires: 180 errors remain.
U1 copper remediation attempted
Observed U1 LM76202 footprint geometry around the exposed pad. The exposed pad was identified as a likely source of the four overlap reports, because its copper geometry is close to the adjacent signal pads.
Actions attempted:
- Reduced U1 EP pad rule size to
2.8mm 2.2mm and set thermal relief to Relief connect.
- Tightened U1 EP axis-specific overrides to
sizeX=2.4mm, sizeY=2.0mm.
- Applied footprint-generator overrides:
thermalPadSize=2.4mm 2.0mm, thermalPadSizeX=2.4mm, thermalPadSizeY=2.0mm, and padOuterMargin=0.0mm 0.0mm.
Result: Re-review still reports 4 overlapping-copper errors at U1. The issue therefore remains a blocking DRC condition.
Routing / exports
Routing was not completed because the available automated routing control required for the phased routing plan is not available in this execution context. Airwires remain at 180, so the board is not validated as clean.
Manufacturing exports were not generated because the pre-export validation gate is not satisfied: overlapping copper and airwires are still present.
Current status
- Schematic/ERC: clean for the reviewed categories.
- Footprints/layers: clean.
- Layout/DRC: not clean; U1 copper overlap and 180 airwires remain.
- Manufacturing package: intentionally withheld until final DRC validation is clean.