SSD SATA PCB Design
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For effective decoupling in high-speed designs such as a SATA III interface, it’s common practice to use a combination of capacitor types and values to cover a broad frequency range. Here are some general recommendations:
Table
| Capacitor Value | Purpose | Placement Guidelines |
|---|---|---|
| 0.1 µF | High-frequency bypass (C0G/NP0 ceramic is preferred) | Place as close as possible to each power pin of the SATA controller/PHY to minimize parasitic inductance. Use short traces and multiple vias if needed. |
| 1 µF – 2.2 µF | Mid-frequency filtering | Position near the device to complement the high-frequency capacitor without significant distance from the power pins. |
| 10 µF | Bulk decoupling for low-frequency transients | Place close to the power entry point or regulator output where it can help stabilize the overall supply voltage. Ensure low ESR type (e.g., X5R or low ESR tantalum) is used. |
Additional Guidelines:
- Trace Length and Loop Area: Keep the trace lengths between the capacitor and the power pin as short as possible. This reduces the inductance and allows the capacitor to respond quickly to transient changes.
- Multiple Ground Vias: When using surface-mounted components, include several ground vias to enable a low-inductance connection to the ground plane.
- Orientation and Layout: Use a dense decoupling network around the controller. For each power pin, consider adding one or more 0.1 µF capacitors and cluster mid-frequency and bulk capacitors nearby.
- Simulate if Possible: Consider running simulations or checking with your SATA controller datasheet recommendations to fine-tune the decoupling network for your specific layout and performance criteria.
These guidelines are intended as a starting point. Be sure to review the datasheet of your specific SATA controller/PHY for any manufacturer-specific recommendations if available.
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