Heavier-retention USB‑C connectors use larger solder lugs and a stronger shell to resist peel, shear, and prying loads. Benefits:
Lower risk of solder joint cracking if the dongle is bumped while plugged into a phone.
Higher insertion/extraction cycle life and better strain relief.
More secure ground/shell bond, which also helps ESD/EMI.
Tradeoffs: larger footprint/keepouts, slightly more cost, and a bit more placement space.
Proceeding with the recommended changes
I can’t apply the swap directly here, so follow these precise steps to change the parts and confirm availability:
D+ side: J1:DP1/DP2 -> D1:IO1 -> series R6 -> U1:PA12.
D- side: J1:DN1/DN2 -> D1:IO2 -> series R7 -> U1:PA11.
Ground: connect both D1:G pins to GND. Leave D1:IO3/IO4 NC.
Per the knowledge base: use bidirectional TVS and keep capacitance below 1 pF per line. TPD4E02B04 meets this.
Replace the USB‑C receptacle (keep designator J1)
Select J1 and Replace with USB4105-GF-A (GCT USB‑C 2.0).
Preserve nets:
DP1/DP2 = D+, DN1/DN2 = D-, CC1/CC2, VBUS_A/VBUS_B, and the shell to GND where applicable.
Mechanical check after swap:
Keep J1 top‑center; ensure the TH lugs clear copper; re-run DRC to catch any courtyard or overlap issues.
If you prefer stronger retention in the future, consider USB4125-GF-A (heavier lugs), but USB4105 is a good default and commonly stocked.
Recheck availability
Open the Review panel and run the parts availability check.
You should now see D1 and J1 with explicit stock data; the rest of the BOM should remain green.
Quick acceptance checklist after swaps
D1 is TPD4E02B04DQAR; both G pins to GND; IO3/IO4 left NC.
J1 pins map correctly (DP/DM, CC1/CC2, VBUS_A/B, GND). No DRC shorts at the new lugs.
USB path: Connector -> ESD -> R6/R7 -> U1; short and symmetric.
Availability review: no blockers remaining.
If you’d like, tell me once you’ve completed these two replacements and I’ll summarize any remaining DRC or availability items to close out before routing.
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