Pin Function Grouping

Done — I generalized the pin group values and added/updated Section on every pin to match Pin Group exactly.
Applied groups: Power, Ground, Control, Reset, and Other.
Verify the pin groups against the datasheet, then run ERC and fix any property issues.
I’ll compare the current Pin Group/Section assignments against the LT3641 datasheet, run ERC, then fix any property issues found.
ERC returned no ERROR/WARNING items, but I found the prior Pin Group values included non-standard entries. I’m normalizing them to accepted general values while keeping Section identical to Pin Group.
Verified against the LT3641 datasheet and normalized the properties so every pin has matching Pin Group and Section values.
ERC/property checks now show no ERROR or WARNING items. Final groups are Power, Ground, Analog, and Debug; NC is grouped with Ground because the datasheet says it may be connected to ground.
Review pins and docs
Create pin table
Check footprint mapping
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Documents

    Documents are markdown text files which describe project goals, capture details, or even simulation outputs.

    Assets

    LT3641EFE#PBF Symbol.svg

    LT3641EFE#PBF Symbol.svg

    LT3641EFE#PBF SymbolDefault
    step

    LT3641EFE#PBF/LT3641EFE#PBF.3dshapes/TSSOP-28_L9.7-W4.4-H1.0-LS6.4-P0.65.step

    LT3641EFE#PBF/LT3641EFE#PBF Model3D Model
    LT3641EFE#PBF-thumb.png

    LT3641EFE#PBF-thumb.png

    LT3641EFE#PBF-thumbThumbnail
    kicad_mod

    LT3641EFE#PBF/LT3641EFE#PBF.pretty/TSSOP-28_L9.7-W4.4-P0.65-LS6.4-BL-EP.kicad_mod

    LT3641EFE#PBF/LT3641EFE#PBF FootprintFootprint

    LT3641EFE#PBF

    LT3641EFE#PBF thumbnail
    Buck Switching Regulator IC Positive Adjustable 0.6V, 1.265V 2 Output 1.3A, 1.1A 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
    The LT3641EFE#PBF specification defines the engineering requirements for a dual-channel step-down switching regulator integrated circuit designed for high-efficiency power conversion and distribution applications. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure stable voltage regulation, efficient power delivery, and long-term operational reliability in industrial, embedded, communication, and control systems.
    The device is intended for use in distributed power architectures, industrial automation equipment, instrumentation, telecommunications systems, automotive electronics, and embedded applications requiring multiple regulated output voltages from a common input source. The integrated dual-channel architecture enables compact power supply designs while providing high conversion efficiency, low power dissipation, and reliable performance across a wide range of operating conditions.
    Engineering Requirements
    The switching regulator shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure consistent electrical performance, efficient power conversion, and dependable long-term reliability. The device shall maintain stable operation under specified input voltage, output load, temperature, and environmental operating conditions.
    Electrical characteristics shall provide accurate output voltage regulation, high conversion efficiency, low output ripple, and fast transient response. The regulator shall maintain stable switching behavior during startup, shutdown, load variations, and input voltage fluctuations while ensuring reliable power delivery to connected circuits.
    The integrated control architecture shall support independent regulation of multiple output channels and provide reliable operation during dynamic system conditions. Built-in protection functions shall support safe operation during abnormal events including overload, short-circuit, thermal stress, and fault conditions, thereby enhancing overall system reliability.
    Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical integrity and long-term reliability. The package shall facilitate effective heat dissipation and shall be suitable for automated surface-mount assembly and standard solder reflow manufacturing processes.
    Mechanical construction shall withstand thermal cycling, vibration, mechanical handling, and environmental exposure without degradation of electrical or structural performance. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, or structural inconsistencies that could adversely affect functionality or reliability.
    Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation.
    Documentation
    Supporting documentation shall include engineering drawings, electrical performance specifications, thermal characterization reports, application guidelines, qualification records, inspection reports, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability.
    Revision Control
    Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards.

    Properties

    ADI(亚德诺)

    U

    LT3641EFE#PBF

    C107878

    TSSOP-28_L9.7-W4.4-P0.65-LS6.4-BL-EP

    DC-DC Converters

    Extended Part

    parametric-v1

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