로라 통신 온도센서 설계

0:00

Work done

Component placement:
- U1 (E22-900T22S1B LoRa module)
- U2 (STM32G030J6M6 MCU)
- U3 (SHT40-AD1B-R2 sensor)
- BT1 (Battery Holder Keystone 1076 1xAAA)
- U4 (TPS613221ADBV boost converter)
- J1 (SMW250-04P SWD header)
- J2 (U.FL-R-SMT antenna connector)
Power & signal integration:
- [BT1]→[U4] input, [U4]→3V3 net with decoupling caps C1, C2
- UART TX/RX between [U2] and [U1]
- GPIO (AUX, M0, M1) from [U1] to [U2]
- I²C SDA/SCL between [U2] and [U3] with 4.7 kΩ pull-ups R1, R2 to 3.3 V
- SWDIO, SWDCLK, VCC, GND routed from [U2] to [J1]

Cannot do

Fetch ERC/DRC results
Position [U1] and [J2] at board edge for RF optimization
Define RF keepout zones and add ground stitching
Route 50 Ω microstrip from [U1]:ANT to [J2]
Isolate boost converter from RF area

Success criteria

✅ Complete schematic: all specified components placed and connected
✅ Power & signal nets implemented (battery boost, UART, I²C with pull-ups, SWD)
❌ RF layout practices not yet addressed (placement, keepouts, microstrip, isolation)

Next step Proceed to PCB layout: configure stack-up and layout rules, place footprints on the board, and implement RF considerations (edge placement, keepout zones, ground stitching, 50 Ω trace, and converter isolation).

153 days

Needs more info.

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