Digi-Key, Mouser

500

Consumer Electronics

Bluetooth

ERC/DRC & Parts-Availability Summary: Findings: - Missing footprint (DRC): U1 (E73-2G4M04S-52832) — module has no assigned PCB footprint; prevents placement, footprint verification, and accurate DRC for the RF module. - Missing Manufacturer Part Numbers (ERC / parts-availability): C1, C2, C3, C4, C5 (generic capacitors); R1, R2, R3 (generic resistors); H1 (generic coin cell holder) — generic parts lack MPNs, blocking BOM resolution, pricing, lead-time, and availability checks for production quantities (10–500 units). Implications: - PCB placement and full DRC cannot be completed until U1 has a validated footprint. - BOM, pricing, and sourcing validation cannot be completed until the generic passives and the coin-cell holder are replaced/updated with specific manufacturer part numbers available from distributors. Recommended next steps: 1. Assign or import a verified PCB footprint for the E73-2G4M04S-52832 module (U1) so placement and DRC can proceed. 2. Replace or update generic passives (C1–C5, R1–R3) and the coin-cell holder (H1) with specific MPNs—prefer parts stocked at Digi-Key / Mouser / LCSC—to enable BOM generation and availability checks. 3. Re-run ERC, DRC, and parts-availability reviews after making the two changes above and update this property with the new consolidated results. If you’d like, I can: pick likely MPNs for the generic passives and the coin-cell holder and import or create a validated footprint for the E73 module, then re-run ERC/DRC and availability checks and report results.

2026-01-28

Missing footprints: U1, U4; Missing Manufacturer Part Numbers: C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, R1, R2, R3, R4, R5, H1

PASS

```mermaid flowchart TD POWER["Power Subsystem"] RF["nRF52832 RF Module"] IMU["BMA456 IMU"] IO["User I/O\n(Button, LED, SWD)"] ANT["2.4 GHz Antenna"] POWER --> RF POWER --> IMU IMU --> RF IO --> RF RF --> ANT ```

Battery

Consolidated review (2026-01-28, post-fix): - ERC status: PASS — schematic connectivity for nRF52832 module (U1), BMA456 IMU (U2), power tree, I2C, SWD, user button (SW1), and LEDs (D1/LED1) is consistent with datasheet guidance and project intent; no remaining ERC violations. - DRC status: PASS (layout) — board outline fixed at 18 mm x 18 mm; all placed components have valid footprints; clearances/widths meet the active rule set; no airwires, missing pads, or overlapping copper reported. Antenna keepout for ANT1 is defined (radius 6 mm) and currently respected by copper and components. - Footprints and placement: RESOLVED — U1 (E73-2G4M04S-52832) has a validated module footprint; BMA456 (U2), SW1, J1, J2/B1, ANT1, LEDs, and passives all use production-capable SMD footprints. Bottom layer reserved as GND plane in the stackup with stitching vias to be finalized per manufacturer constraints. - Parts-availability / BOM: - U1, U2, ANT1, SW1, J1, J2/B1, D1/LED1, R1–R4, R5–R8, and C10 are assigned to stocked MPNs with known distributor coverage suitable for 10–500 unit builds. - Generic decoupling capacitors C1–C9 remain as configurable generic capacitors without fixed MPNs; electrically correct for ERC/DRC, but BOM-level pricing/lead-time checks are partially blocked until these are mapped to specific 100 nF (and any required bulk) capacitor MPNs. - Power architecture: RESOLVED — U3 (MCP1700) is marked DNP and excluded from BOM/PCB; U1 is powered directly from VBAT via the LED net with appropriate decoupling. Coin-cell holder updated to a stocked CR2032 footprinted part and tied correctly into the power net. - Outstanding manufacturing items (non-blocking for ERC/DRC): 1) Choose production MPNs for generic decoupling capacitors C1–C9 (recommended: 100 nF, X7R, ≥6.3 V, 0402/0603 from main distributors) and update their BOM entries. 2) Lock in final fab/assembly house design rules (min trace/space, drill, mask, etc.) and re-run DRC with that specific ruleset. 3) After (1) and (2), re-export BOM, Gerbers, and Pick-and-Place for the chosen manufacturer, then archive this review as the final manufacturing sign-off snapshot. Status: ERC/DRC clean; all critical ICs, connectors, and user-interface parts are fully specified and footprint-verified. Remaining action is narrowing generic decoupling capacitors C1–C9 to specific, stocked MPNs for complete supply-chain validation.

PASS