Rearranged the placement so the M.2 card corridor is mostly clear and components are clustered on the USB-connector/top side of the board. Verified: all 53 components remain on Top, none are on Bottom, and no component-overlap/outside-board placement checks were reported.
Open items:
Existing routing is stale after the move; airwires remain and will need rerouting.
J1/J2 are intentionally edge-positioned/overhanging slightly as connectors.
Suggested next steps:
Add/mark the exact M.2 card keepout outline on the PCB.
Clear stale traces.
Reroute with the new placement and card clearance preserved.
Understood — I’ll keep J2’s current rotation unchanged and adjust the placement plan around it instead of rotating the M.2 connector.Got it — I will not rotate J2. Any placement cleanup will keep the M.2 connector orientation as-is and move other components around it to preserve the card clearance.
Understood — J1 should not be rotated either. I’ll preserve the current orientations of both J1 and J2 and move other components around them for clearance.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant