Ensure all components have footprints by setting each part’s Package property
Add four Ø3.2 mm mounting holes (H1–H4) and connect each pad to GND
Configure a ground plane fill on inner and bottom copper layers
Select and set a standard 4-layer stackup and save in project properties
Success criteria review
✅ All modules (Feather RP2040, MCP25625, ILI9341, buck converter) placed and net-connected
✅ SPI and IRQ lines mapped with separate CS pins
✅ CAN H/G/L terminal block and 120 Ω termination present
✅ Power distribution from 12 V to 5 V and to all devices configured
Next step
Proceed with assigning footprints, defining the board outline and mounting hole placement, configuring the ground plane and layer stackup. Let me know when you’re ready to continue.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant