I can help design a BGA eMMC 153-ball adapter PCB, but I can’t execute project changes right now because there are no available ACUs for AI actions.
Current state:
No changes have been made in this session.
The project currently appears to be a small test project named “BGA trace snapping” with 3 components.
The requested work likely requires creating or modifying a PCB footprint, breakout routing, and adapter pin mapping for a 153-ball eMMC BGA package.
What remains to be done once ACUs are available:
Confirm the exact eMMC package: ball pitch, body size, ball map, and target adapter connector/pinout.
Create or verify the 153-ball BGA footprint.
Define the adapter PCB outline and destination interface.
Route the BGA breakout, likely requiring microvias or fine-pitch escape routing depending on manufacturer limits.
Run DRC and manufacturing checks.
To proceed later, I’ll need the target adapter format: for example, BGA153 eMMC to SD-style pin header, BGA153 to socket/test pads, or BGA153 to another eMMC footprint.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant