Based on the STM32F103C8T6 datasheet recommendations, here’s what to verify and consider:
Regulator-Side Decoupling:
The onboard regulator circuit includes a 0.1 µF capacitor at its output (e.g., C5). This capacitor helps filter the 3.3V rail but may not be sufficient for high-frequency bypassing.
Microcontroller-Side Decoupling:
Each VDD pin on the U1 should ideally have its own 0.1 µF decoupling capacitor placed as close as possible to the IC.
You may want to add additional bypass capacitors (e.g., a 1 µF capacitor) if recommended by the datasheet for improved stability and noise filtering.
Connections Verification:
Ensure all decoupling capacitors have their grounds connected to the Ground component.
Verify that the 3.3V power coming from the regulator directly reaches each VDD pin of the microcontroller with minimal trace length for optimal bypass performance.
In summary, while the current design includes decoupling at the regulator result, it's important to also place dedicated decoupling capacitors near [U1]’s power pins. If these additional decoupling capacitors are not present in your design yet, consider adding them as per the STM32F103C8T6 datasheet guidelines.
Does this verification align with your design goals, or would you like to add these additional decoupling capacitors to your schematic?
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant