Hybrid Smartwatch Design Inquiry
Worked for 37 sec
Enlarged the PCB from 40 mm circular to 42 mm circular on a 4-layer stackup. This keeps it within the 44 mm case target while improving density from critical to high.
Open items:
- Routing is still tight, especially around the ESP32/RTC/regulator area.
- A few passives may still need to move to the bottom layer for clean routing.
Suggested next steps:
- Spread the crowded ESP32/RTC/power components.
- Move low-profile passives to the bottom side.
- Run routing feasibility again before autorouting.
the esp doesnt fit
Thought for 4 sec
I’ll inspect the ESP32 module placement and board clearance, then move/orient it so the module body and antenna keepout fit within the enlarged round PCB/case constraints.
Worked for 51 sec
Fixed the ESP32 fit issue: U1 was protruding past the 42 mm circular board, so I moved it inward. It is now fully inside the PCB outline at approximately (0, 5 mm).
Open items:
- Moving U1 inward created new routing congestion between U1, U5, J1, and J3.
- The next placement pass should spread the motor driver/AMOLED connector area and possibly move small passives to the bottom side.
Suggested next steps:
- Re-place the crowded U1/U5/J1/J3 cluster.
- Move selected passives to the bottom layer.
- Run routing feasibility again.
Re-place and check
Re-place crowded cluster
Move passives bottom
Run layout review
Protect antenna keepout
