Test Plan Development for PCB Project

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Below is a structured test plan to help ensure the final design meets its performance, reliability, and safety requirements. Modify and extend these items to match your organization’s standards and the specific goals of this project.
1. Introduction
This test plan covers the validation of both the functional and non-functional aspects of the project. It ensures that the final combination of hardware (PCB, onboard components, enclosures, modules) meets the design specifications such as electrical performance, thermal stability, mechanical robustness, and environmental resilience.
1.1 Project Overview
  • Project Name: ESP32 RC Car PCB and schema
  • Primary Functions:
    • Control of motors, sensors, and other accessories via ESP32 module
    • Onboard power regulation (+5V, +3.3V rails)
    • Connectivity via ESP32 (Bluetooth, Wi-Fi)
1.2 Key Stakeholders
  • Design Engineering Team: Oversees board design, layout, and integration.
  • Test/Validation Team: Conducts test procedures and compiles results.
  • Project Management: Ensures timeline, budget, and readiness for manufacturing.
2. Scope
  1. In-Scope Testing
    • Electrical verification (power rails, sensors, motor drivers, I/O lines)
    • Thermal analysis for power components, motor drivers, and regulators
    • Mechanical and fit checks (alignments, mounting, and mechanical tolerances)
    • Environmental reliability (temperature range, vibration, moisture/humidity, etc.)
    • Communication links and interface testing (Wi-Fi, Bluetooth, sensor signals)
  2. Out-of-Scope Testing
    • Final overall system integration testing with remote control or software apps (beyond ensuring the PCB-level communication is functional).
    • Certification testing for regulatory standards (FCC, CE, etc.) unless specified later.
3. Objectives
  1. Validate Functional Requirements:
    • Confirm each power rail has correct voltage under load.
    • Ensure motor driver signals and sensor interfaces function reliably.
    • Confirm correct operation of the ESP32 module for communication and control.
  2. Validate Non-Functional Requirements:
    • Assess thermal dissipation capacity under typical and extreme loads.
    • Check mechanical integrity of connectors, mounting holes, and standoffs.
    • Validate reliability under environmental stress (temperature/humidity).
  3. Mitigate Risks:
    • Identify failure modes and ensure they are mitigated (e.g., over-voltage on motors, improper sensor readings).
    • Provide data to refine performance margins and design improvements.
4. Requirements to Validate
Below is a concise list of key requirements to be tested:
  1. Electrical
    • Supply Voltage Stability: Must remain within ±5% of nominal for 5V and 3.3V rails under maximum load.
    • Motor Driver Performance: L293D driver should handle specified DC motor current without thermal shutdown.
    • Sensor I/O: Sensors (HC-SR04, IR sensors) must communicate reliably.
    • Communication: Wi-Fi and BLE on ESP32 must operate as expected.
  2. Thermal
    • Regulator Heat Dissipation: Linear regulators (LD1117V33, L7805CV) must keep junction temperature below specified max.
    • Motor Driver Thermal Load: L293D should not exceed recommended temperature at continuous motor current.
  3. Mechanical
    • Connector Alignment: All connectors, pin headers, and sockets must align with appropriate mechanical references.
    • Mounting Holes: Standoffs and mounting points must align with enclosure or chassis.
  4. Environmental
    • Temperature Range: Board must operate within expected ambient (e.g., -10°C to +60°C).
    • Humidity and Moisture: No shorting or corrosion under typical humidity levels.
  5. Interfaces
    • Bluetooth: Must pair with standard devices when tested.
    • Wi-Fi: Must connect to a standard 2.4 GHz network and maintain stable connectivity.
    • Sensor Data: Must be read consistently over I2C/UART lines and match expected sensor specifications.
5. Test Categories & Cases 5.1 Electrical Testing
Objective: Validate power distribution, voltage levels, signal integrity, and load-handling performance.
  1. Power-Up Test
    • Procedure: Apply power from a regulated bench supply at 5V. Check 5V and 3.3V lines with no load.
    • Expected Outcome: 5V rail at 5.0 ± 0.25V; 3.3V rail at 3.3 ± 0.1V.
    • Pass/Fail Criteria: Voltages within specified range; stable with minimal ripple.
  2. Full Load Test
    • Procedure: Simulate maximum motor usage and sensor activation. Measure regulator output voltages and current draw.
    • Expected Outcome: All supply lines remain within tolerance. Regulators do not exceed thermally-safe operating points.
    • Pass/Fail Criteria: Voltage rails do not drop below tolerance; no over-current or thermal shutdown.
  3. Signal Integrity
    • Procedure: Check motor driver input signals, sensor signals with an oscilloscope.
    • Expected Outcome: Clean transitions with minimal noise/ringing.
    • Pass/Fail Criteria: Signal edges stable; no unexpected jitter or noise that breaks the sensor or driver logic.
5.2 Thermal Testing
Objective: Verify that onboard components (voltage regulators, MCU, motor driver) remain within safe temperature limits.
  1. Operating Temperature
    • Procedure: Operate the board at 25°C ambient for an extended period (e.g., 2 hours) with typical loads. Measure component temperatures.
    • Expected Outcome: Regulator packages remain below manufacturer’s recommended junction temperature (e.g., <125°C).
    • Pass/Fail Criteria: No signs of thermal throttling or overheating.
  2. Thermal Stress under Max Load
    • Procedure: Drive motors at high duty cycle for a prolonged period. Record surface temperature on L293D, regulators, and high-current traces.
    • Expected Outcome: Temperature stabilizes within manufacturer limits.
    • Pass/Fail Criteria: Junction temperature at or below maximum rating.
5.3 Mechanical Testing
Objective: Confirm the mechanical robustness of the PCB, connectors, and mounting points.
  1. Connector Fit Check
    • Procedure: Insert all pin headers/sockets, sensors, and modules.
    • Expected Outcome: Components align properly without bending pins; board holes match mechanical references.
    • Pass/Fail Criteria: Easy insertion and secure fit. No pin misalignment or mechanical strain.
  2. Mounting & Standoff
    • Procedure: Attach standoffs in designated mounting holes. Ensure clearance with chassis or enclosure.
    • Expected Outcome: Board sits flat; holes align with mating enclosure.
    • Pass/Fail Criteria: No mechanical interference or warped placement.
  3. Light Vibration Check (Optional)
    • Procedure: Vibrate assembly at low amplitude and frequency typical for an RC environment.
    • Expected Outcome: No loosening of bolts, no cracked solder joints.
    • Pass/Fail Criteria: Connectors remain seated; no visible fractures.
5.4 Environmental Testing
Objective: Verify operation over relevant temperature, humidity, and environmental stress conditions.
  1. Extended Temperature Range
    • Procedure: Place board in a temperature chamber cycling between -10°C and +60°C while powered (if those are target extremes).
    • Expected Outcome: All essential functions remain operational.
    • Pass/Fail Criteria: No unexpected resets or performance degradation beyond tolerance.
  2. Humidity/Ingress
    • Procedure: Expose to 80–90% humidity environment for a short cycle.
    • Expected Outcome: No condensation-related shorts or corrosion.
    • Pass/Fail Criteria: Board continues normal function.
5.5 Communication & Interface Testing
Objective: Validate the ESP32’s Wi-Fi, Bluetooth, sensor interrogation, and any other comm lines.
  1. Wi-Fi Connectivity
    • Procedure: Connect board to a known AP, measure throughput or ping stability.
    • Expected Outcome: Reliable connection within standard ESP32 performance.
    • Pass/Fail Criteria: Minimal packet loss, stable data link.
  2. Bluetooth Pairing
    • Procedure: Attempt pairing with a test device (e.g., phone or BLE-enabled PC).
    • Expected Outcome: Successful pairing and data exchange.
    • Pass/Fail Criteria: Stable throughput or stable link over typical distances.
  3. Sensor & Actuator Interface
    • Procedure: Trigger ultrasonic sensor, read IR sensor signals, observe motor driver commands.
    • Expected Outcome: Data read consistently; motors respond to control signals.
    • Pass/Fail Criteria: Observed reaction times match the design expectation.
6. Test Environment & Setup
  • Power Supplies: Bench power supply (adjustable 0-12 V, 5 A).
  • Measurement Tools: Multimeter, oscilloscope, thermal camera (or IR thermometer), logging software for sensor data.
  • Environmental Chamber (if available): For temperature/humidity cycling.
  • Motor Load: Representative or actual motors, possibly with a mechanical fixture to simulate load torque.
  • Reference Board/Fixture: A known functional board or test jig for comparing signals/sensor data.
7. Automation Strategies
  1. Power & Voltage Logging
    • Automated logging of multiple rail voltages using DAQ modules, especially under dynamic loads.
  2. Sensor Data Capture
    • Scripts that poll the ESP32 via serial or Wi-Fi to confirm sensor readings in real-time.
  3. Thermal Soak
    • Automated data capture from thermocouples or thermal sensors at intervals.
  4. Connectivity & Communication
    • Automated scripts that repeatedly connect/disconnect Wi-Fi or BLE to gauge reliability.
8. Edge Cases
  • Power Brownout: Rapidly switch input supply from 5V to lower, to simulate battery depletion or brownout.
  • Thermal Overload: For a short period, exceed typical motor current to see if the driver or regulators shut down gracefully.
  • Extreme Low Temperature: If relevant for the usage scenario, test just below or near the lower limit (e.g., -10°C).
  • High Vibration: If the RC environment is subject to shocks or vibrations, quickly check for solder joint or connector loosening.
9. Potential Risks & Mitigations
  • Risk: Overheating of regulators or motor driver.
    • Mitigation: Adequate heatsinking or forced air cooling if necessary.
  • Risk: Sensor malfunctions in high humidity or temperature.
    • Mitigation: Include conformal coating or protective enclosures if needed.
  • Risk: Loose mechanical connections under vibration.
    • Mitigation: Lock washers, threadlock on standoffs, robust soldering.
10. Reporting & Documentation
  • Test Log: Maintain a spreadsheet or database tracking each test case, steps, results, and pass/fail status.
  • Anomaly Reports: Document unexpected behaviors or failures; track corrective actions.
  • Summary Report: Conclude with a final document stating overall pass/fail, recommended design changes, and re-tests needed after modifications.
11. Recommendations for Improving Coverage & Reliability
  1. Continuous Integration for Firmware: If the ESP32 firmware is part of the design, integrate basic self-tests (checking sensor readouts, memory usage) into the firmware.
  2. Automated Re-Testing: Rerun the test suite (voltage logging, sensor checks) after each significant PCB or firmware revision.
  3. Extended Environmental Testing: If the product sees wide temperature swings or moisture, consider longer soak tests or real-world field tests.
  4. Early Runner Boards: Build a small pilot batch to catch potential manufacturing issues and refine test procedures.
12. Pass/Fail Criteria Summary
  • Functional: All power rails within ±5% tolerance, stable communication, sensor signals valid.
  • Thermal: Regulator and driver temperatures within datasheet operating limits.
  • Mechanical: No mechanical or solder-joint failures; connectors robust.
  • Environmental: Board operates consistently through temperature/humidity cycles.
  • Communication & Interface: ESP32 connectivity stable (Wi-Fi/BLE); sensor interfaces accurate.
By following the above plan and adjusting each step to the exact requirements (e.g., test duration, pass/fail margins, acceptance conditions), the test team can confidently certify the performance and reliability of the final design before moving to production.
Detailed Test Plan Overview
Test Plan with Categories & Cases
Comprehensive Testing Strategy
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ESP32 RC Car PCB and schema final

ESP32 RC Car PCB and schema final
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Last updated by guyhadad
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guyhadad

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