I can’t modify the project right now because execution credits are exhausted, so no schematic or layout changes were made.
For this phone motherboard request, there are major feasibility blockers to resolve before design can start:
Snapdragon 8 Elite is not a normal catalog part: Qualcomm mobile SoCs usually require direct OEM agreements, NDAs, reference designs, firmware/boot chain access, PMIC ecosystem, RF certifications, and controlled supply.
96 GB RAM on a phone-class Snapdragon platform is likely not practical: mobile Snapdragon SoCs use tightly constrained LPDDR memory interfaces, often PoP or very short matched routing. The supported maximum capacity depends on Qualcomm’s confidential memory controller spec and approved LPDDR devices.
A phone motherboard is a high-density HDI design: it would need blind/buried microvias, controlled-impedance DDR/USB/MIPI/RF routing, multi-rail PMIC sequencing, thermal simulation, and custom mechanical constraints.
CPU cooler integration needs mechanical and thermal specs: board outline, enclosure volume, heat spreader/vapor chamber/fan choice, target power dissipation, and allowable surface temperature.
What remains to be done once credits are available:
Confirm whether you have access to Qualcomm Snapdragon 8 Elite datasheets, PMIC reference design, layout guidelines, and firmware package.
Verify supported RAM type/capacity from Qualcomm documentation.
Create a block-level architecture first, then a schematic specification.
Select available parts for power, memory, storage, connectors, cooling, and sensors.
Only then proceed to schematic capture and HDI layout planning.
A more realistic starting point would be a phone-like development motherboard around an available SOM/module instead of a raw Snapdragon 8 Elite SoC. If you want, I can help convert this into a feasible project plan once execution is available.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant