Retrieved the current schematic state and confirmed the previously missing passive network was in fact absent, not just differently named
Added the full missing gate-drive and pull-up network: R_G1 through R_G6, R_PD1 through R_PD6, and optional I2C pull-ups R_I2C_SDA and R_I2C_SCL
Verified key pin details needed for the next wiring pass, including duplicate-name handling on OC1, OC2, OC3, and dual-GND pins on U2 and U3
Confirmed from the U4 datasheet that ~Sleep~ should tie to Vin when unused, and that TP/NC pins remain explicit no-connects
Success criteria review
✅ The missing passive network that blocked progress is now added to the schematic
✅ Datasheet-driven tie-off decision for U4 is resolved
❌ The board is not yet fully wired
❌ ERC/schematic completeness review is not yet finished
❌ PCB preparation has not started
Next steps
The immediate next step is to run one full connection pass for power, grounds, I2C, SPI, stepper drivers, MOSFET outputs, the U4 block, and the isolated optocoupler section, then review remaining ERC findings. After schematic completion, the natural next stage is PCB layout: board sizing, stackup, and component placement.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant