48V to 380V Inverter Design
0:44
PCB Layout Recommendations
| Section | Recommendation |
|---|---|
| Board Stackup | Use a 2-layer board. The Top Layer routes your high-current/high-voltage signals and control traces, while the Bottom Layer is dedicated as a continuous ground plane. |
| High-Power Area | - Place your inverter stage (MOSFET arrays, protection components such as TVS diodes, MOVs, and PTCs) in a confined high-power region. - Use wide traces (≥ 2 mm) and maintain clearances of at least 3 mm for the 380V sections. |
| Control Section | - Locate the STM32F407 away from the high-power region. - Route low voltage logic and PWM interconnects separately to reduce EMI interference. |
| Thermal Management | - Add thermal vias directly beneath high-power components to transfer heat from the top layer to the ground plane on the bottom. - Consider using copper pours or heatsink areas for additional heat spreading. |
| Routing Strategy | - Route high-voltage and high-current paths with minimal bends and short distances. - Use full copper pours or wider traces for power lines. - Use the bottom layer as a low impedance return path for the entire board. |
| Clearance & Creepage | - Ensure that all high-voltage traces observe the recommended 3 mm clearance between them and adjacent low-voltage circuitry to comply with IPC-2221 guidelines. |
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