No tasks were completed; execution halted due to insufficient credits.
Pending tasks
Core Component Integration
Select and place a dual-radio MCU (Wi-Fi + BLE 5.x)
Add a digital temperature and humidity sensor with I²C pull-ups
Add a USB-C receptacle and configure CC pull-downs for sink
Power Subsystem and Protection
Route VBUS through an eFuse or protection IC (0.5 A–3 A)
Add a 5 V→3.3 V low-Iq regulator
Place 100 nF decoupling and low-ESR bulk capacitors
Signal Integrity and ESD Protection
Add bidirectional TVS diodes on USB D+ and D– (<1 pF)
Define solid ground scheme and add bulk decoupling
Connectivity and Layout Preparation
Connect I²C, boot, reset, programming pins; add status LED/test points
Plan RF keep-out zones, antenna clearance, via stitching, sensor vent
Final Review and Validation
Run ERC/DRC, verify power/thermal, update BOM, export schematic/PCB
Success criteria status
✗ Schematic is empty; no components placed
✗ No power, ESD, or signal-integrity measures implemented
✗ No PCB layout exists for RF or grounding practices
Recommended next step
Begin with Core Component Integration: select and place the dual-radio MCU supporting 802.11 b/g/n and BLE 5.x so we can build out the rest of the schematic.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant